Fujitsu Corporation

Taiyo Yuden Co., Ltd.

Masayuki Kitajima

Masakazu Takesue

Toru Okada

Yutaka Noda

Yoshitaka Muraoka

Masanao Fujii

Hidehiko Kobayashi

Seiichi Shimoura

Tadaaki Shono

Keiichi Yamamoto

Takashi Kubota

Takatoyo Yamakami

Satoshi Emoto

Kenji Iketaki

Hisao Tanaka

Hiroshi Kobayashi

Shunichi Aikawa

Yasuo Moriya

Keiji Tsuda

Ryoji Matsuyama

Yoshinori Nemoto

Yumiko Fukushima

Takashi Matsuda

Kazunori Inoue

Hidehiko Kira

Yasuo Yamagishi

Hiroki Uchida

Takeshi Ishitsuka

Hitoshi Ebihara

Masayuki Ochiai

Jyouji Kimura

Fumihiko Tokura

Takumi Masuyama

Naoto Kobayashi

Kuniko Ishikawa

Takumi Kooriike

Tetsuji Ishikawa

Toshimasa Numata

Motoko Fujioka

Hitoshi Homma

A filter includes: a piezoelectric substrate; a first acoustic wave resonator located on the piezoelectric substrate and including a pair of first reflectors including first grating electrodes and a pair of first comb-shaped electrodes that is located between the first reflectors and includes first electrode fingers; and a second acoustic wave resonator that is connected in series or parallel with the first acoustic wave resonator, is located on the piezoelectric substrate, and includes a pair of second reflectors including second grating electrodes and a pair of second comb-shaped electrodes that is located between the second reflectors and includes second electrode fingers, an average value of duty ratios of the second grating electrodes being different from an average value of duty ratios of the first grating electrodes, an average value of pitches of the second electrode fingers being substantially equal to an average value of pitches of the first electrode fingers.

Filter and multiplexer

A power-demand-value calculating system includes a storage device and an arithmetic device. The storage device stores data of combinations of temperatures and power result values. The arithmetic device selects data equal to or higher than a predetermined temperature from the storage device and, calculates, when the power result values corresponding to the temperatures of the selected data are smaller than a power calculation value which is calculated from a regression formula derived from the data of the combinations and the temperatures of the selected data, a maximum power demand value based on the temperatures equal to or higher than the predetermined temperature and the regression formula.

Power-demand-value calculating system, power-demand-value calculating method, and recording medium recording power-demand-value calculating program

A method of mounting a semiconductor element, the method includes: attaching a first solder joint material onto a first pad formed on a substrate supplying a second solder joint material onto the first solder joint material, a second melting point of the second solder joint material being lower than a first melting point of the first solder joint material; arranging the semiconductor element so that a second pad formed on the semiconductor element faces the first pad and a joint gap is provided between the semiconductor element and the substrate; and performing reflow at a reflow temperature lower than the first melting point and higher than the second melting point to join the first solder joint material and the second solder joint material.

Method of mounting semiconductor element, and semiconductor device

An optical unit in which an optical part having an optical element is mounted on a base having an optical waveguide includes a hydrophobic first area formed in a region including an optical axis of the optical part, a hydrophobic second area formed in a region facing the first area on a surface of the base, and a hydrophilic filler which fills peripheries of the first area and the second area between the optical part and the base.

Optical unit in which optical element is mounted on base having optical wave guide and method of manufacturing the same

A method of determining a reinforcement position of a circuit board includes: setting a numerical model of a circuit board in which an electronic component is mounted in a front surface by bumps, and a reinforcing member is attached to a position corresponding to a bump located in a corner part of the electrical component in a back surface; incorporating information about a stud that is located in a periphery of the electronic component and fixes the circuit board to a chassis of the electronic device; performing a simulation for obtaining values of stresses generated in bumps of corner parts when a force is applied to the electronic component from a back side of the circuit board; and determining an arrangement of the reinforcing member in accordance with a position of the stud based on the values of stresses obtained by the simulation.

Method of determining reinforcement position of circuit substrate and substrate assembly

Disclosed is a board reinforcing structure for reinforcing a circuit board in which an electronic component is mounted on a first surface, the electronic component having an electrode arranged in a rectangular-shaped region on the first surface. The board reinforcing structure includes a reinforcing member bonded to positions corresponding to corner parts of four corners of the rectangular-shaped region on a second surface provided on a side opposite to the first surface of the circuit board. In the board reinforcing structure, corresponding one of notches is formed in the reinforcing member at a position corresponding to one of the corner parts of the four corners of the rectangular-shaped region, and at least two apexes of the reinforcing member directed to an outside are formed to shape a contour thereof with the one of the notches.

