Shin-etsu Chemical Co., Ltd.

Shin-estu Chemical Co., Ltd.

National Institute of Advanced Industrial Science and Technology

Gc Corporation

Masayuki Ikeno

Hironao Fujiki

Hidenori Mizushima

Hiroyasu Hara

Takafumi Sakamoto

Hiroshi Inomata

Takashi Tanaka

Takeshi Miyao

Tsutomu Nakamura

Hideki Sugahara

Miyuki Tanaka

Kazuyasu Sato

Syuichi Azechi

Yuka Mayumi

Tsuneo Kimura

Toshiyuki Ozai

Nobuaki Matsumoto

Takehide Okami

Shinichi Sato

Hiroyuki Yasuda

Noriyuki Meguriya

Shigeru Ubukata

Daichi Todoroki

Atsushi Yaginuma

Masanobu Miyakoshi

Masaya Arakawa

Hiroshi Kamohara

Mikio Shiono

Shinji Irifune

Yoshifumi Inoue

Eiichi Tabei

Shigeki Shudo

Minoru Igarashi

Masachika Yoshino

Kouichi Tanaka

Shunichi Futami

Tadashi Araki

Osamu Hayashida

Taichi Kitagawa

Mitsuhiro Iwata

Takahiro Yamaguchi

Naoki Yamakawa

Norihisa Fukaya

Taiki Katayama

Akira Uta

Kohei Masuda

Yujiro Taira

Yoshifumi Harada

Isao Iwasaki

Masayuki Yoshida

Akihito Tsukuno

Satoshi Onai

Jun-chul Choi

Shinichi Ide

Takeharu Toyoshima

Shinji Kimura

Morio Ohashi

Misaki Takai

Kaoru Michimata

Masanari Moteki

Kazuyasu Satoh

Taich Kitagawa

Provided is an oxygen-curable silicone composition that cures at room temperature, the reaction being triggered by oxygen in the atmosphere, without requiring heat or UV irradiation at the time of use, and exhibits good mechanical strength after curing. A composition including (Rrepresents an alkyl group or the like but has at least one acryloyloxy group or the like in the molecule, Rrepresents an oxygen atom or the like, and m and n represent numbers that satisfy 1≤m+n≤1,000.), (Rand Rare the same as above. Rrepresents an acryloyloxyalkyl group or the like, p represents 0-10, and 1 represents a number that satisfies 1-3.), and (R-Rrepresent hydrocarbon groups.).

Oxygen-curable silicone composition and cured product thereof

Provided is a novel polyoxyalkylene compound which contains, at a molecular chain terminal, at least one reactive silicon-containing group represented by formula (1) per molecule and which has a main chain that is a polyoxyalkylene polymer. Also provided are: a process for producing the novel polyoxyalkylene compound; a room-temperature-curable composition which includes the compound as a main component and can contain any of various crosslinking agents; a sealing material; and an article. (In formula (1), Rand Rare each a monovalent hydrocarbon group, a hydrogen atom, or a triorganosiloxy group; n is 2 or larger; m is 1 or larger; and the broken line is a linking bond).

Silanol-group-terminated polyoxyalkylene compound and production process therefor, room-temperature-curable composition, sealing material, and article

A resin composition includes: (a) a supported platinum catalyst having a structure shown by the following general formula (1) in which a platinum complex is supported on a surface of an inorganic oxide; and (b) a thermoplastic matrix resin. The resin composition is usable as an addition-reaction catalyst capable of imparting sufficient storability and quick curability to an addition-reaction curable composition. In the formula, L represents a ligand selected from carbon monoxide, an olefin compound, an amine compound, a phosphine compound, an N-heterocyclic carbene compound, a nitrile compound, and an isocyanide compound; and n represents the number of Ls and an integer from 0 to 2.

