Dic Corporation

Masayoshi Kotake

Masanori Kasai

Hiroshi Isozumi

Hisatomo Yonehara

Kiyofumi Takano

Hideki Etori

Yasuhiro Sente

Toshihiro Ebine

The object of the present invention is to provide an organic transistor using an organic semiconductor having excellent transistor properties, and a method for producing the organic transistor, the present invention providing, first, an organic transistor including a gate electrode (b), an insulating layer (c), an organic semiconductor layer (d) which contacts the insulating layer (c) and has a channel formation area, and source/drain electrodes (e), which are formed on (a) a substrate, wherein the organic semiconductor layer (d) contains a fluorine-based compound (surfactant), and, secondly, a method for producing an organic transistor comprising a gate electrode (b), an insulating layer (c), an organic semiconductor layer (d) which contacts the insulating layer (c) and has a channel formation area, and source/drain electrodes (e), which are formed on (a) a substrate, the method comprising: a step in which the organic semiconductor layer (d) is formed on the insulating layer (c) by printing or coating an organic semiconductor solution containing a fluorine-based surfactant; or a step in which the insulating layer (d) is formed on the organic semiconductor layer (d) containing a fluorine-based surfactant by printing or coating.

Organic transistor and method for producing the same

The present invention provides a new method for manufacturing an electronic part, which is capable of reducing the number of steps of superpose-printing, achieving positional accuracy (alignment accuracy) of precise superposed patterns, and layering with substantially no difference in level, thereby improving productivity and dimensional accuracy and eliminating defects. The method for manufacturing an electronic part includes the steps of forming a composite ink pattern layer on a releasing surface of a transfer plate using a relief offset method, and then simultaneously reversely transferring the composite ink pattern layer to a printing object. Various organic transistor elements are formed by combining a conductive ink, an insulating ink, and an ink containing a semiconductor.

Electronic part manufacturing method and electronic part manufactured by the method

An insulating ink composition for forming an insulating film, which sufficiently achieves a low calcination temperature, solvent resistance and an insulating property, is provided. Furthermore, an ink composition for forming an insulating film which can form, by the printing method, fine insulating film patterns necessary for formation of highly integrated organic transistors is provided. The present invention provides an ink composition which forms an insulating film, and includes an organic solvent, a polyvinylphenol-based resin, an epoxy resin and a cross-linking aid. Particularly, the ink composition is a composition wherein the organic solvent includes an organic solvent which has a vapor pressure of 11.3&#xd7;10Pa or higher at 20&#xb0; C. and a boiling point of lower than 115&#xb0; C. under atmospheric pressure and an organic solvent which has a vapor pressure of less than 11.3&#xd7;10Pa at 20&#xb0; C. and a boiling point of 115&#xb0; C. or higher under atmospheric pressure; the ink composition includes a extender component having a volume average particle diameter of 1 to 150 nm and a silicone-based releasing component.

Ink composition for forming insulating film and insulating film formed from the ink composition

The present invention provides a conductive ink for forming a fine conductive pattern on a substrate by letterpress reverse printing. In particular, the conductive ink enables the pattern to be formed stably without the occurrence of transfer failures and is able to impart superior conductivity by low-temperature baking. The conductive ink, which contains substantially no binder component, comprises as essential components thereof conductive particles having a volume average particle diameter (Mv) of 10 to 700 nm, a release agent, a surface energy regulator and a solvent component, the solvent component being a mixture of a solvent having a surface energy at 25&#xb0; C. of 27 mN/m or more (high surface energy solvent) and a volatile solvent having a boiling point at atmospheric pressure of 120&#xb0; C. or lower (low boiling point solvent), and the surface energy of the ink at 25&#xb0; C. is 10 to 21 mN/m.

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Chiba, Japan

Masayoshi Kotake