Denso Corporation

Masayuki Aoyama

Koji Kondo

Kenji Kondo

Masanori Takemoto

Yoshihiko Shiraishi

Toshikazu Harada

Toshihiro Miyake

Tadao Suzuki

Yoshitaro Yazaki

Satoshi Takeuchi

Kaoru Nomoto

Yasuaki Matsunaga

Kazuo Tada

Hidehiro Mikura

Masashi Echigo

Yosuke Ozaki

Tomoyuki Hiramatsu

Katsumi Yamazaki

Naoyuki Akita

Tetuhiro Nakano

Seiji Konishi

Seiichi Shindou

A multilayer printed circuit board with a built-in capacitor includes a plurality of resin films, each of which is made of thermoplastic resin and has a plurality of via-holes at predetermined positions, a plurality of conductive patterns, which are located on the resin films, and a plurality of conductive pattern interconnecting members, which are located in the via-holes to electrically interconnect the conductive patterns that are electrically separated by the resin films. Two of the conductive patterns are respectively located on two surfaces, which are opposite to each other, of one of the resin films while overlapping. The two of the conductive patterns and the one of the resin films make up a capacitor.

Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit board

An electronic component unit includes an interposer with a plurality of holes and a circuit wiring layer disposed on one surface of the interposer. The electronic component is electrically connected to the circuit wiring layer. A plurality of solder bumps are electrically connected to one surface of the circuit wiring layer through the holes formed in the interposer. The circuit wiring layer is electrically connected to an outside circuit through the solder bumps. A junction interface between the circuit wiring layer and each of the solder bumps is made of ductile metal.

Mounting structure of electronic component on substrate board

In an electronic-component mounting structure, an electronic component (,) has a surface. First electrodes (,) provided on the surface of the electronic component (,) are arranged in a first array. Second electrodes (,) provided on a base board (,) are arranged in a second array corresponding to the first array. The second electrodes (,) correspond to the first electrodes (,) respectively. Solder bumps (,) connect the first electrodes (,) and the second electrodes (,) respectively. The first electrodes (,) include first outermost electrodes (,) located in an outer area of the first array. The second electrodes (,) include second outermost electrodes (,) located in an outer area of the second array. The second outermost electrodes (,) correspond to the first outermost electrodes (,) respectively. An outer edge (X,, Z,) of each of the second outermost electrodes (,) extends outward of an outer edge (Y,) of a corresponding first outermost electrode (,) with respect to the first and second arrays. A distance between an outer edge (X,, Z,) of each of the second outermost electrodes (,) and an outer edge (Y,) of a corresponding first outermost electrode (,) is greater than a distance between an inner edge (X,, Z,) of the second outermost electrode (,) and an inner edge (Y,) of the corresponding first outermost electrode (,) with respect to the first and second arrays.

Electronic-component mounting structure

A BGA package is mounted on a multi-layer printed wiring board having a plurality of electrodes arranged in a matrix form through a plurality of solder bumps. In the most externally-located electrodes, a lead wire is formed to extend from a portion of the most-externally-located electrode located inside of a polygon formed by connecting each of the centers of adjacent most-externally-located electrodes. Therefore, the solder bumps are prevented from coming off the most-externally-located electrodes because a portion of the most-externally-located electrode to which stress caused by an external shock is intensively applied is located in an outside of the polygon. Thus, a contact failure between the BGA package and the multi-layer printed wiring board is prevented.

A printed circuit board has a layer including a resin material, which has a tensile breaking strain of approximately 1% or more at a tensile strain rate of 40%/sec at 25&deg; C., and an Izod impact strength of approximately 1 kgf&middot;cm/cm or more at 25&deg; C. Otherwise, the resin material has a peak value of dynamic loss tangent of 0.05 or more in a range of &minus;100&deg; C. to &minus;50&deg; C. by &bgr; relaxation, and a peak value of dynamic loss tangent of 0.02 or more in a range of 0&deg; C. to 100&deg; C. by &bgr;&prime; relaxation in a dynamic viscoelasticity spectral measurement. Accordingly, thermal shock resistance and drop shock resistance of the printed circuit board can be improved.

Shock-resistive printed circuit board and electronic device including the same

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Kariya, Japan

Masayuki Aoyama