Kabushiki Kaisha Toshiba

Masayuki Arakawa

Yasuhito Saito

Tomohiro Iguchi

Kazuki Tateyama

Naruhito Kondo

Masao Segawa

Naotake Watanabe

Osamu Tsuneoka

Takahiro Sogou

Akihiro Hara

Kenji Ito

Tetsuro Komatsu

Taizo Tomioka

Ikuo Mori

Kenta Fukatsu

Mutsumi Suematsu

Yoshitoshi Fukuchi

Makoto Takagi

In order to provide a highly reliable thermoelectric device, in a thermoelectric device, a plurality of heat-radiating-side electrodes, arranged in accordance with positions where respective thermoelectric elements are to be arranged, are arrayed in an array fashion on a planer surface of a heat-radiating-side board. Heat-radiating-side end surfaces of the plurality of p-type thermoelectric elements and n-type thermoelectric elements and the heat-radiating-side electrodes are joined together by solders. Heat-absorbing-side electrodes are brought into sliding contact with heat-absorbing-side end surfaces of these thermoelectric elements.

Method of making a thermoelectric device

Thermoelectric device

An optically coupled semiconductor device according to the present invention comprises a mount electrode and a wire electrode which are formed on a top main face of the first wiring substrate, a light-emitting element is electrically connected to the mount electrode and the wire electrode, a first electrode pad and a second electrode pad which are provided on the top main face of the second wiring substrate in such a manner as to sandwich the opening formed in the second wiring substrate, a photo-receptor element which is arranged in such a manner as to block the opening formed in the second wiring substrate and which is connected to the first electrode pad so as to face the light-emitting element, and a switching element which is connected to the second electrode pad so as to face the wire.

Optically coupled semiconductor device and method for manufacturing the same

In a stacked-type semiconductor unit having a plurality of semiconductor devices stacked on a base board including a base electrode, each semiconductor device has a wiring board including an external electrode provided in an end portion thereof. The semiconductor devices are stacked on the base board such that the external electrodes are aligned with one another. Then, the external electrodes are electrically connected to the base board by solder.

Semiconductor device having a plurality of stacked wiring boards

A semiconductor device comprises a first wiring board and a second wiring board, wherein the first wiring board includes a first semiconductor element arranged on the underside of the first wiring board, and a second connecting section formed on the underside of the first wiring board, the second wiring board includes a second semiconductor element, and a third connecting section formed on the surface of the second wiring board, the second connecting section has a first external connecting land, the third connecting section is arranged opposite to the first external connecting land and has a second external connecting land which is smaller than the first external connecting land, and the second and third connecting sections are formed such that a combined thickness thereof provides a given space between the first semiconductor element and the second wiring board.

Stacked semiconductor device and method for manufacturing the same

A rotary magnetic head apparatus according to one aspect of the invention has magnetic heads mounted on a rotary drum, a rotor which rotates together with the rotary drum and a circuit board with electronic circuits formed thereon provided between the rotor and the magnetic heads. While a connecting device according to another aspect of the invention has at least one spring contact and outer lead terminals extending in at least three directions and a resin mold body for fixing them together in a body, and the lead terminal extending in one direction is electrically connected with the spring contact while the remaining two terminals extending in other directions are electrically connected to each other in the resin mold body.

Rotary magnetic head apparatus which includes a device for electrically

A thick-film high frequency signal circuit apparatus with a feedthrough capacitor. The apparatus includes a thick-film circuit in which a high frequency signal circuit is constituted on a substrate in a thick-film configuration, a shielding case for housing the thick-film circuit therein, a feedthrough capacitor constituted on one surface of the substrate in the thick-film configuration and a terminal for transmitting signals between the thick-film circuit and a circuit outside the shielding case, the terminal having a first end coupled to the thick-film circuit through the feedthrough capacitor and a second end protruding outside the shielding case through a hole defined therein.

Thick-film high frequency signal circuit apparatus with feedthrough

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Yokohama, Japan

Masayuki Arakawa