Seiko Epson Corporation

Masayasu Sakuma

Yoshihiro Kobayashi

Taketo Chino

Shojiro Kitamura

Michiharu Ogami

Yusuke Kinoshita

Nobuyuki Imai

Hideo Karasawa

Yoshiaki Matsumoto

Masahiro Onuki

Yutaka Takada

Yoshikuni Saito

A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.

Sensor device and electronic apparatus

An inertial sensor module includes: a first inertial sensor having a first axis as a detection axis; and a second inertial sensor having the first axis, a second axis, and a third axis as detection axes, in which the first inertial sensor and the second inertial sensor are separated from each other, and detection accuracy of the first inertial sensor is higher than detection accuracy of the second inertial sensor.

Inertial sensor module

A sensor module includes: a substrate including a first terminal and a second terminal; a first conductive bonding member having a first melting point and a first Young's modulus; a lead bonded to the first terminal by the first conductive bonding member; a second conductive bonding member having a second melting point lower than the first melting point and a second Young's modulus higher than the first Young's modulus; and an inertial sensor bonded to the second terminal by the second conductive bonding member.

Sensor module having conductive bonding members with varying melting points and young's moduli

A sensor module includes: a printed circuit board having a first recessed portion formed at a first side, a second recessed portion formed at a second side facing the first side, a third recessed portion formed at a third side, and a fourth recessed portion formed at a fourth side facing the third side; a metal cap including convex portions each bonded to a respective one of the first to fourth recessed portions; and a first inertial sensor and a second inertial sensor that are provided at a main surface of the printed circuit board. The first inertial sensor and the second inertial sensor are disposed outside a region surrounded by a line connecting both ends of the first recessed portion and the second recessed portion and outside a region surrounded by a line connecting both ends of the third recessed portion and the fourth recessed portion.

Sensor module

An inertial measurement unit includes a sensor module including at least one inertial sensor and a printed substrate on which the inertia sensor is provided, and a lead group provided as a support member for supporting the printed substrate on an attachment surface, and leads of the lead group each have a first section coupled to the attachment surface, a second section extending from the first section toward the printed substrate in a direction that intersects the attachment surface, and a third section coupled to the printed substrate.

Inertial measurement unit, electronic instrument, and moving object

A sensor unit with high reliability and stable detection accuracy against vibrations of an installation target object is to be provided. A sensor unit includes: a sensor module configured including a substrate with inertial sensors mounted thereon, and an inner case in which the substrate is installed; and an outer case accommodating the sensor module. A recessed part is formed in the inner case. The inertial sensors are arranged in an area overlapping with the recessed part as viewed in a plan view seen from the direction of thickness of the substrate, and a filling member is provided to fill a space formed by the substrate and the recessed part. The sensor module is joined to a bottom wall of the outer case via a joining member.

Sensor unit, electronic apparatus, and moving body

A module includes a first rigid substrate including an analog circuit; a second rigid substrate including a digital circuit; a third rigid substrate including an angular velocity sensor; a first connecting portion that connects the first rigid substrate and the second rigid substrate so as to electrically connect the analog circuit and the digital circuit, and that has flexibility; and a second connecting portion that connects the first rigid substrate and the third rigid substrate so as to electrically connect the analog circuit and the angular velocity sensor, and that has flexibility.

Module and electronic apparatus

A module includes a sensor device, a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable, a supporting member having fixing faces, wherein the sensor device is mounted on at least one of the mounting faces, each of the mounting faces is disposed along each of the fixing faces, and the sensor device is disposed on the supporting member side.

A sensor unit includes a sensor and a mount board on which the sensor is mounted. The mount board includes a mount terminal connected to a terminal provided in the sensor and a wiring extending from the mount terminal. The wiring is not provided in a region where the sensor and the mount board overlap each other when viewed in plan.

Growing community of inventors

Kamiina, Japan

Masayasu Sakuma