Canon Kabushiki Kaisha

Canon Kabishiki Kaisha

Masaya Uyama

Souta Takeuchi

Masataka Kato

Makoto Terui

Takuya Hatsui

Toru Nakakubo

Toshiyasu Sakai

Hiroshi Higuchi

Tomohiro Takahashi

Seiko Minami

Yoshinao Ogata

Atsunori Terasaki

Kazuhiro Hayakawa

Makoto Sakurai

Takeru Yasuda

Atsushi Teranishi

Hirokazu Komuro

Yoshiyuki Fukumoto

Takumi Shimoda

Kenji Takahashi

Kazuaki Shibata

Ryoji Kanri

Seiichiro Yaginuma

Taichi Yonemoto

Sadayoshi Sakuma

Masataka Nagai

Tetsushi Ishikawa

Yuichiro Kanasugi

Kouji Harada

Shuichi Tamatsukuri

Tadanobu Nagami

An object is to provide a wafer, and a liquid ejection chip which are capable of preventing a decrease in yield. To that end, an adhesive agent accumulation portion is provided at which an adhesive agent coming out of a gap between a first channel substrate and a second channel substrate accumulates and stays away from a bottom of a groove.

Wafer, and liquid ejection chip

A highly reliable liquid ejection head comprises a substrate made of silicon and having a first surface and a second surface opposite to the first surface, an ejection port forming member bonded to the first surface of the substrate and formed with an ejection port for ejecting liquid, and a bonded member configured to be bonded to the second surface of the substrate. A through flow path is formed in the substrate, which is configured to pass through the substrate and to supply liquid to the ejection port. A first protective film made of a metal oxide is formed on an inner surface of the through flow path, and a second protective film made of a silicon compound is formed on all of the second surface of the substrate.

Liquid ejection head and method for manufacturing the same

A liquid ejection apparatus includes a housing provided at least with an upper surface and side surfaces, and a liquid tank that is arranged in the housing and is refillable with a liquid from outside. A display unit that indicates a remaining liquid amount in the liquid tank is arranged at least at one of joining portions each joining the upper surface to one of the side surfaces.

Liquid ejection apparatus and liquid tank

A liquid ejection head is provided with a recording element substrate, and the recording element substrate includes an ejection port member, an electric wiring layer including a pressure generating element array and electric connection portions, and a silicon substrate including the ejection port member and the electric wiring layer on a front surface. The silicon substrate includes a first through hole and a second through hole that protrude the electric connection portions. The rear surface of the silicon substrate is a (100) surface. An extension line of a side extending along the [110] direction, out of sides of the opening of the first trough hole and an extension line of a side extending along the [110] direction, out of sides of the opening of the second through hole are displaced from each other in a direction orthogonal to the [110] direction.

Liquid ejection head

A liquid ejection head including an element substrate including an ejection port, an energy generating element generating energy to eject a liquid from the ejection port, and a terminal electrically connected to the energy generating element, and an electric connection member connected to the terminal and that supplies electric power to the energy generating element. The element substrate includes a hole portion drilled from a surface of the element substrate opposite a surface of the element substrate in which the ejection port is provided to the terminal. A sealing member is provided inside the hole portion, the sealing member covering a connection portion. The liquid ejection head further includes a fixing member in contact with the surface of the element substrate in which the ejection port is formed, the fixing member being provided at a position corresponding to the hole portion.

Liquid ejection head and method of manufacturing same

Provided is a method of forming a film on a substrate including: forming a protective member on a surface of the substrate; forming an organic structure on the surface of the substrate, at a distance from the protective member; removing the protective member after the formation of the organic structure; and forming a film by CVD in a region of the surface of the substrate from which the protective member is removed.

Method of forming film on substrate and method of manufacturing liquid ejection head

A liquid ejection head includes an ejection port member that includes an ejection port that ejects a liquid, an energy generating element that generates energy for ejecting the liquid from the ejection port, a terminal electrically connected to the energy generating element, and a substrate portion that supports the ejection port member, the energy generating element, and the terminal. The terminal is connected to a wire member that supplies electric power that drives the energy generating element to the energy generating element, the substrate portion includes a hole portion formed from a surface of the substrate portion on a side opposite to a surface of the substrate portion on which the terminal is provided to a surface where the terminal is exposed, and an area of the surface where the terminal is exposed is smaller than an area of an opening of the hole portion.

