Matsushita Electric Works, Ltd.

American Standard International Inc.

Masayuki Ishihara

Susumu Kajita

Izuru Yoshizawa

Kazuhiro Matsuura

Satoru Ogawa

Kiyotaka Waki

Noboru Yamaguchi

Shigeru Ishiki

Kanjanatanom Othong

Keizo Makio

A glaze composition can be used to provide a glaze layer having excellent antifouling performance and visual beauty. The glaze composition contains a glaze forming material, which has a composition determined such that a baked product obtained by baking the glaze composition comprises 55.0 to 67.0 wt % of SiO; 8.0 to 11.0 wt % of AlO; 2.0 to 8.0 wt % of SnO; 15.0 to 21.0 wt % of a divalent metal oxide; and 4.0 to 6.0 wt % of a monovalent metal oxide, with respect to a total weight of the baked product. When a glaze layer is formed by use of this glaze composition, it resists contamination. Even when a dirt deposits on the glaze layer, the dirt can be easily removed from the glaze layer. In addition, the glaze composition can provide a beautiful semi-opaque glaze layer with luster and a reduction in pore generation amount.

Glaze composition and antifouling ceramic ware

A method for roughening a ceramic substrate surface includes a step of sequentially taking out part of roughening a treatment bath of phosphoric acid into which the ceramic substrate is dipped prior to a formation on the substrate of conductor a layer, and subjecting the part of the bath taken out sequentially to regeneration treatment. Any increase in the viscosity due to dehydrating condensation of the roughening bath can be thereby effectively restrained to prolong effective life of the bath. Further, the surface roughened ceramic substrate can be provided thereon with conductor layers smoothly formed by means of a plating and eventually with a circuit pattern as well as a resistor formed on the pattern within an inert gas atmosphere.

Method for roughening ceramic substrate surface and method for

A sintered glass-powder product of a glass ceramic body, consisting essentially of: SiO.sub.2, Al.sub.2 O.sub.3, MgO, and B.sub.2 O.sub.3, and sintered at a temperature below 900.degree. C. The product includes a microstructure of alpha-cordierite and magnesium aluminum silicate (MgO.Al.sub.2 O.sub.3.4SiO.sub.2) homogeneously dispersed in the glass ceramic body. When the sintered glass-powder product is used in the form of a green sheet for fabricating, in particular, a multilayer wiring substrate or the like, the required sintering temperature for fabricating the substrate can be remarkably reduced so as to be well-matched in thermal characteristics with such wiring conductors as gold, silver, copper, or the like, and even with a relatively large semiconductor chip because the thermal expansion coefficient of the sintered product is close to that of silicon semiconductor.

Sintered glass-powder product

Growing community of inventors

Neyagawa, Japan

Masayuki Ishihara