Board reinforcing structure, board assembly, and electronic device

An electro-conductive bonding material includes: metal components of a high-melting-point metal particle that have a first melting point or higher; a middle-melting-point metal particle that has a second melting point which is first temperature or higher, and second temperature or lower, the second temperature is lower than the first melting point and higher than the first temperature; and a low-melting-point metal particle that has a third melting point or lower, the third melting point is lower than the first temperature.

Electroconductive bonding material, method for bonding conductor, and method for manufacturing semiconductor device

A printed wiring board includes a first conductive paste forming a wiring pattern, and a second conductive paste including kneaded first conductive material and second conductive material whose particles are finer than those of the first conductive material.

Circuit board with kneaded conductive paste

A surface acoustic wave device includes a piezoelectric substrate, an interdigital transducer (IDT) formed on the piezoelectric substrate, an interconnection electrode that is provided on the piezoelectric substrate and is connected to the IDT, the IDT being made of a metal identical to that of the IDT, an inorganic insulation layer that is provided on the piezoelectric substrate so that at least the interconnection electrode is exposed, an insulative resin layer that is located on an interface between the inorganic insulation layer and a portion of the interconnection electrode exposed from the inorganic insulation layer and is formed so as to cover a side surface of the interconnection electrode, and a metal layer that is provided on the interconnection electrode and the insulative resin layer.

Surface acoustic wave device and method of fabricating the same

A method of manufacturing an acoustic wave device includes forming a first sealing portion on a substrate having an acoustic wave element thereon so that a functional region, in which an acoustic wave oscillates, of the acoustic wave element acts as a first non-covered portion and a cutting region for individuating acts as a second non-covered portion, forming a second sealing portion on the first sealing portion so as to cover the first non-covered portion and the second non-covered portion, and cutting off the substrate and the second sealing portion so that the second non-covered portion is divided.

Method of manufacturing an acoustic wave device

A conductor is at least partially exposed on the surface of a body. A wiring is formed for connection to the conductor. The conductor is made of a Zn&#x2014;Al alloy. Heat is then applied to the conductor and the wiring. A chemical reaction is accelerated between the conductor and the wiring based on the heat treatment. This allows oxygen to get released out of the conductor and the wiring. Deoxidation is thus realized on the joint surfaces of the conductor and the wiring. Electric resistance is decreased. Electric conduction can thus be established between the conductor and the wiring.

Method of making zinc-aluminum alloy connection

A high melting point solder alloy superior in oxidation resistance, in particular a solder alloy provided with both a high oxidation resistance and high melting point suitable for filling fine through holes of tens of microns in diameter and high aspect ratios and forming through hole filling materials, comprising a zinc-aluminum solder alloy containing 0.001 wt % to 1 wt % of aluminum and the balance of zinc and unavoidable impurities.

Zinc-aluminum solder alloy

In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable, and a movable electrode is placed on the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the second adhesive. Next, a third adhesive is applied to an actuator base, a base electrode is placed on the third adhesive, and the third adhesive is semi-cured in the same manner as above. A fourth adhesive is applied to the base electrode, the piezoelectric element is placed on the fourth adhesive, and the fourth adhesive is semi-cured in the same manner as above. Finally, the adhered laminate thus obtained is placed into a heating furnace and heated at a predetermined temperature for a predetermined period of time to thereby fully cure the adhesives.

Method of producing a micro-actuator

A solder alloy having a solderability comparable to that of a conventional Pb&#x2014;Sn solder alloy without having a detrimental effect on the environment and a soldered bond using the same. A solder alloy consisting of Zn: 4.0-10.0 wt %, In: 1.0 to 15.0 wt %, Al: 0.0020 to 0.0100 wt %, and the balance of Sn and unavoidable impurities. A soldered bond of an electric or electronic device composed of the above solder alloy.

Solder alloy and soldered bond

In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable electrode is placed on the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the second adhesive. Next, a third adhesive is applied to an actuator base, a base electrode is placed on the third adhesive, and the third adhesive is semi-cured in the same manner as above. A fourth adhesive is applied to the base electrode, the piezoelectric element is placed on the fourth adhesive, and the fourth adhesive is semi-cured in the same manner as above. Finally, the adhered laminate thus obtained is placed into a heating furnace and heated at a predetermined temperature for a predetermined period of time to thereby fully cure the adhesives.

Growing community of inventors

Kawasaki, Japan

Masayuki Kitajima