Tokyo Electron Limited

Masayuki Kajiwara

Katsunori Ichino

Nobuaki Matsuoka

Masato Hayashi

Tsunenaga Nakashima

Toyohisa Tsuruda

Daisuke Ishimaru

Kenji Adachi

Hideo Funakoshi

Tomohiko Muta

Takeaki Sakamoto

Tetsuro Iriyama

Masato Imamura

Atsushi Yamamoto

Takuya Tajiri

Hiroki Okaguchi

A substrate processing apparatus includes a discharge part including a nozzle configured to discharge a processing liquid onto a substrate; a liquid feeder configured to feed the processing liquid to the discharge part; a replenishment part configured to replenish the liquid feeder with the processing liquid to be fed to the discharge part; a connector including a switching valve configured to open/close a flow path between the replenishment part and the liquid feeder; a filter configured to remove foreign matters contained in the processing liquid; a replenishment preparation part configured to open the switching valve after reducing a pressure difference between the inside of the replenishment part and the liquid feeder; and a replenishment controller configured to start replenishment of the processing liquid from the replenishment part to the liquid feeder in a state in which the switching valve is opened by the replenishment preparation part.

Substrate processing apparatus, control method, and computer-readable storage medium

A treatment solution supply apparatus to supply a treatment solution to a treatment solution discharge unit via a supply path that is provided with a filter configured to remove foreign substances in the treatment solution and a tubephragm pump to send the treatment solution, the supply path has an opening/closing valve on an upstream side of the tubephragm pump and the filter, and a suck-back valve on a downstream side of the tubephragm pump and the filter, and includes a control unit to control at least the tubephragm pump, the opening/closing valve, and the suck-back valve, wherein the control unit performs: a control of stopping sending of the treatment solution from the tubephragm pump; and a control of suspending discharge of the treatment solution from the treatment solution discharge unit by operation of the suck-back valve, and then closing the opening/closing valve to stop the discharge.

Treatment solution supply apparatus and substrate treatment system

A treatment solution supply method of supplying a treatment solution to a substrate, the method includes the steps of: applying a DC voltage to the treatment solution; detecting a potential difference between two points in the treatment solution in a state where the DC voltage is applied to the treatment solution; and increasing the DC voltage when the detected potential difference is less than a predetermined reference value.

Treatment solution supply method, treatment solution supply apparatus, and non-transitory computer-readable recording medium

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Koshi, Japan

Masayuki Kajiwara