Nitto-denko Corporation

Masayuki Hodono

Masami Inoue

Yuichi Tsujita

Akiko Nagafuji

Kunio Nagasaki

Mitsuru Honjo

Miho Yamaguchi

Shinji Inokuchi

Takami Hikita

Ryusuke Naito

Yusuke Shimizu

Kei Nakamura

Emiko Tani

Tomohiro Taruno

Shunsuke Shuto

Hajime Nishio

Hidenori Onishi

Tomoaki Hishiki

Akihito Matsutomi

Naoki Nagaoka

Mayu Takase

Takahiko Ito

Yoshinori Kouno

Masayoshi Nakamura

A porous liquid crystal polymer sheet and a wiring circuit board have excellent handleability and excellent low repulsive properties. The porous liquid crystal polymer sheethas a porosity P of 20% or more and 90% or less. The porous liquid crystal polymer sheethas a thickness T of 1 &#x3bc;m or more and 240 &#x3bc;m or less.

Porous liquid crystal polymer sheet and wiring circuit board

First and second conductor layers are formed on a main surface of a base layer. A tapered slot is formed between the first and second conductive layers. A first slit is formed at the first conductor layer, and a second slit is formed at the second conductor layer. Thus, the first conductor layer is divided into a first device connection portion and a first antenna portion, and the second conductor layer is divided into a second device connection portion and a second antenna portion. A semiconductor device is connected to the first and second device connection portions.

Antenna module and method for manufacturing the same

Provided are an opto-electric hybrid board which eliminates the necessity of an aligning operation of a core of an optical waveguide unit and an optical element of an electric circuit unit and which is excellent in mass-productivity, and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit. The optical waveguide unit includes fitting holes which are formed in a surface of an overcladding layer and are located and formed at predetermined locations with respect to one end surface of a core. The electric circuit unit includes protruding portions which fit into the fitting holes and are located and formed at predetermined locations with respect to the optical element.

Opto-electric hybrid board and manufacturing method therefor

Provided are an opto-electric hybrid board and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit using coupling pins. The optical waveguide unit includes fitting holes for fitting the coupling pins thereinto, which are formed in a surface of an overcladding layer, located and formed at predetermined locations with respect to one end surface of a core. The electric circuit unit includes fitting through holes for fitting the coupling pins therethrough, located and formed at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled to each other in a state in which the coupling pins fit through the fitting through holes and fit into the fitting holes.

Provided are an opto-electric hybrid board and a manufacturing method therefor. An optical waveguide unit includes protruding portions which are extendingly provided at portions of at least one of an undercladding layer and an overcladding layer, and the protruding portions are located and formed at predetermined locations with respect to a light transmitting surface of a core. An electric circuit unit includes a bent portion having fitting holes into which the protruding portions fit and having an optical element. The fitting holes are located and formed at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled to each other in a state in which the protruding portions fit into the fitting holes to form an opto-electric hybrid board.

Provided are an opto-electric hybrid board and a manufacturing method. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon. The optical waveguide unit includes socket portions for locating the electric circuit unit, which are formed on a surface of an undercladding layer and formed of the same material as a core. The socket portions are located at predetermined locations with respect to one end surface of a core. The electric circuit unit includes bent portions which are formed by bending a part of an electric circuit board so as to stand, for fitting into the socket portions. The bent portions are located at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled in a state in which the bent portions fit into the socket portions.

Provided are an opto-electric hybrid board which eliminates the necessity of an aligning operation of a core of an optical waveguide unit and an optical element of an electric circuit unit and which is excellent in mass-productivity, and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit. The optical waveguide unit includes protruding portions which are extendingly provided at portions of at least one of the undercladding layer and the overcladding layer, and are located and formed at predetermined locations with respect to a light transmitting surface of a core. The electric circuit unit includes fitting holes into which the protruding portions fit, and are located and formed at predetermined locations with respect to the optical element.

Provided are an opto-electric hybrid board and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit. The optical waveguide unit includes notch portions for locating the electric circuit unit, which is formed in portions of at least one of an undercladding layer and an overcladding layer, and the notch portions are located and formed at predetermined locations with respect to one end surface of a core. The electric circuit unit includes bent portions, which fit into the notch portions, and the bent portions are located and formed at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled to each other under a state in which the bent portions fit into the notch portions.

