Alps Electric Co., Ltd.

Masaya Yamatani

Hideki Kamimura

Satoshi Waga

Hisayuki Yazawa

Hiroshi Ishida

Yasuo Hayakawa

Hiroyuki Morioka

Sumihito Morita

Hisanobu Okawa

Motoki Hirayama

Shuji Yanagi

Chiaki Kera

Masaru Sakurai

Hideki Gocho

Kazuhide Nakayama

An electronic component has a circuit board with a main surface, a chip having a sensor facing the main surface, bump electrodes disposed between the main surface and the chip so as to be placed inside of the edges of the chip in a plan view of the main surface, a dam provided between the main surface and the chip so as to extend at least from the edges of the chip to outer positions of the bump electrodes in a plan view of the main surface, and an under-fill material provided at least in a clearance between the dam and the chip. Between the main surface and the sensor, a space is formed in a region enclosed by the bump electrodes in a plan view of the main surface. The under-fill material is disposed outside of the space in a plan view of the main surface.

Electronic component and method of manufacturing the same

A capacitive type humidity sensor is provided, where a sensor chip substrate, with a sensor section where electrostatic capacitance changes in accordance with humidity, a reference section where electrostatic capacitance does not change, and a plurality of pads which are output terminals of each section, and an IC substrate, which is electrically connected to the pads and which outputs the difference in capacitance between the sections as a voltage, are fixed to the same support substrate, where a protective member, which forms a sealed region surrounding the sensor section and which covers the reference section, is provided on the sensor chip substrate, the support substrate is covered by a sealing resin except for the region which is covered by the protective member, the sensor section is exposed to air at the region which is surrounded by the protective member, and the other constituent elements are covered by the sealing resin.

Capacitive type humidity sensor and manufacturing method thereof

Pressure sensor package

Photo detector

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Tokyo, Japan

Masaya Yamatani