Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Masayuki Ida

Shinjiro Tsuji

Tomotaka Nishimoto

Ryouichirou Katano

Takahiko Murata

Shinji Kanayama

Akira Yamada

Kenichi Nishino

Kozo Odawara

Yasuhiro Okada

Yuichi Takakura

Provided is an apparatus capable of easily splicing ACF tapes that are thin and are hard to handle. The tape splicing apparatus splices two ACF tapes () each having an ACF (), and includes: a first holding unit that holds one of the ACF tapes (); a second holding unit that holds the other one of the ACF tapes (); a positioning unit () that positions the ACF tapes () to be overlapped in a thickness direction; and a pressing unit () that presses the overlapped ACF tapes () in the thickness direction.

Tape splicing apparatus and attaching apparatus

An adhesive tape applying apparatus includes a stage on which a terminal end portion of a first tape member and a leading end portion of a second tape member are placed so as to be superimposed on each other, an ultrasonic tool in which a plurality of protruding portions are provided on its contact surface that is to be put into contact with the leading end portion or terminal end portion of the superposed tape members, an ultrasonic vibration generator for applying ultrasonic vibrations in a tape's thicknesswise direction to the ultrasonic tool, and a pressing device for making a stage-directed pressing force act on the ultrasonic tool. As a result, the terminal end portion of the in-use first tape member and the leading end portion of the second tape member rolled out from a new reel can be spliced together with a simple, low-cost construction while the possibility of occurrence of trouble in tape feed is eliminated.

Adhesive tape applying apparatus and tape splicing method

Component mounting equipment mounts an FPC board onto an LCD board. The LCD board has a first electrode section on one side edge and a second electrode section on another side edge. The FPC board has a first section on one side edge and a second section on another side edge. A first mounting apparatus mounts the first section on the first electrode section. A second mounting apparatus mounts the second section on the second electrode section. In the second component mounting apparatus, the second section is separated from the second electrode section at an ACF supply section and released at a pre-press bonding section.

Electronic component, component mounting equipment, and component mounting method

Transfer of liquid crystal panels to subsequent processes is performed with the panels placed on transfer arms and held by suction pads. A small suction force can be sufficient, and a suction irregularity is prevented. The transfer arms are arranged at a lower side of the liquid crystal panels, thus not obstructing the liquid crystal panels. In arranging the liquid crystal panels at an image pickup device, a panel holding device is controlled to be driven so as to position panel marks to a bonding height position while negating a deflection amount of the liquid crystal panels, and furthermore a component holding device is controlled to be driven so as to position component marks to the bonding height position and to mount electronic components to the liquid crystal panels at the bonding height position.

Component mounting apparatus and component mounting method, and recognition apparatus for a component mount panel, component mounting apparatus for a liquid crystal panel, and component mounting method for a liquid crystal panel

Growing community of inventors

Osaka, Japan

Masayuki Ida