Resin composition containing supported platinum catalyst, thermosetting organopolysiloxane composition using the resin composition, and method for curing the thermosetting organopolysiloxane composition

Provided is a heat dissipation material comprising a mesogen/silicon compound (co)polymer having a number average molecular weight of 1,000-500,000, represented by general formula (1). (Ar is a mesogen group selected from the structure represented by the following formulas. a represents a positive number from 0.5 to 1, b represents a number from 0 to 0.5 (with the caveat that a and b each represent the ratio of each number of repeating units in molecules, and a+b=1). Ris independently a monovalent hydrocarbon group which does not independently include a Caliphatic unsaturated bond. Ris independently a hydrogen atom, &#x2014;Si(CH), &#x2014;Si(CH)(OH), &#x2014;Si(CH)(CH&#x2550;CH) or &#x2014;Si(CH)(CH&#x2014;CH&#x2550;CH)). This heat dissipation material has excellent thermal conductivity, and further shows good thermoplastic properties and has excellent moldability, and hence can be suitably used as a resin material for heat dissipation materials and semiconductor devices and electronic parts in particular.

Heat dissipation material

Provided is a compound for imparting a thermal plasticity to an organic silicon resin. The compound is a novel vinyl silane compound represented by the following formula (1): wherein A independently represents a divalent hydrocarbon group having 1 to 6 carbon atoms; Y independently represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms.

Vinyl silane compound

The present invention pertains to an ultraviolet-ray-curable organopolysiloxane composition containing: (A) (A-1) a straight-chain organopolysiloxane containing an alkenyl group, and (A-2) a three-dimensional-network-shaped organopolysiloxane resin containing an RRSiOunit, an RSiOunit, an SiOunit, and an alkenyl group; (B) an organohydrogenpolysiloxane; (C) a photoactive platinum complex curing catalyst; and (D) an organopolysiloxane oligomer containing an RRSiOunit or the RRSiOunit and an RRSiOunit, also containing an RSiOunit, not containing an SiOunit, and also containing an alkenyl group. As a result, this ultraviolet-ray-curable organopolysiloxane composition retains high strength and does extremely well suppressing heat-induced expansion or contraction; hence, it is possible to transfer a pattern and print with high dimensional accuracy.

Ultraviolet-ray-curable organopolysiloxane composition, and method for producing printing material

A silicone gel composition including: an organopolysiloxane shown by the following general formula: RRSiO, having one or more alkenyl groups bound to a silicon atom in one molecule, wherein the amount is 100 parts by mass; an organohydrogenpolysiloxane shown by the following general formula: RHSiO, having two or more hydrogen atoms bound to a silicon atom in one molecule, wherein the amount is such that 0.6 to 3 hydrogen atoms bound to a silicon atom is contained relative to one alkenyl group bound to a silicon atom in the component; a platinum-based catalyst, wherein the amount is an effective amount; and a carbon nanotube, wherein the amount is 0.01 to 3 parts by mass. This provides a silicone gel composition which can be a silicone gel cured product with low elastic modulus, low stress, and excellent heat resistance at 230&#xb0; C., when it is cured.

Silicone gel composition and silicone gel cured product

A UV-curable adhesive organopolysiloxane composition is provided comprising (A) (A-1) an alkenyl-containing linear organopolysiloxane and (A-2) a three-dimensionai network alkenyl-containing organopolysiloxane resin comprising RRSiO, RSiOand SiOunits, wherein Ris a monovalent hydrocarbon group exclusive of alkenyl and Ris alkenyl, (B) (B-1) an alkoxy-free organohydrogenpolysiloxane and (B-2) an organohydrogenpolysiloxane containing at least one trialkoxysilyl group bonded to silicon via alkylene, (C) a photoactive platinum complex catalyst, and (D) a branched organopolysiloxane oligomer comprising RRSiOand/or RSiOunits and RSiOunits, but not SiOunits.

UV-curable adhesive organopolysiloxane composition

The invention provides a primer composition which adheres a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device includes (A) an acrylic resin containing either one or both of an acrylate ester and a methacrylate ester that contains one or more SiCH&#x2550;CHgroups in the molecule, and (B) solvent. There can be provided a primer composition in which the adhesion between a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device can be improved, the corrosion of a metal electrode formed on the substrate can be prevented, and the heat resistance of a primer itself can be improved.

