Konica Minolta Opto, Inc.

Masayoshi Uehira

Kanji Sekihara

Akihiko Matsumoto

Toshiyuki Majima

Yuzo Nakatsuka

Akihiro Iwane

Takahito Muroi

Katsushi Watanabe

Taper portionsandare provided in the cavity of a stationary side dieand the cavity of a movable side diein an injection molding apparatus, respectively, and a floating mechanismis provided so that one taper portions are able to freely follows the other taper portions while die clamping. This configuration makes it possible to correct axial misalignment in each of the cavities.

Die assembly for injection molding

A method for bonding resin members by laser welding in which melting of a resin member can be prevented on the contact surface with a base or a tool used for bonding. In the bonding method, a resin member () is mounted on a base () and a surface of the base () in contact with the resin member () is an optical mirror surface. A surface of the resin member () is coated with a light absorbing agent (), a resin member () is placed thereon and then a laser light () is irradiated from the resin member () side in order to melt the resin on the bonding surface of the resin member () and the resin member (), thereby bonding the resin members together. The laser light () penetrated through the bonding surface reaches the contact surface where the resin member () and the base () are in contact with each other, and since the laser light () penetrates the bonding surface without being scattered or absorbed, melting of the resin member can be prevented.

Bonding method of resin member

A method of forming an optical element forming metal mold to form an optical element, having steps of: laminating a heat insulation layeron a surface of the base memberwhere the optical element is formed; laminating an intermediate metal layeron a surface of the heat insulation layerby thermal spraying; laminating a surface forming layer, on which a surface shape to be transferred to the optical element is formed, on the intermediate metal layer; wherein the intermediate metal layeris laminated in a way that parts of the heat insulation layerare exposed substantially evenly from the intermediate layer

Optical element forming metal mold and method of manufacturing optical element forming metal mold

Provided is a microchip manufacturing method by which a functional film is formed in a flow path channel and resin microchip substrates are bonded. The manufacturing method has a first step of forming SiO2 films () representing the functional films on a surface having a flow path channel () of a microchip substrate () and on a surface having a flow path channel () of a microchip substrate () respectively; a second step of exfoliating the SiOfilms formed on the microchip substrates () except the SiOfilms formed on the flow path channels () by a cohesive member; and a third step of placing the microchip substrates () one over another in such a way that the surfaces on which the flow path channels () are formed face inside, and bonding the substrates by laser welding, ultrasonic wave welding or thermocompression bonding.

Microchip manufacturing method

In the case where a lens unit where two ore more transparent resin lenses are combined is constituted, at least one transparent resin lens contains infrared absorbent. When the lens unit is assembled, an infrared laser is emitted to a joined portion between the transparent resin lens and the other transparent resin lens. As a result, the emitted infrared ray is absorbed by the infrared absorbent, so that the transparent resin lenses are welded to each other. An opaque lens barrel which holds the entire lens unit and the transparent resin lenses are joined by welding.

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Osaka, Japan

Masayoshi Uehira