Fujitsu Ten Limited

Masayoshi Shouno

Masaki Hitotsuya

Tomohiko Tamaki

Hiroaki Matsuki

A high frequency IC package and high frequency unit are simplified and downsized, and the number of manufacturing processes is reduced. The partto determine a characteristic of the high frequency IC chip is arranged outside the sealingof the high frequency IC package. The part can be arranged on the package board, circuit boardor housing chassis. When the part is arranged outside the sealing, the package and the high frequency uniton which the package is mounted can be downsized. In the case of arranging the part on the circuit board, the part can be mounted together with other surface mounting parts. Therefore, the number of manufacturing processes can be reduced.

High frequency IC package, high frequency unit using high frequency IC package, and manufacturing method thereof

An FM-CW radar apparatus capable of detecting a stationary object, in particular, an overbridge, located above the road ahead in a simple manner uses a traveling wave antenna as a transmitting antenna, and includes a means for varying, in upward and downward directions the projection angle of a combined beam pattern of a transmitted wave radiated from the traveling wave antenna, and an overbridge is detected by varying the projection angle of the combined beam pattern in the upward direction using the varying means. Further, a phase shifter for varying the projection angle of the beam pattern in upward/downward directions by controlling the phase of the radio wave to be transmitted or received is provided on either a transmitting antenna or a receiving antenna or on a transmitting/receiving antenna, and an overbridge is detected by controlling the phase shifter and varying the projection angle of the beam pattern in the upward direction.

Growing community of inventors

Kobe, Japan

Masayoshi Shouno