Primer composition and optical semiconductor apparatus using same

A UV curable silicone rubber composition is provided. The composition does not undergo curing failure, foaming, and other undesirable conditions even if a water-containing inorganic filler such as zeolite were added. A UV curable silicone rubber composition comprising (A) 100 parts by weight of an organopolysiloxane having at least 2 alkenyl groups per molecule represented by the average compositional formula (I): RSiO(I) (wherein Ris independently a substituted or unsubstituted monovalent hydrocarbon group, and a is a positive number of 1.95 to 2.05); (B) 1 to 300 parts by weight of an inorganic filler having a water content of at least 0.5% by weight; (C) 0.1 to 50 parts by weight of an organohydrogenpolysiloxane having at least 2 silicon-bonded hydrogen atoms per molecule; and (D) a catalytic amount of a photoactive platinum complex curing catalyst.

Silicone rubber composition, silicone rubber molded article, and production method thereof

A curable resin composition to which at least phosphor particles and nanoparticles having a primary particle size of 1 nm or more and less than 100 nm are added, wherein the nanoparticles are dispersed in the form of secondarily aggregated particles having an average particle size of 100 nm or more and 20 &#x3bc;m or less in terms of volume Q3 is provided for an optical semiconductor apparatus in which when a sealant obtained by dispersing phosphor particles in a curable resin composition having a low viscosity is filled into a package substrate, the dispersion state of the phosphor particles is not changed at the early and late stages of the fabrication, specifically the amounts of the phosphor particles to be contained at the early and late stages are the same, and the color rendering property can be stably maintained, a hardened material thereof, and an optical semiconductor apparatus.

Curable resin composition, hardened material thereof, and optical semiconductor apparatus

Disclosed is a photocurable organopolysiloxane composition including (A) 100 parts by weight of diorganopolysiloxane having at least two silicon atoms having a hydroxyl group and/or hydrolyzable group attached thereto in one molecule; and (B) 0.1 to 30 parts by weight of a complex compound composed of titanium(meth)acrylate-trialkoxide and &#x3b2;-diketone. It will find use as a sealing agent, adhesive, coating material. It is particularly suitable for micro pars and precision molding on account of its good curability and very little cure shrinkage.

Photocurable organopolysiloxane composition

A method for curing an addition curable organopolysiloxane composition is provided. This method uses a UV activatable platinum catalyst (complex), and this method has enabled consistent curing of the parts where UV exposure is impossible as well as consistent curing of a thick article. This method cures an addition curable organopolysiloxane composition comprising (A) an organopolysiloxane having at least 2 alkenyl groups bonded to silicon atoms per molecule, (B) an organohydrogenpolysiloxane having at least 2 hydrogen atoms bonded to silicon atoms per molecule, and (C) an effective amount of a photoactivatable platinum complex curing catalyst, and the method comprises the first step of exposing the composition to UV to increase catalytic activity of the component (C), and the second step of applying the composition obtained in the first step to a desired position and curing the composition.

Method for curing addition curable organopolysiloxane composition

A liquid silicone rubber coating composition exhibiting high adhesion for an airbag base fabric; a curtain airbag having a silicone rubber coating layer of the cured composition formed on at least one surface of the base fabric; and a method for producing such curtain airbag are provided. The composition comprises (A) an organopolysiloxane having at least 2 alkenyl groups bonded to the silicon atoms per molecule; (B) an organohydrogenpolysiloxane having at least 2 structural units represented by formula (1) per molecule, the structural units being linked by a non-siloxane structural unit not containing SiH group; (C) an addition catalyst; (E) an organosilicon compound having an epoxy group and an alkoxy group bonded to the silicon atom in the molecule; and (F) a titanium compound and/or a zirconium compound; and preferably (D) a fine powder silica having a specific surface area of at least 50 m/g. 

Liquid silicone rubber coating composition, curtain airbag, and its production method

Provided is a liquid silicone rubber coating composition with a viscosity at 25&#xb0; C. of 10,000 to 100,000 mPa&#xb7;s, comprising:

Liquid silicone rubber coating composition and air bag

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Maebashi, Japan

Masayuki Ikeno