C.uyemura Co., Ltd.

Masayuki Kiso

Tohru Kamitamari

Hiroki Uchida

Teruyuki Hotta

Motonobu Kubo

Daisuke Hashimoto

Yoshikazu Saijo

Tomoji Okuda

Yukinori Oda

Daisuke Matsuyama

Seigo Kurosaka

Keita Taniguchi

Masahiro Saito

Katsuhisa Tanabe

Hiromu Inagawa

Takayuki Nakamura

Hideyuki Takami

Shinji Ishimaru

Ayumi Okubo

Rumiko Susuki

Koichiro Shimizu

Makoto Sato

A surface treatment device includes at least one paddle in a plate shape, in a surface treatment tank, for stirring a surface treatment solution near a substrate by reciprocally moving the paddle with respect to the substrate. The paddle is configured by integrally forming multiple square bars provided in a depth direction or a horizontal direction of the surface treatment solution at regular intervals along the substrate. A liquid draining member for draining a liquid is arranged in at least one side of an end of the paddle.

Turbulence-reducing device for stirring a surface treatment solution

The purpose of the present invention is to provide a surface treatment device and a paddle with improved strength and uniform plating thickness by uniformly stirring surface treatment solution near an object to be plated. Also, the purpose of the present invention is to provide a surface treatment method capable of stirring for a long period of time, by uniformizing plating thickness, and by improving a strength of a paddle. A surface treatment device comprising at least one plateshaped paddle, in a surface treatment tank, for stirring surface treatment solution near an object to be plated by reciprocally moving the paddle with respect to the object to be plated, wherein the paddle is configured by integrally forming a plurality of square bars provided in depth direction of the surface treatment solution in the surface treatment tank along the object to be plated at regular intervals, and a square bar of the plurality of square bars is provided with a curved surface with respect to the object to be plated in a cross section in thickness direction of the square bar.

Surface treatment device comprising a paddle for stirring a surface treatment solution, paddle for stirring a surface treatment solution and method thereof

Disclosed is an electroless nickel plating bath not containing harmful metal species. In the electroless nickel plating bath, there are contained at least an iron ion source and an iodide ion source. With the use of the electroless nickel plating bath containing at least the iron ion source and the iodide ion source, it is possible to suppress decomposition of the plating bath without using harmful metal species to stabilize the plating bath.

Electroless nickel plating bath and method for electroless nickel plating

Part or whole of an electroless gold plating film of a plated film laminate including an electroless nickel plating film, an electroless palladium plating film and an electroless gold plating film is formed by an electroless gold plating using an electroless gold plating bath including a water-soluble gold compound, a complexing agent, formaldehyde and/or a formaldehyde-bisulfite adduct, and an amine compound represented by the following general formula R&#x2014;NH&#x2014;CH&#x2014;NH&#x2014;Ror R&#x2014;(CH&#x2014;NH&#x2014;CH&#x2014;NH&#x2014;CH)&#x2014;R. The method of the invention does not need two types of baths, a flash gold plating bath and a thick gold plating bath for thickening. Gold plating films of different thicknesses suited for solder bonding or wire bonding can be formed using only one type of gold plating bath.

Electroless gold plating method and electronic parts

An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, an aldehyde compound, and an amine compound represented by R&#x2014;NH&#x2014;CH&#x2014;NH&#x2014;Ror (CH&#x2014;NH&#x2014;CH&#x2014;NH&#x2014;CH)&#x2014;R(wherein Rto Rrepresent &#x2014;OH, &#x2014;CH, &#x2014;CHOH, &#x2014;CHOH, &#x2014;CHN(CH), &#x2014;CHNH(CHOH), &#x2014;CHNH(CHOH), &#x2014;CHNH(CHOH), &#x2014;CHNH(CHOH), &#x2014;CHN(CHOH), &#x2014;CHN(CHOH), &#x2014;CHN(CHOH)or &#x2014;CHN(CHOH), and n is an integer of 1 to 4). The electroless gold plating can be carried out without corrosion of an underlying metal to be plated at a stable deposition rate. Because of the high deposition rate and the immersion and reduction types, thickening of a plated coating is possible in one solution and the color of the coating is not degraded to provide a good appearance while keeping a lemon yellow color inherent to gold.

