Hitachi Metals, Ltd.

Masayoshi Date

Koji Sato

Hideko Fukushima

Takeshi Kuboi

Masaru Fujiyoshi

Tsuyoshi Yamamoto

Shuhei Iwagaki

There is provided a manufacturing method including: forming a molded body element with a molding material containing a ceramic powder and a binder; forming a ceramic molded body by disposing at least one molded body element in a mold and then injecting a molding material containing a ceramic powder and a binder into the mold and graft molding a graft molded body element to the molded body element; and forming a ceramic sintered body by degreasing and sintering the ceramic molded body. A graft connecting surface of the molded body element to which the graft molded body element is graft molded is formed so as to have a surface roughness of 2 &#x3bc;m or more in terms of Ra.

Method of manufacturing ceramic sintered body and ceramic sintered body

A solder ball having a diameter of 1.2 mm or less, a dispersion of a diameter distribution of 5% or less and sphericity of 0.95 or more, an area ratio of the maximum dendrite being 80% or less of a cross section including a center of the solder ball, comprises a first additional element of 0.5-8 mass % of Ag and/or 0.1-3 mass % of Cu, and 0.006-10 mass %, in total, of at least one second additional element selected from the group consisting of Bi, Ge, Ni, P, Mn, Au, Pd, Pt, S, In and Sb, the balance being substantially Sn. The solder ball is produced by a uniform droplet-spraying method comprising the steps of vibrating a melt of a solder alloy in a crucible under pressure to force the melt to drop through orifices of the crucible; permitting the melt dropping through the orifices to become spherical droplets in a non-oxidizing gas atmosphere; and rapidly solidifying them.

Solder ball and method for producing same

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Shimane, Japan

Masayoshi Date