Mitsubishi Electric Corporation

Masayoshi Tamura

Seiji Haga

Shigenobu Tochiyama

Kazuki Arata

Takashi Kobayashi

Keita Takahashi

Koji Nakajima

Takuya Nakamura

Satoshi Ishibashi

Masashi Sakai

Kazuki Sakata

Mamoru Takikita

Takuto Yano

Kosuke Nakano

Kazutoshi Awane

Takao Mitsui

Yosuke Kikuchi

Yoshiyuki Deguchi

Shinsuke Idenoue

Tsuyoshi Tanabe

Naoto Himura

Masasi Sakai

Hideki Goto

Noriyuki Tani

Nobuyasu Kitagawa

Yuhei Nagashima

Kazuya Horio

Takayoshi Horiguchi

A heat sink includes a main body and multiple circular pipes. The main body is in contact with at least one heat emitter. The circular pipes are disposed inside the main body. The circular pipes extend in a shape of helices and are configured to convey refrigerant. The circular pipes are arranged such that the central axes of the helices are adjacent. Each two of the circular pipes of which the central axes of the helices are adjacent to each other are intertwined with each other.

Heat sink and sink manufacturing method

A refrigerant channel of a heatsink includes an upwardly inclined channel formed by a side wall for downstream side of a first protruding portion and a side wall for upstream side of a second protruding portion. The upwardly inclined channel directs a flow of the refrigerant toward a base portion of the fin and causes the refrigerant to flow into the fin region, because of which more refrigerant flows to the base portion than to a leading end portion of the fin, and a high heat dissipating performance is obtained. Also, the fin is a columnar body whose sectional form perpendicular to a central axis is a regular hexagon, has rounded portions in corner portions, and has tapers on side faces. Six fins are disposed neighboring one fin, and a distance between fins is constant. Because of this, the heat dissipating performance further improves, and pressure loss can be reduced.

Heatsink, and semiconductor module including the heatsink

A soldering system includes a temperature measurement device that measures a temperature distribution of a surface of a substrate. The soldering system also includes a driver that drives the soldering system based on a control parameter obtained from the temperature distribution measured by the temperature measurement device.

Soldering system including temperature distribution measurement control device, control method, and program

A pin-shaped first heat radiating fin low in fluid resistance is disposed in a region required to be high in cooling performance, and a second heat radiating fin high in fluid resistance of a shape in which a plurality of columns of grooves which each meander in zigzag at a narrow pitch are arranged side by side is disposed in a region only necessary to be low in cooling performance. Furthermore, the first and second heat radiating fins are installed in parallel to a direction of flow of refrigerant.

Heat sink

A heat sink includes a plurality of heat-radiating fins provided on a base, wherein the heat-radiating fins each have a projection-and-recess shape in which a sectional shape along the base is inscribed in a regular hexagon, wherein projections of the projection-and-recess shape are held in contact with the regular hexagon. In adjacent heat-radiating fins, sides of the regular hexagon, with which the projections are held in contact, are opposed to each other in an entire region. The heat-radiating fins are arranged so that distances between the sides opposed to each other at a distance are equal.

Heat sink with projection and recess shaped fins

A liquid coolant supplying header is configured on a central portion in the width direction between an upper portion heatsink and a partitioning plate, a liquid coolant discharging header is configured on a central portion in the width direction between a lower portion heatsink and the partitioning plate so as to be parallel to the liquid coolant supplying header, vertical flow channels are formed so as to pass through the partitioning plate vertically on two sides in the width direction so as to be parallel to the liquid coolant supplying header, a liquid coolant distributing structural body is disposed inside the liquid coolant supplying header, and an external shape of the liquid coolant distributing structural body is formed such that flow channel cross-sectional area of the liquid coolant supplying header becomes gradually smaller from an upstream end toward a downstream end.

Cooling apparatus having vertical flow channels

A power converter includes: a base conductor, an electrically heating member which is provided on the base conductor, a noise reduction capacitor of flat plate-shape in which via an insulator, a plurality of first electrodes and second electrodes are alternately layered, on one surface, the first electrode in an outermost layer is exposed and on another surface, the second electrode in an outermost layer is exposed, a relay conductor which is electrically connected to other members from the electrically heating member via the noise reduction capacitor, and the second electrode in an outermost layer of the noise reduction capacitor is face-joined to a face of the base conductor at a side where the electrically heating member is provided and the first electrode in an outermost layer and the relay conductor are face-joined.

Power conversion device

There are provided a heat transfer parthaving heat-receiving surfacesandwhich have curved surface shapes along side surfacesandof a stemand a cylindrical partand in which the stemand the cylindrical partcan be fitted, and heat-dissipating surfacesandprovided with projected and retracted portionsand; and a casinghaving the optical distributorand the heat transfer partmounted thereon, and having heat-receiving surfacesandprovided with projected and retracted portionsandengaged with the projected and retracted portionsand

Heat dissipation structure and optical transceiver

The cooling device comprises a heat exchange unit provided in a cooling water flow path. The heat exchange unit has a plate part in the form of a plate and multiple fins erected on the plate face of the plate part, and provided in the manner that the plate face of the plate part extends along the cooling water flow path and the cooling water runs through the space between the fins. The multiple fins are each in the form of a rhombic column and provided on the plate part in a lattice pattern in the manner that the longer diagonal of the rhombic column extends along the cooling water flow path.

Cooler and cooling device

Growing community of inventors

Tokyo, Japan

Masayoshi Tamura