Seiko Instruments Inc

Citizen Electronics Co., Ltd.

Masayoshi Shiraishi

Kiyoshi Aratake

Naoki Kawawada

Yasuhiro Nohara

Akihiro Sadaki

Koji Kawaguchi

Hideo Hoshi

Tatsuru Sato

Katsuhiko Sato

Kazuhiro Kobayashi

Hiroshige Ikeno

Kenji Sunaga

Kishirou Nakamura

Takashi Konno

Osamu Tanabe

In a method for manufacturing a piezo-electric vibrator, a vibrator is provided having a vibrator piece and a frame surrounding a periphery of the vibrator piece. A first exciting electrode is formed on the vibrator piece. A weight is disposed on the vibrator piece in spaced-apart relation to the first exciting electrode. A characteristic of the vibrator is then adjusted. The first exciting electrode is removed and a metal film is formed on a surface of the vibrator. The metal film is patterned and a second exciting electrode is formed on the vibrator piece.

Method for manufacturing piezo-electric vibrator

A method of fabricating a piezoelectric vibrator comprises providing a piezoelectric oscillating plate having a piezoelectric vibrator piece and frame integrally connected to a base end portion of the piezoelectric vibrator piece and surrounding the piezoelectric vibrator piece. A pair of excitation electrodes is disposed on surfaces of two sides of the piezoelectric vibrator piece for vibrating the piezoelectric vibrator piece. Bond films are formed on upper and lower surfaces of the frame and are connected to the excitation electrodes. Shortcircuiting electrodes are disposed on the piezoelectric oscillating plate for causing a shortcircuit to electrically connect the bond films to each other. The piezoelectric vibrator piece is covered to seal the piezoelectric vibrator piece in an airtight manner via the bond films without hampering vibration of the piezoelectric vibrator piece.

Method of fabricating piezoelectric vibrator

A method is provided for fabricating a piezoelectric vibrator without degrading vibration characteristics. The piezoelectric vibrator has a vibration plate formed with a piezoelectric vibration portion and a frame portion integrally connected with a base portion of the piezoelectric vibration portion and surrounding the piezoelectric vibration portion. Opposite surfaces of the piezoelectric vibration plate are provided with a pair of lid members bonded to hermetically seal the piezoelectric vibration portion without interfering with vibration thereof. To achieve the bonding, a metal film is coated over substantially the entire area of opposite surfaces of the piezoelectric vibration plate. The metal film is patterned to form oscillation electrode films on opposite surfaces of the piezoelectric vibration portion and to form bonding films on opposite surfaces of the frame portion for bonding the frame portion to the pair of lid members.

Method for manufacturing piezoelectric oscillator

A piezoelectric vibrator has a piezoelectric oscillating plate having a piezoelectric vibrator piece and a frame integrally connected to a base end portion of the piezoelectric vibrator piece and surrounding the piezoelectric vibrator piece. A pair of excitation electrodes are disposed on surfaces of two sides of the piezoelectric vibrator piece for vibrating the piezoelectric vibrator piece. Bond films are formed on upper and lower surfaces of the frame and are connected to the excitation electrodes. A pair of lids seal the piezoelectric vibrator piece in an airtight manner via the bond films without hampering vibration of the piezoelectric vibrator piece. Shortcircuiting electrodes are disposed on the piezoelectric oscillating plate for causing a shortcircuiting to electrically connect the bond films to each other.

Electrode structure of piezoelectric vibrator

To provide an anodic bonding method which can favorably bond between members different in thermal expansion coefficient. In an anodic bonding method of applying a voltage to and bonding between a first member having a bonding film on a bonding surface and a second member closely put on the bonding surface of the first member through the bonding film in a manner that the first member is rendered as an anode, characterized in that: the bonding film is of a metal film and the second member is of a soda-lime glass, and a bonding temperature is at 100-200&deg; C. and an application voltage is at 0.5-5.0 kV.

Method for anodic bonding

An inkjet recording apparatus comprises an inkjet recording device for discharging recording ink according to a recording signal and for recording on a recording medium, and a coating device for coating a coating material on the recording medium prior to recording by the inkjet recording device. The inkjet recording device comprises at least one first orifice for discharging the recording ink on the recording medium, a first passage in communication with the first orifice for receiving a supply of the recording ink, and a first heating device for heating the recording ink supplied to the first passage. The coating device has at least one second orifice for discharging the coating material on the recording medium, a second passage in communication with the second orifice for receiving a supply of the coating material, and a second heating device for heating the coating material supplied to the second passage.

Inkjet recording apparatus

A crystal oscillating device comprises an outer case having a longitudinal axis, a cavity, a pair of first surfaces extending along the longitudinal axis, a pair of second surfaces extending in a direction generally transverse to the longitudinal axis, a first opening portion in one of the first surfaces for providing access into the cavity, a second opening portion in one of the second surfaces, and a groove in the other of the second surfaces. A crystal oscillator is disposed in the cavity of the outer case and has lead terminals extending through the second opening portion of the outer case for electrically connecting the crystal oscillator to a circuit board. A bonding material is disposed in the cavity of the outer case for bonding the crystal oscillator to the outer case. A connecting member is disposed in the groove of the outer case for connecting the outer case to the circuit board.

Surface mountable crystal oscillating device and method of producing the

Integrated circuit package

An image recording method and apparatus employing a thermal head capable of making a sublimation type thermal transfer recording and a fusion type thermal transfer recording by means of the same thermal head. This apparatus sets its vertical printing pitch at different values in the sublimation type recording mode and the fusion type recording mode. In the sublimation type recording mode, after making a first printing, this apparatus feeds a recording paper by a distance which is an integral multiple of the vertical printing pitch and makes a second printing using the same printing data as the first printing. In the fusion type recording mode, after making a 1-line printing, this apparatus feeds the recording paper by a 1-line spacing and makes a printing by means of printing data of the next line.

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Chiba, Japan

Masayoshi Shiraishi