A liquid ejection head including an orifice plate including an ejection orifice, an element substrate including an energy-generating element, and a flow path wall member for formation of a flow path, the flow path wall member being disposed between the element substrate and the orifice plate, wherein the orifice plate includes a first surface and a second surface which is opposite to the first surface and which is disposed facing the element substrate, the first surface includes a first diamond-like carbon film, respective contact angles &#x3b8;and &#x3b8;to pure water, of the first surface and the second surface, satisfy a relationship of Expression 1 defined in the specification, and composition in the first surface of the first diamond-like carbon film satisfies all relationships of Expression 2 to Expression 5 defined in the specification.

A liquid ejection head includes: a substrate in which a supply path which opens on a first surface and supplies an ejection liquid is formed; an insulating layer provided on the first surface of the substrate; an energy generating element provided on a surface of the insulating layer; an electric wiring layer electrically connected to the energy generating element and electrically insulated from the ejection liquid by the insulating layer; and an ejection orifice member which forms an ejection orifice and forms a flow path of the ejection liquid from an opening of the supply path to a formation position of the energy generating element. In the vicinity of the opening of the supply path, the insulating layer forms a recessed region by being dented closer to the substrate than the surface on which the energy generating element is provided or by being removed.

Liquid ejection head and a manufacturing method of the same

A semiconductor element includes an insulation layer and a pad portion for electrical connection to an external portion by wire bonding. The insulation layer includes a plurality of projections projecting from a main surface of the insulation layer. The pad portion is disposed on an upper surface of each of the projections without extending beyond the upper surface of the projection on which the pad portion is formed.

Semiconductor element, recording element substrate, and liquid discharge head

A perforated substrate having a first surface, a second (opposite) surface, a plurality of through holes running through the substrate from the first surface to the second surface and an etching object arranged on the first surface, is processed by forming a coating layer containing a resin material on the etching object, then allowing part of the resin material to drop into each of the through holes so as to close each of the through holes at least partly with the dropped resin material, then patterning the coating layer such that the coating layer is left on each of the through holes as mask while at least part of the coating layer covering the etching object is removed to expose the etching object; and etching the exposed etching object under a condition where each of the through holes is closed at least partly with the resin material.

Perforated substrate processing method and liquid ejection head manufacturing method

A method for manufacturing a perforated substrate includes forming a through-hole extending through a substrate from a first surface to a second surface opposite the first surface; forming a film on the first surface, a sidewall of the through-hole, and the second surface; forming a resist on the first surface; patterning the resist such that the resist closes an opening of the through-hole in the first surface; etching the film on the first surface using the resist as a mask; before the etching step, forming an inspection member on the second surface such that the inspection member closes an opening of the through-hole in the second surface; and determining whether there is a film patterning defect or a flaw that causes a film patterning defect.

Method for manufacturing perforated substrate, method for manufacturing liquid ejection head, and method for detecting flaw

A method for forming a film that covers a side wall of a through hole in a substrate having the through hole, the method including, in the following order, the steps of providing a substrate having a through hole that passes therethrough from a first surface to a second surface, which is a surface opposite to the first surface, forming, on the first surface, a lid member that blocks an opening of the through hole open on the first surface, recessing, in a direction away from the first surface, a surface of the lid member that blocks the opening by removing part of the lid member through the opening, and forming a film that covers the side wall of the through hole.

Method for forming film and method for manufacturing inkjet print head

A liquid election head including a silicon substrate and an element for generating energy that is utilized for electing a liquid on the silicon substrate, wherein a protective layer A containing a metal oxide is disposed on a first surface of the silicon substrate, a structure containing an organic resin and constituting part of a liquid flow passage is disposed on the protective layer A, and an intermediate layer A containing a silicon compound is disposed between the protective layer A and the structure.

Growing community of inventors

Kawasaki, Japan

Masaya Uyama