Hitachi, Ltd.

Masayoshi Tsugane

Hiromichi Suzuki

Makoto Kitano

Akihiro Yaguchi

Satoshi Nakamura

Naotaka Tanaka

Tatsuya Nagata

Tetsuo Kumazawa

A lead frame for use with a plastic encapsulated semiconductor device includes a tab on which the semiconductor chip is mounted, chip pad supporting leads, inner leads to be electrically coupled with the semiconductor chip, outer leads formed in a monoblock structure together with the inner leads, and a frame for supporting the chip pad supporting leads and outer leads. In the lead frame, there is disposed a dam member only between the outer leads. Alternatively, dummy outer leads are formed between the frame and leads adjacent thereto so as to connect the dummy leads to the outer leads by the dam member. The frame is removed after the semiconductor device is assembled.

Lead frame and semiconductor device

Lead frame and semiconductor device encapsulated by resin

Growing community of inventors

Kodaira, Japan

Masayoshi Tsugane