Sumitomo Bakelite Company Limited

Masayoshi Kondo

Toshiaki Chuma

Satoshi Tanaka

Daisuke Fujiwara

Natsuki Makino

Kenichi Kanemasa

Toshio Komiyatani

Yuka Ito

Masaaki Kato

Satoru Nakao

Kentaro Fujiura

Disclosed is an electronic component package () including a circuit board (), an electronic component (), and an adhesive layer (). The circuit board () is provided with an electrically-conductive conductor post () which is buried in a base member (), and a solder layer () which is provided at the front end () of the conductor post () while exposed from a surface () of the base member (). An electrode pad () having a metal layer () mounted thereon is provided on the main surface () of the electronic component (). The adhesive layer () contains a flux activating compound, and bonds the surface () of the base member () and the main surface () of the electronic component (). Then, the metal layer () and the solder layer () are metal-bonded.

Electronic component package and method for producing electronic component package

A circuit board () exhibits an average coefficient of thermal expansion (A) of the first insulating layer () in the direction along the substrate surface in a temperature range from 25 degrees C. to its glass transition point of equal to or higher than 3 ppm/degrees C. and equal to or lower than 30 ppm/degrees C. Further, an average coefficient of thermal expansion (B) of the second insulating layer () in the direction along the substrate surface in a temperature range from 25 degrees C. to its glass transition point is equivalent to an average coefficient of thermal expansion (C) of the third insulating layer () in the direction along the substrate surface in a temperature range from 25 degrees C. to its glass transition point. (B) and (C) are larger than (A), and a difference between (A) and (B) and a difference between (A) and (C) are equal to or higher than 5 ppm/degrees C. and equal to or lower than 35 ppm/degrees C.

Circuit board, semiconductor device, process for manufacturing circuit board and process for manufacturing semiconductor device

A multilayer circuit board is fabricated by: preparing a film comprising a first protective film and a first interlayer adhesive; preparing a first circuit board having a first base and a conductive post protruding therefrom; stacking the first interlayer adhesive and the conductive post together; peeling off the first protective film; preparing a second circuit board including a conductive pad receiving the conductive post; and bonding the first circuit board and the second circuit board through the first interlayer adhesive so that the conductive post and the conductive pad face each other, wherein the first interlayer adhesiveat the top portion of the conductive post is selectively removed while peeling off the first protective film.

Method for fabricating multilayer circuit board, circuit plate, and method for fabricating the circuit plate

According to the present invention, there is provided a process for manufacturing a circuit board wherein a first substrate having a conductor post and a second substrate having a conductor pad for receiving the conductor post are laminated through an interlayer adhesive, and the conductor post and the conductor pad are electrically connected, comprising, as a first step, bonding the conductor pad with the conductor post by thermocompression under predetermined first conditions while the first and the second substrates are arranged such that the conductor pad faces the conductor post through the interlayer adhesive; thermocompressing the first substrate and the second substrate under predetermined second conditions while the conductor pad is bonded with the conductor post; and thermocompressing the first substrate and the second substrate under predetermined third conditions while the conductor pad is bonded with the conductor post, wherein the first, the second and the third conditions are different from each other.

Process for manufacturing circuit board

A multilayer flexible wiring board including (1) plural single-sided wiring boards each having a wiring pattern on one side of the corresponding substrate and two-layer conductor posts projecting from the wiring pattern to the side of the substrate opposite from the wiring pattern, wherein the substrates other than that of the outermost layer have the pads to be connected to the two-layer conductor posts on the side opposite from the conductor posts, and the wiring pattern has no surface coating; (2) a flexible wiring board having on at least one side thereof the pads for connection to the conductor posts and including a wiring pattern with surface coating applied on the flexible portion but no surface coating applied on the multilayer portion, and (3) an adhesive layer having a flux function, wherein the conductor posts and pads are connected by a metal or an alloy, and the wiring patterns are electrically connected.

Growing community of inventors

Akita, Japan

Masayoshi Kondo