The Furukawa Electric Co., Ltd.

Masayoshi Seki

Junji Yoshida

Toshio Kimura

Hiroyuki Matsuura

Naoki Tsukiji

Hiroshi Ichikawa

Yutaka Oki

Takeshi Aikiyo

Tsuyoshi Wakisaka

A method and apparatus for inspecting a plurality of optical modules, in which the optical modules are given channel numbers, a plurality of inspection items, which are related to optical characteristics and/or electrical characteristics of the optical modules, are measured in parallel, and measurement data on the inspection items is stored in storing device. This makes it possible to inspect the optical modules efficiently in a short time, eliminating waiting time.

Method and apparatus for inspecting optical modules

A semiconductor laser element is fixed onto a submount by forming a metallic thin film at a region on a surface of a p-side electrode of the semiconductor laser element. A periphery of the thin metallic thin film is recessed from a periphery of the p-side electrode by a predetermined width. The metallic thin film is thermally processed together with the p-side electrode for increasing a size of the grains and connected through a solder layer to the submount. Parts of the p-side electrode and the submount, the metallic thin film and the solder layer include Au for improving a cushion function of the semiconductor laser device.

Semiconductor laser device with a strain reduction cushion function, semiconductor laser module, and semiconductor laser device fabrication method

Growing community of inventors

Tokyo, Japan

Masayoshi Seki