Mitsubishi Materials Corporation

Daiwa Fine Chemicals Co., Ltd.

Masayoshi Kohinata

Masayuki Ishikawa

Hideaki Yoshida

Akihiro Masuda

Akifumi Mishima

Naoki Uchiyama

Yoshiaki Okuhama

Masakazu Yoshimoto

Akihumi Mishima

Seishi Masaki

Makoto Toriumi

Hirokazu Tanaka

An Au&#x2014;Sn alloy bump that does not include large voids and a method of producing the same are provided. The Au&#x2014;Sn alloy bump that does not include large voids comprises a composition containing Sn: 20.5 to 23.5 mass % and the balance Au and unavoidable impurities, and a structure where 0.5 to 30 area % of Sn-rich primary crystal phase is crystallized in the matrix.

Au&#x2014;Sn alloy bump including no large void and method of producing same

The problem is to provide an Au&#x2014;Sn alloy powder for use in producing an Au&#x2014;Sn alloy solder paste having reduced generation of voids. The problem is solved by an Au&#x2014;Sn alloy powder for a solder paste, which has a composition consisting of Sn of 20.5-23.5% by mass and a remainder containing Au and inevitable impurities, and which has a microstructure in which 0.5 to 30 area % of fine Sn-rich primary crystal phase regions having a diameter of 3 &#x3bc;m or less are crystallized in a matrix.

Au-sn alloy powder for solder paste

An electroplating solution (A), comprises an aqueous solution consisting essentially of lead phenolsulfonate: 1 to 250 g/liter in terms of Pb content; tin phenolsulfonate: 0.1 to 250 g/liter in terms of Sn content; phenolsulfonic acid: 20 to 300 g/liter; polyoxyethylene polyoxypropylene alkylamine: 1 to 50 g/liter; a 1-naphthaldehyde derivative: 0.001 to 1 g/liter; and an aldol sulfanilic acid derivative: 0.1 to 30 g/liter; or an aqueous solution (B) consisting essentially of lead methanesulfonate: 1 to 250 g/liter in terms of Pb content; tin methanesulfonate: 0.1 to 250 g/liter in terms of Sn content; methanesulfonic acid: 20 to 300 g/liter; polyoxyethylene polyoxypropylene alkylamine: 1 to 50 g/liter; and an aldol sulfanilic acid derivative: 0.1 to 30 g/liter. Each of the electroplating aqueous solutions (A) and (B) contains 50 ppb or less radioactive isotopes, whereby Pb-Sn alloy bump electrodes with improved uniformity in height and improved surface smoothness can be formed on a surface of a semiconductor wafer.

Electroplating solution for forming Pb-Sn alloy bump electrodes on

A method for joining two ceramic sintered bodies with a joining layer. A magnesium layer is deposited on the ceramic sintered bodies to form a magnesium nitride layer. The joining layer has a component in common with a base component of the ceramic sintered bodies. The laminate is heat treated under conditions that convert the joining layer into a material substantially identical to that of the ceramic sintered bodies, whereby a homogeneous strong laminate results. The ceramic sintered body may be either an oxide, carbide or nitride. The joining layer is a metal corresponding to the base material of the ceramic sintered bodies. After joining, the joining layer is then nitrided. The resulting laminate has improved strength, and heat and corrosion resistance properties.

Method for joining ceramic sintered bodies

Growing community of inventors

Sanda, Japan

Masayoshi Kohinata