Mitsubishi Electric Corporation

Riken Corporation

Ricoh Company, Ltd.

Fuji Die Co., Ltd.

Masayuki Ishii

Hidetoshi Kami

Ryota Inoue

Naoto Takano

Hitoshi Ohmori

Noriaki Senba

Tomoharu Asano

Nobuhide Itoh

Toshio Kasai

Osamu Terada

Toshiro Karaki-Doy

Kentarou Yamada

Yuudai Hirai

Rei Kitano

Masahiro Ura

Kenichiro Horio

Toshiaki Uno

Kazuhiko Tsuchiya

Saki Suzuki

Kozo Kitamura

Koji Hayashi

Flowmeter

In a data diode device that includes a transmitting device, a one-way transmission path and a receiving device, in order to reduce packet loss that occurs when a receiving side is put in an overload state, the transmitting device includes a network load prediction function unit that predicts a network load of a receiving side network from the amount of communication of data sent from a transmitting side network, and a data control unit that discards IP packets of data sent from the transmitting side network when the network load predicted by the network load prediction function unit is determined to be higher than a predetermined value, so as to limit the amount of communication from the transmitting device.

Data diode device

The method disclosed here comprises the steps of (a) mixing metal powder, a resin, abrasive grains, and a solid reducing agent at the normal (room) temperature through the melting point of the reducing agent to form a mixture and (b) molding and baking the mixture at the melting point of the reducing agent through that of the metal powder. The solid reducing agent is a fatty acid, preferably stearic acid having a volume ratio of 5 to 20% with respect to the metal powder. With is, it is possible to make metal-resin bond grindstones that give such high-quality mirror surfaces that have conductivity fit for ELID grinding and are not liable to have chippings or scratches and also have an Rmax value of approximately 3 nm or less.

Metal-resis bond grindstone and method for manufacturing the same

Growing community of inventors

Tokyo, Japan

Masayuki Ishii