Dow Corning Toray Company, Ltd.

Dow Corning Corporation

Dow Corning Toray Silicone Company Limited

Masayoshi Terada

Makoto Yoshitake

Hiroji Enami

Yoshitsugu Morita

Tomoko Kato

Takashi Sagawa

Brian Harkness

Ann Walstrom Norris

Michelle R Cummings

Tammy Cheng

Masashi Murakami

Malinda Howell

A hydrosilylation reaction-curable organopolysiloxane composition comprising (A) a methylpheny-lalkenylpolysiloxane that has at least two alkenyl groups wherein diphenylsiloxane units are no more than 5 mole % and at least 20 mole % is comprised of phenyl groups, (B) a methylphenylhydrogenpolysiloxane that has at least two Si-bonded hydrogen atoms wherein diphenylsiloxane units are no more than 5 mole % and at least 20 mole % is comprised of phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor element sealant comprising this composition. An optical semiconductor device sealed with this optical semiconductor element sealant.

Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device

A curable organopolysiloxane composition and an optical semiconductor element sealant, each comprising (A) a diorganopolysiloxane that has at least 2 alkenyl groups wherein at least 70 mole % of all the siloxane units are methylphenylsiloxane units and the total content of 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane is no more than 5 weight %, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms wherein at least 15 mole % of the silicon-bonded organic groups are phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor device in which an optical semiconductor element within a housing is sealed with the cured product from the aforementioned composition.

A curable organopolysiloxane composition comprising: (A) an organopolysiloxane that contains in one molecule at least two alkenyl groups and at least 30 mole % of all silicon-bonded monovalent hydrocarbon groups in the form of aryl groups: (B) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms and at least 15 mole % of all silicon-bonded organic groups in the form of aryl groups; (C) a branched-chain organopolysiloxane that contains alkenyl, aryl, and epoxy-containing organic groups; and (D) a hydrosilylation catalyst. The composition is capable of forming a cured body that has a high index of refraction and strong adhesion to substrates.

Curable organopolysiloxane composition and semiconductor device

A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si&#x2014;H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device.

Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones

A curable organopolysiloxane composition comprises at least the following components: an organopolysiloxane (A) represented by the following general formula: RSiO(RSiO)SiR(where Ris a monovalent hydrocarbon group, and 'm' is an integer from 0 to 100); an organopolysiloxane (B) represented by the following average unit formula: (RSiO)(RSiO)(RSiO)(where Ris a monovalent hydrocarbon group, and 'a', &#x201c;b&#x201d;, and &#x201c;c&#x201d; are specific numbers); an organopolysiloxane (C) having in one molecule on average at least two silicon-bonded aryl groups and on average at least two silicon-bonded hydrogen atoms; and a hydrosilylation-reaction catalyst (D); is characterized by good fillability and curability and that, when cured, forms a cured body that possesses a high refractive index, high light transmissivity, and strong adhesion to various substrates.

A curable organopolysiloxane composition comprising (A) a linear organopolysiloxane having at least two alkenyl groups and at least one aryl group per molecule, (B) a branched organopolysiloxane having at least one alkenyl group and at least one aryl group per molecule, and having siloxane units represented by the general formula: RsiO, (C) a linear organopolysiloxane with both terminal ends of the molecular chain blocked by silicon bonded hydrogen atoms having at least one aryl group per molecule, and (D) a hydrosilation reaction catalyst, and a semiconductor device whose semiconductor elements are coated with the cured product of the above-described composition. The curable organopolysiloxane composition shows low viscosity, excellent filling properties, and excellent curability that cures to form a soft cured product of a large refractive index, high light transmittance, and high adhesion to substrates, as well as the semiconductor device shows superior reliability.

A silicone gel composition is characterized by excellent storage stability in a non-cured state and by high adhesion to a substrate and long-term stability of consistency at elevated temperatures after curing. The silicone gel composition comprises: a polyorganosiloxane (A), which consists of polyorganosiloxane (A-1) that contains R(CH)SiOunits, RsiOunits R(CH)SiOunits, and polydiorganosiloxane (A-2) that contains R(CH)SiOunits and R(CH)SiOunits, and R(CH) which contains in one molecule two silicon-bonded hydrogen atoms; an addition-reaction platinum catalyst (C); an organosilicon compound (D) selected from silane of the general formula (RO)SiRor a partially hydrolyzed condensate thereof; and an organic titanium compound (E).

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Ichihara, Japan

Masayoshi Terada