Other

Hitachi, Ltd.

Hitachi Ulsi Systems Co., Ltd.

Texas Instruments Corporation

Elpida Memory, Inc.

Hitachi Vlsi Engineering Corp.

Masayasu Kawamura

Yasushi Takahashi

Masachika Masuda

Hirotaka Nishizawa

Tamaki Wada

Toshio Sugano

Michiaki Sugiyama

Atsushi Nakamura

Yoshitaka Kinoshita

Yoshihiko Inoue

Kazuki Sakuma

Yoshihiro Sakaguchi

Shunichi Sukegawa

Takeshi Wada

Hidetoshi Iwai

Susumu Hatano

Katsuo Komatsuzaki

Shin'ichi Ikenaga

Fujio Yamamoto

Jun Kitano

Kenji Nishimoto

Michihiro Mishima

Tathunori Mushya

A semiconductor device is formed by laminating two semiconductor chips with the rear surfaces thereof provided face to face. Each semiconductor chip is provided with an outer lead for clock enable to which the clock enable signal and chip select signal are individually input. On the occasion of making access to one semiconductor chip, the other semiconductor chip is set to the low power consumption mode by setting the clock enable signal and chip select signal to the non-active condition.

Semiconductor device and a memory system including a plurality of IC chips in a common package

A semiconductor device comprising a resin mold, two semiconductor chips positioned inside the resin mold and having front and back surfaces and external terminals formed on the front surfaces, and leads extending from the inside to the outside of the resin mold, wherein each of said leads is branched into two branch leads in at least the resin mold, the one branch lead is secured to the surface of the one semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, the other branch lead is secured to the surface of the other semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, and the two semiconductor chips are stacked one upon the other, with their back surfaces opposed to each other.

Stacked semiconductor device including improved lead frame arrangement

Two memory chips each being subjected to memory accesses in 2-bit units are assembled into a stacked structure by placing their back surfaces one over the other, so as to make memory accesses in 4-bit units. A memory module is so constructed that a plurality of such semiconductor storage devices, in each of which two memory chips each being subjected to memory accesses in 2-bit units are assembled into a stacked structure by placing their back surfaces one over the other, so as to make memory accesses in 4-bit units, are mounted on a mounting circuit board which is square and which is formed with electrodes along one latus thereof.

Semiconductor storage device having memory chips in a stacked structure

Semiconductor device and memory module

A semiconductor storage device equipped with redundant circuits designed to increase the operating speed and to simplify the layout by providing for the detection of the storage of a faulty address and access to the faulty address so as to substitute a spare word line for a faulty word line. The semiconductor storage device includes a MOSFET for causing current to flow through a pair of fuse means by a complementary address signal at one end of a fuse means corresponding to each bit of the faulty address. The other end thereof is connected to a wired OR logic so as to generate a decision signal. The fuse means corresponding to the MOSFET which is turned on by the faulty address signal is cut off to store a faulty address. The faulty address storage and comparison units can be formed with the pair of fuses and the MOSFET. High-speed operation and a high-density layout in the form of a matrix can thus be achieved efficiently by switching the faulty circuit to a spare circuit while the normal decoder is operating.

Semiconductor storage device

A semiconductor integrated circuit comprising a MOSFET having a metal wiring layer formed via an insulating film above and along the gate electrode of the MOSFET. The MOSFET is structured such that its channel length is small or channel width is large, and an input signal is applied from at least both end sides of the gate electrode thereof. Since the metal wiring layer for the input signal is formed on the gate electrode of the MOSFET, high-speed operation is possible without increasing the layout area. FIG. 1.

Transistor layout for semiconductor integrated circuit

Herein disclosed is a semiconductor integrated circuit for testing test data of two kinds of non-inverted and inverted statuses of all bits by itself with a prospective data of one kind to compress and output the test results. The semiconductor integrated circuit includes a decide circuit 25 for deciding a first status, in which the prospective data latched by a pattern register and the read data of a memory cell array are coincident, a second status, in which the read data is coincident with the logically inverted data of the prospective data, and a third statuses other than the first and second statuses through an exclusive OR gate to generate signals of 2 bits capable of discriminating the individual statuses. These statuses are informed to the outside of the semiconductor integrated circuit in accordance with high- and low-levels and a high-impedance.

Semiconductor memory device

Growing community of inventors

Higashiyamato, Japan

Masayasu Kawamura