Electroless gold plating bath, electroless gold plating method and electronic parts

An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, a formaldehyde metabisulfite adduct, and an amine compound represented by R&#x2014;NH&#x2014;CH&#x2014;NH&#x2014;Ror (CH&#x2014;NH&#x2014;CH&#x2014;NH&#x2014;CH)(wherein Rto Rrepresent &#x2014;OH, &#x2014;CH, &#x2014;CHOH, &#x2014;CHOH, &#x2014;CHN(CH), &#x2014;CHNH(CHOH), &#x2014;CHNH(CHOH), &#x2014;CHNH(CHOH), &#x2014;CHNH(CHOH), &#x2014;CHN(CHOH), &#x2014;CHN(CHOH), &#x2014;CHN(CHOH)or &#x2014;CHN(CHOH), and n is an integer of 1 to 4). A gold plated coating of a good appearance can be formed without causing a failure in appearance owing to the progress of intergranular corrosion in a nickel surface.

To an electroless nickel plating solution comprising a water-soluble nickel salt, a reducing agent, and a complexing agent is added a polythionate or dithionite. The invention also provides a high-build electroless gold plating method comprising the steps of immersing a workpiece in the electroless nickel plating bath, thereby chemically depositing a nickel coating on the workpiece, and immersing the nickel-plated workpiece in an electroless gold plating bath, thereby chemically depositing a gold coating on the workpiece.

Electroless nickel plating solution and method

In electroless or electric tin, lead or tin-lead alloy plating solution which may contain copper, the concentration of a metal ion component selected from divalent tin ion, lead ion, and copper ion is quantitatively determined by taking a sample from the solution, adding a chemical agent, for example, an oxidizing agent to the sample, thereby causing the selected metal ion to develop its color, measuring the absorbance of the sample due to the metal ion by colorimetry, and determining the concentration from the absorbance. A choice of chemical agent depends on a particular metal ion on analysis. When the solution contains more than one metal ion, correction is made by repeating the process using another chemical agent.

Analysis of tin, lead or tin-lead alloy plating solution

A tin or tin-lead alloy electroless plating bath comprising (A) a stannous salt or a mixture of a stannous salt and a lead salt, (B) an acid, (C) thiourea or a thiourea derivative, and (D) a reducing agent is improved by adding (E) a nonionic surfactant and optionally, (F) a cationic surfactant, a nitrogenous heterocyclic compound or a derivative thereof, or alternatively by adding (G) an ammonium or quaternary ammonium ion. From the bath, uniform films of fine grains will chemically deposit on fine pitch printed wiring boards intended for SMT.

Bath and method for the electroless plating of tin and tin-lead alloy

The invention provides a process for electroless plating tin, lead or tin-lead alloy on copper or copper alloy using an electroless plating bath containing a water soluble tin and/or lead salt, an acid capable of dissolving the salts, and a complexing agent. The tin and/or lead content in the bath is maintained high enough to chemically deposit thick films by replenishing the tin and/or lead salt in proportion to an increase in concentration of copper ion dissolving out in the bath. Also provided is an electroless tin, lead or tin-lead alloy plating process in which a water soluble copper salt is added to a fresh bath.

Process for electroless plating tin, lead or tin-lead alloy

For replenishing a metal ion to a plating bath, a soluble electrode of the same type of metal as in the bath and a counter electrode of a metal material having a nobler standard electrode potential than the soluble electrode are immersed in the bath. Electricity is conducted between the soluble electrode and the counter electrode, thereby dissolving the soluble electrode to replenish an ion of the metal of the soluble electrode to the bath. The potential of the counter electrode is measured using a reference electrode of the same metal as the soluble electrode. The quantity of electricity is controlled such that the measured potential may not be negative with respect to the reference electrode, thereby preventing deposition of the dissolving metal ion on the counter electrode while ensuring a high rate of metal ion dissolution.

Metal ion replenishment to plating bath

A gold plating bath having potassium aurous cyanide and thiourea complexing agent dissolved in water and adjusted to an acidity of pH 3 or lower can be used as either electroplating or electroless plating bath. Bright gold electroplating is possible when a brightener is added to the bath. Electroless plating is possible when a reducing agent, typically sodium hypophosphite is added to the bath.

Gold plating bath and method

An amine, such as a triethanol amine or ethylenediamine is added to an alkaline electroless gold plating solution comprising a gold salt and a boron-based reducing agent to deposit a gold film having good appearance and high throwing power on a workpiece at a high deposition rate.

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Hirakata, Japan

Masayuki Kiso