Ibiden Company Limited

Ibeden Company, Ltd.

Masayuki Hayashi

Motoo Asai

Dongdong Wang

Kenichi Shimada

Honchin En

Yukihiko Toyoda

Tohru Nakai

Koji Sekine

Shinichiro Ichikawa

Kazushige Ohno

Kazutake Ogyu

Hiroki Sato

Masafumi Kunieda

Akihiro Ohira

Wang Dongdong

A method of manufacturing a multilayer printed circuit board includes preparing a substrate having a first conductor circuit, forming on first circuit formed over substrate a film including cycloolefin resin such that an insulating layer including the resin is formed on substrate and first circuit, forming in insulating layer an opening exposing at least portion of first circuit, forming an electroless plating film covering surface of insulating layer including surface of insulating layer inside opening, forming on electroless film a plating resist layer having pattern exposing selected portions of electroless film, selected portions of electroless film including a second conductor circuit and a portion of electroless film covering opening, and forming an electrolytic plating film covering selected portions of electroless film such that a filled via conductor including an electrolytic material filling space in opening and that first circuit is connected to second circuit via conductor.

Printed wiring board and method for producing the same

A multilayer printed circuit board including a substrate board having a lower conductor circuit, a resin insulating layer formed over the substrate board and lower conductor circuit, and a conductor circuit formed over the resin insulating layer. The resin insulating layer has a via hole filled up with plating and is formed of a linear polyolefin resin formed by hot-pressing a film shaped resin.

The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.

Method of manufacturing a printed wiring board

Printed circuit board

Method for producing a printed wiring board

A multilayer printed circuit board including a substrate board and a built-up structure formed over the substrate board. The built-up structure includes conductor circuits and resin insulating layers. The built-up structure has via holes interconnecting the conductor circuits through one or more resin insulating layers. The via holes are filled up with plating, and the resin insulating layers is formed of a cycloolefin resin.

The present invention provides a method for producing a honeycomb structure which carries a catalyst component containing at least one element selected from the group consisting of alkali metals and alkaline earth metals and purifies exhaust emissions. The method of the invention includes: a starting material mixing step of mixing ceramic particles having a predetermined average particle size, fine particles being composed of the same material as the ceramic particles and having an average particle size smaller than the predetermined average particle size, and an erosion-resistant material or a precursor thereof which inhibits the catalyst component from eroding the ceramic particles more effectively than an oxide of the element contained in the ceramic particles, to prepare a puddle; a molding and firing step of molding the puddle into a molded body and firing the molded body to sinter the molded body and to allow a ceramic particle protection material composed of the erosion-resistant material or the precursor thereof to be present on the surface of the molded body; and a catalyst-carrying step of making the fired molded body to carry the catalyst component.

Honeycomb structure, method for producing the same, and exhaust emission purification apparatus

The invention provides a method for producing a porous body comprising: a starting material mixing step of mixing ceramic particles serving as an aggregate and a sintering aid which includes at least one element selected from the group consisting of rare earth elements, alkaline earth elements, Al and Si such that the amount of the sintering aid is about 1.0% by weight or less relative to the total amount of the ceramic particles and the sintering aid to form a puddle; and a molding and firing step of molding the puddle into a molded body and firing the molded body.

Method for producing porous body, porous body, and honeycomb structure

A ceramic honeycomb structural body is manufactured by molding silicon carbide raw powders into a honeycomb pillar shape and then firing it to form a sintered body. The silicon carbide raw powders are comprised of about 60 to about 80% by mass of particles of first particle group having one frequency peak in the particle size distribution and a particle size of 1.0 &#x3bc;m to about 100 &#x3bc;m, and about 20 to about 40% by mass of particles of a second particle group having a particle size of about 0.1 &#x3bc;m or more and less than 1.0 &#x3bc;m.

Ceramic honeycomb structural body and method of manufacturing the same

A honeycomb structured body of the present invention is a honeycomb structured body in which a plurality of porous ceramic members are combined with one another through an adhesive layer, each of the porous ceramic members having a plurality of cells which are allowed to penetrate in a longitudinal direction with a wall portion therebetween and either one end of which is sealed, with a catalyst supporting layer being adhered to the wall portion, wherein, supposing that the rate of the pore volume of pores having a pore diameter of 10 &#x3bc;m or less to the entire pore volume of the porous ceramic member is X(%), the porosity is Y(%) and the weight of the catalyst supporting layer is Z(g/l), these X, Yand Zare allowed to satisfy the following expressions (1) and (2):&#x2266;20&#x2212;/10&#x2003;&#x2003;(1), and&#x2267;35+7/40&#x2003;&#x2003;(2)(where about 20&#x2266;Z&#x2266;about 150).

Honeycomb structured body

The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in fracture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.

Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same

The honeycomb structured body of the present invention is a honeycomb structured body in which a plurality of porous ceramic members are combined with one another through an adhesive layer, each of the porous ceramic members having a plurality of cells which are allowed to penetrate in a longitudinal direction with a wall portion therebetween and either one end of which is sealed, with a catalyst supporting layer being adhered to the wall portion, wherein an average pore diameter of the porous ceramic member is larger than an average particle diameter of particles constituting the catalyst supporting layer, and when a pore diameter distribution of the porous ceramic member and a particle diameter distribution of particles constituting the catalyst supporting layer are drawn with the pore diameter and the particle diameter being on the same axis, a pore volume in an overlapped area of both the distributions is about 10% or less to the entire pore volume of the porous ceramic member.

The invention provides a filter that has a plurality of through holes and satisfies the expression 2.5&#xd7;A/B+52.5&#x2266;C&#x2266;2.5&#xd7;A/B+60.2 (A&#x2266;20, 0&#x3c;B&#x2266;20), where A(%) represents the ratio of pores with a pore diameter of 10 &#x3bc;m or less to the total pore volume in a wall part between the through holes; B(%) represents the ratio of pores with a pore diameter of 30 &#x3bc;m or more to the total pore volume in the wall part; and C(%) represents the aperture ratio of a plane perpendicular to the through holes.

Growing community of inventors

Gifu, Japan

Masayuki Hayashi