Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Matsushita Electric Industrial Co., Ltd.

Masayoshi Koyama

Norihito Tsukahara

Yoshitake Hayashi

Susumu Matsuoka

Seiichi Nakatani

Toshiyuki Kojima

Tsukasa Shiraishi

Yasushi Taniguchi

Kazuo Otani

Osamu Shibata

Takashi Kitae

Seiji Karashima

Yoshihiro Tomura

Satoru Yuhaku

Daido Komyoji

Akira Isomi

Ryuichi Saito

Takayuki Hirose

Yoshitaka Sunagawa

Keiko Ikuta

Nobuyuki Kirihara

Hiroki Nunose

A pin () is moved down in a nozzle (), the end of paste () protruded from the discharge opening () of the nozzle () to a target object () is brought into contact with the target object (), and the pin () is moved away from the discharge opening () to divide the paste in contact with the target object.

Paste dispenser for applying paste containing fillers using nozzle with pin and application method using the same

A semiconductor device () includes: a semiconductor chip () having a first main surface and a second main surface opposite to the first main surface; a heat dissipating plate () opposed to the first main surface; a first electrode () disposed between the first main surface and the heat dissipating plate () so as to be electrically connected to the semiconductor chip (); a pressure contact member () opposed to the second main surface; a second electrode () disposed between the second main surface and the pressure contact member () so as to be electrically connected to the semiconductor chip (); and a pressure generating mechanism that generates a pressure for pressing the first electrode () into contact with the heat dissipating plate () and the semiconductor chip () and pressing the second electrode () into contact with the pressure contact member () and the semiconductor chip ().

Semiconductor device and method for manufacturing the same

A wiring board connection method comprising: arranging a continuous conductive joint body on adjacent connection terminals of one of the wiring boards in a space between the adjacent connection terminals on one of the wiring boards; aligning the wiring boards so that the connection terminals face each other with the conductive joint body interposed therebetween; and bonding the connection terminals with each other by heating and then cooling the conductive joint body, wherein: the conductive joint body is a material that generates air bubbles upon being heated; and a recessed portion is formed on a surface of at least one of the connection terminals, the surface being opposite to the connection terminal of another wiring board. When the connection terminals are bonded with each other, the conductive joint body is allowed to move so as to gather on the surfaces of the connection terminals where no recessed portions are formed.

Wiring board connection method

Dummy electrodes () are disposed on wiring connected to first electrodes () of the substrate (), outside a junction region containing all of the first electrodes () and second electrodes () and in bonding resin (), the dummy electrodes () not being involved in electrical connection between the substrate () and the component (). When conductive particles () in the bonding resin () are melted by heating, molten solder self-assembles and solidifies between the first electrodes () and the second electrodes () and on the dummy electrodes (). With this configuration, the solder self-assembles between the adjacent dummy electrodes () and causes a solder short circuit. Thus it is possible to eliminate excessive solder supply between the adjacent first electrodes () and the adjacent second electrodes (), thereby preventing short circuits between the adjacent first electrodes () and the adjacent second electrodes ().

Method of joining electronic component and the electronic component

A circuit board in which end faces () of wires are located in positions withdrawn from the end in a joint region of a first board (), end faces () of wires are located in positions withdrawn from the end in a joint region of a second board (), a gap (W) between the end faces () of the wires of the first board () and the end faces () of the wires of the second board () is filled with a conductor (A), and the first board () and the second board () are jointed by means of a resin.

Circuit board and method for jointing circuit board

In a method for forming bumpson electrodesof a wiring board, a fluidcontaining conductive particlesand a gas bubble generating agent is supplied onto a first regionincluding the electrodeson the wiring board. Then, a substratewhich has a protruding surfacehaving the same area as that of the first regionand formed on a main surfaceof the substratehaving a larger area than that of the first regionis disposed so that the protruding surfacefaces the first regionof the wiring board. Then, the fluidis heated to generate gas bubblesfrom the gas bubble generating agent contained in the fluid

Bump forming method and bump forming apparatus

In a method of cutting a plasma display panel, a front glass substrate and a rear glass substrate are sealed so as to face each other. The front glass substrate and the rear glass substrate are sandwiched between pairs of rotating cutters, and the pairs of rotating cutters are pressed onto the front glass substrate and the rear glass substrate to be in contact therewith so that the rotating cutters are run thereon in order to cut the substrates.

Plasma display panel cutting method

Holes having the same diameter as via holes are formed in predetermined positions in advance when forming wiring patterns on releasable carriers. The carriers with the wiring patterns are bonded on an insulating material, and a laser beam is irradiated from the side of the carrier using the holes in the wiring pattern as a laser mask to form via holes in the insulating material. The via holes and the holes in the carrier are then filled with a conductive paste. With the holes in the carrier that are matched in position with the via holes, lands in the conductor layers are precisely positioned relative to the via holes. A multilayer circuit board thus produced has lower electrical connection resistance and excellent mountability with improved performances. Also a manufacturing method thereof is achieved.

Multilayer circuit board and manufacturing method thereof

A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating sheet with the electrical component built therein, the electrical insulating sheet being disposed between the first wiring pattern and the second wiring pattern; and a via conductor formed in a via hole penetrating through the electrical insulating sheet, the via conductor connecting electrically the first wiring pattern and the second wiring pattern. A side face of the via conductor defines a continuous line in an axis direction of the via conductor. Thus, a component built-in module having excellent reliability concerning electrical connection can be provided.

Growing community of inventors

Osaka, Japan

Masayoshi Koyama