A method of manufacturing an optical sensor module which eliminates the need for the operation of alignment between a core in an optical waveguide section and an optical element in a substrate section, and an optical sensor module obtained thereby. An optical waveguide section Wincluding groove portions (fitting portions)for the positioning of a substrate section, and a substrate section Eincluding fitting plate portions (to-be-fitted portions)for fitting engagement with the groove portionsare individually produced. The fitting plate portionsin the substrate section Eare brought into fitting engagement with the groove portionsin the optical waveguide section Wwhereby the substrate section Eand the optical waveguide section Ware integrated together.

Manufacturing method of optical sensor module and optical sensor module obtained thereby

An optical waveguide unit having board unit engaging vertical grooves and a board unit having engagement plate portions to be fitted in the vertical grooves and projections are individually produced, and the engagement plate portions and the projections are brought into fitting engagement with the vertical grooves of the optical waveguide unit. At this time, the projections are deformed to accommodate the tolerances of the components, thereby preventing wobbling and warpage of the board unit. Further, the vertical grooves of the optical waveguide unit are provided in proper positions with respect to a light transmission face of a core, and the engagement plate portions of the board unit are provided in proper positions with respect to the optical element. Therefore, the fitting engagement between the vertical grooves and the engagement plate portions permits proper positioning of the light transmission face of the core and the optical element for self-alignment.

Optical sensor module

An optical sensor module is provided in which an engagement portion of a board unit is fitted in a groove of an optical waveguide unit and, even with the single engagement portion, the board unit is stably supported. An optical sensor module includes an optical waveguide unit, and a board unit mounted with an optical element and coupled to the optical waveguide unit. The optical waveguide unit includes a single edge extension portion axially extending along one side edge of an over-cladding layer, a board unit engagement groove provided in the single edge extension portion, and a projection provided on a side wall of the vertical groove and kept in abutment against an engagement portion of the board unit. The board unit includes an engagement portion fitted in the vertical groove, which abuts against the projection within the vertical groove.

An optical sensor module is provided which reduces variations in optical coupling loss between a core in an optical waveguide unit and an optical element in a substrate unit and which reduces the optical coupling loss. The optical waveguide unit including vertical groove portions for fitting engagement with the substrate unit and the substrate unit including fitting plate portions for fitting engagement with the vertical groove portions are produced individually. The fitting plate portions in the substrate unit are brought into fitting engagement with the vertical groove portions in the optical waveguide unit, so that the substrate unit and the optical waveguide unit are integrated together. The vertical groove portions in the optical waveguide unit are in an appropriate position relative to a light-transmissive surface of the core. The fitting plate portions in the substrate unit are in an appropriate position relative to the optical element.

An opto-electric hybrid module capable of shortening the distance between a light-emitting section or a light-receiving section of a semiconductor chip and a reflecting surface formed in a core to reduce optical losses between an opto-electric conversion substrate section and an optical waveguide section, and a method of manufacturing the same. A recessed portion () is formed in a surface of an over cladding layer () of the optical waveguide section (W). At least part of the light-emitting section () or the light-receiving section of the semiconductor chip () for opto-electric conversion and at least part of a loop portion () of a bonding wire () in the opto-electric conversion substrate section (E) are positioned within the recessed portion (). This brings the light-emitting section () or the light-receiving section of the semiconductor chip () and the reflecting surface () formed in the core () closer to each other.

Opto-electric hybrid module and method of manufacturing the same

An opto-electric hybrid module manufacturing method which suppresses a cost loss, and to provide an opto-electric hybrid module manufactured by the method. An opto-electric hybrid module is produced by separately preparing a first board for a middle portion having an optical waveguide extending from one end to the other end of the board, a second board for a light emitting end portion having a light emitting element and an optical waveguide connectable to one end of the optical waveguide of the middle portion and a third board for a light receiving end portion having a light receiving element and an optical waveguide connectable to the other end of the optical waveguide of the middle portion, checking the second and third boards for light transmission, and connecting second and third boards judged to be acceptable to the first board.

Manufacturing method of opto-electric hybrid module and opto-electric hybrid module manufactured thereby

An opto-electric hybrid module capable of achieving the reduction in distance between an optical element and a core end portion to improve the efficiency of light coupling therebetween, and a method of manufacturing the same are provided. The opto-electric hybrid module includes an optical waveguide section, an electric circuit section, and a light-emitting element () and a light-receiving element () both mounted on the electric circuit section. The optical waveguide section includes an under cladding layer (), a linear core () for an optical path, the core being formed on a surface of the under cladding layer (), and an over cladding layer () formed on the surface of the under cladding layer () and covering the core (). An electric circuit () is formed on a surface portion of the under cladding layer () except where the core () is formed.

Growing community of inventors

Ibaraki, Japan

Masayuki Hodono