Hamamatsu-photonics K.k.

Masayoshi Kusunoki

Tatsuya Suzuki

Kazuhiro Atsumi

Koji Kuno

Kenshi Fukumitsu

Fumitsugu Fukuyo

Toshimitsu Wakuda

Tetsuya Osajima

Norio Kurita

A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided. This laser processing method comprises a preparatory step of holding a lens at an initial position set such that a converging point is located at a predetermined position within the object; a first processing step (Sand S) of emitting a first laser beam for processing while holding the lens at the initial position, and moving the lens and the ltd object relative to each other along a main surface so as to form a modified region in one end part of a line to cut; and a second processing step (Sand S) of releasing the lens from being held at the initial position after forming the modified region in the one end part of the line to cut, and then moving the lens and the object relative to each other along the main surface while adjusting the gap between the lens and the main surface after the release, so as to form the modified region.

Laser processing method and device

A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided. This laser processing method comprises a preparatory step of holding a lens at an initial position set such that a converging point is located at a predetermined position within the object; a first processing step (Sand S) of emitting a first laser beam for processing while holding the lens at the initial position, and moving the lens and the object relative to each other along a main surface so as to form a modified region in one end part of a line to cut; and a second processing step (Sand S) of releasing the lens from being held at the initial position after forming the modified region in the one end part of the line to cut, and then moving the lens and the object relative to each other along the main surface while adjusting the gap between the lens and the main surface after the release, so as to form the modified region.

A laser processing method having a displacement acquiring step of acquiring a displacement between a point on the cutting line and one end of the cutting line in the object while irradiating the object with a second laser beam, converged by a lens, for measuring the displacement of a main surface of the object; and a position setting step of setting an initial position for holding the lens with respect to the main surface of the object according to the acquired displacement, and holding the lens at thus set initial position.

A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam is provided. This laser processing method comprises a displacement acquiring step (Sto S) of irradiating an object to be processed with a rangefinding laser beam for measuring a displacement of a main surface of the object while converging the laser beam with a lens and acquiring the displacement of the main surface along a line to cut while detecting reflected light reflected by the main surface in response to the irradiation; and moves the processing objective lens and the object relative to each other along the main surface, while adjusting the gap between the processing objective lens and the surface according to the displacement acquired by the displacement acquiring step, thereby forming the modified region along the line to cut.

A shutter unit capable of preventing the scattering of the laser beam upon closing the optical path of the laser beam and capable of being miniaturized, and a laser processing device employing such a shutter unit. In a shutter unit, when the optical path of the laser beam L is opened, a rotating memberis rotated around an axis line &#x3b3;, and an openingis positioned on an optical axis &#x3b1; so as to pass the laser beam L therethrough. Meanwhile, when the optical path of the laser beam L is closed, the rotating memberis rotated and a reflective surfaceis positioned on the optical axis &#x3b1; so as to reflect the laser beam L. Here, since the reflected laser beam L is absorbed by an optical absorption member, it is possible to prevent the scattering of the laser beam L when the optical path of the laser beam L is closed. In addition, since the openingand reflective surfaceare both formed on the rotating memberwhich rotates around the axis line &#x3b3; that is substantially orthogonal to the optical axis &#x3b1;, it is possible to reduce the size of the shutter unit

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Hamamatsu, Japan

Masayoshi Kusunoki