Aisin Seiki Kabushiki Kaisha

Masayoshi Takeuchi

Takehiko Sugiura

Nobuhiro Yamauchi

Yoshichika Ito

Hironori Koeda

Masaru Hoshina

Shuji Noda

Satoru Nomoto

An object detecting apparatus includes: a piezoelectric sensor including a first electrode, a piezoelectric material surrounding the first electrode, and a second electrode surrounding the piezoelectric material and provided at an outer edge portion at a side of an opening of a door for a vehicle having a door panel; a signal processing circuit measuring a potential difference between the first electrode and the second electrode; and a connecting line connecting the first electrode and the second electrode to the signal processing circuit.

Object detecting apparatus

An object detecting apparatus includes a piezoelectric sensor provided at an edge portion of an opening/closing body for emitting an output voltage which changes corresponding to an external force applied to the edge portion and a detection circuit for receiving the output voltage of the piezoelectric sensor and for judging an entrapment. The detection circuit includes a voltage-measuring circuit for measuring the output voltage of the piezoelectric sensor, a time-measuring circuit for measuring time, and a judging circuit configured to judge the entrapment. The judging circuit judges the entrapment corresponding to the output voltage of the piezoelectric sensor. The judging circuit calculates a changing value of the output voltage after the output voltage of the piezoelectric sensor reaches a predetermined first level. The judging circuit judges that the entrapment has not occurred in a situation where the changing value of the output voltage is larger than a predetermined value.

Protector for nipping sensor in automatic opening and closing devices

A production method of a micromachine includes a polysilicon film forming step which overlays grooves, defined in an upper surface of a sacrificial layer on a silicon substrate, with polysilicon layer so as to be flat. The production method includes a first processing step for filling the grooves by adding a lower laid portion of the polysilicon layer onto a sacrificial layer. The lower laid portion has a thickness greater than 0.625 times relative to a width of the grooves. The production method of the micromachine further includes a second processing step for making the polysilicon layer to have a predetermined thickness by adding a upper laid portion of the polysilicon layer on the lower laid portion to form the polysilicon layer, the upper laid portion formed by depositing polysilicon which has the same impurity concentration as the lower laid portion does.

Production method of a micromachine

Growing community of inventors

Kariya, Japan

Masayoshi Takeuchi