Osaka University

Masayoshi Kamai

Hidetoshi Fujii

Yoshiaki Morisada

Yasuhiro Aoki

Huihong Liu

A dissimilar material solid phase bonding method is disclosed wherein one member and another member having different compositions are brought into contact with one another by way of an insert material to form an interface () to be bonded, at which the one member and the insert material are in contact with one another, and an interface () to be bonded, at which the other member and the insert material are in contact with one another; the temperature of the interface () to be bonded and the interface () to be bonded is raised by means of frictional heat and/or by electrical heating; a bonding pressure () is applied substantially perpendicular to the interface () to be bonded; a bonding pressure () is applied substantially perpendicular to the interface () to be bonded; and the bonding pressure () and the bonding pressure () are set to different values.

Dissimilar material solid phase bonding method, dissimilar material solid phase bonded structure, and dissimilar material solid phase bonding device

To provide a solid phase welding method and a solid phase welding apparatus which are possible to accurately control the welding temperature, to lower the welding temperature and to achieve a solid phase welding of the metallic materials. The present invention provides a solid phase welding method for metallic materials comprising, a first step of forming an interface to be welded by abutting end portions of one material to be welded and the other material to be welded and applying a pressure in a direction substantially perpendicular to the interface to be welded, a second step of raising a temperature of the vicinity of the interface to be welded to a welding temperature by an external heating means, wherein the pressure is set to equal to or more than the yield strength of the one material to be welded and/or the other material to be welded at the welding temperature.

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Suita, Japan

Masayoshi Kamai