Jsr Corporation

Japan Synthetic Rubber Co., Ltd.

Bandai Co., Ltd.

Sharp Corporation

Tokyo Ohka Kogyo Co., Ltd.

International Center for Materials Research

Masayuki Endo

Masayoshi Suzuki

Isao Nishimura

Yasuaki Yokoyama

Masahiro Ueda

Yasumasa Takeuchi

Nobuo Bessho

Atsufumi Shimada

Takashi Satoh

Takamichi Murayama

Takahito Omori

Kimiyasu Sano

Isamu Yonekura

Fumiko Yonezawa

Tamaki Wakasaki

Hirofumi Sasaki

Tsutomu Shimokawa

Yasuo Matsuki

Hiroaki Nemoto

Kenya Makino

Takao Miura

Sojiro Tanaka

Yoshihiro Hosaka

Yoshiji Yumoto

Hiroharu Ikeda

Koei Komatsu

Tomohiro Utaka

Naomi Takebe

Takaaki Utsunomiya

Kazuaki Niwa

Takashi Kunita

Fumitaka Takinishi

Taku Nakano

Yosinobu Kariya

Makiko Togo

Risa Yokoyama, Legal Representative

Naomi Shinoda, Legal Representative

Michiko Yokoyama, Legal Representative

Toy robot

Monster-shaped toy

Without the use of a third monomer, no copolymer practicable as a base polymer for a radiation-sensitive resin composition has been obtained by copolymerizing two ingredients, i.e., a carboxylated monomer and an epoxidized monomer. A carboxylated monomer is reacted with a specific nonpolymerizable compound, and this reaction mixture is then copolymerized with an epoxidized monomer. A radiation-sensitive resin composition and a thermosetting resin composition each containing the resultant copolymer have satisfactory storage stability and are useful as a spacer for liquid-crystal display panels, etc., a planarization film for TFT elements, and a protective film for color filters.

Copolymer, resin composition, spacer for display panel, planarization film, thermosetting protective film, microlens, and process for producing copolymer

There is provided a method for forming wiring or an electrode by coating a substrate with a composition comprising (A) a complex of an amine compound and a hydrogenated aluminum compound and (B) a titanium compound or a composition comprising the complex and (C) metal particles and subjecting the obtained coating film to heating and/or a light treatment. By the method, a film can be formed that uses a conductive film forming composition with which wiring and an electrode that can be suitably used for electronic devices can be formed easily and inexpensively.

Methods for forming wiring and electrode

Radiation-sensitive composition, insulating film and organic EL display element

A barrier rib for an EL display element. The rib is formed from the radiation sensitive resin composition containing (A) an alkali soluble resin, (B) a polymerizable compound having an ethylenically unsaturated bond, and (C) a radiation sensitive polymerization initiator.

Radiation sensitive resin composition for forming barrier ribs for an EL display element, barrier rib and EL display element

Radiation sensitive resin composition and use of the same in an interlaminar insulating film

A process for forming a cured film comprising the steps of: coating an alkali-soluble thermosetting resin composition on a substrate, and baking it; coating a radiation sensitive resin composition on the coated film, and baking it, exposing the radiation sensitive resin composition on the substrate to radiation through a predetermined mask and baking it; carrying out development with an alkaline developer; immersing the substrate carrying the coated films in a stripping solution; and heating the alkali-soluble thermosetting resin remaining on the substrate to obtain a cured film pattern.

Process for forming a cured film of a thermoplastic resin

A radiation sensitive resin composition comprising (A) a fluorine-containing copolymer of hexafluoropropylene, at least one compound selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic anhydrides, and an unsaturated compound (B) an acid generating compound which generates an acid upon exposure to radiation; (C) a cross-linkable compound; and (D) an organic solvent. The composition suitable is useful for a negative resist for forming a mask for the production of a circuit such as a semiconductor integrated circuit or a thin film transistor circuit for liquid crystal displays as well as a material for forming a permanent film such as an interlaminar insulating film or a color filter protective film.

Radiation sensitive resin composition

An epoxy group-containing thermosetting resin composition comprising (A) a copolymer obtained From (a) at least one member selected from an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride, (b) an epoxy group-containing unsaturated compound, (c) a monoolefin unsaturated compound, and optionally (d) a conjugated diolefin unsaturated compound, and (B) an organic solvent for dissolving the above copolymer. There is also provided another epoxy-group containing thermosetting resin composition which contains the above component (A), (C) a polymerizable compound having at least one ethylenically unsaturated double bond, and (D) a photopolymerization initiator. These epoxy-group containing thermosetting resin compositions are excellent in storage stability.

Epoxy group-containing copolymer and radiation sensitive resin

A reflection preventing film for forming a resist pattern and a process for forming the resist pattern using the film. The film comprises a copolymer was copolymerized of monomers which comprise at least one unsaturated carboxylic acid monomer, at least one epoxy group-containing unsaturated monomer, and at least one cinnamoylphenyl group-containing unsaturated monomer. The reflection preventing film exhibits a high halation preventing effect, involves no sublimation of radiation absorbing components contained therein, is free from occurrence of intermixing, possesses excellent heat resistance, exhibits a superb dry etching performance and storage stability, and produces resist patterns with excellent resolution and precision. The resist pattern forming process comprises forming the reflection preventing film on a substrate, forming a resist coating film on said reflection preventing film, irradiating the resist film with a radiation, and developing the resist coating film.

Reflection preventing film and process for forming resist pattern using

A radiation sensitive resin composition for microlens comprising (a) an alkali-soluble resin, (b) a 1,2-quinonediazide compound, (c) a compound having at least 2 epoxy groups in the molecule, (d) a melamine and (e) a trihalomethyltriazine or an onium salt, which composition exhibits high sensitivity, high resolution and high yield of residual film thickness in the formation of a lens pattern and is small in dependency on heating conditions in the preparation of a microlens.

Radiation sensitive quinone diazide and resin composition for microlens

Growing community of inventors

Tokyo, Japan

Masayuki Endo