Toyota Jidosha Kabushiki Kaisha

Hirata Corporation

Nihon Den-Netsu Keiki Co., Ltd.

Masaya Tsuruta

Tomoyuki Kubota

Masanari Matsuura

Sotaro Ol

Yoshiyuki Nakamura

Sotaro Oi

Masahiro Koizumi

A hydrogen vacuum furnace () is provided with a process chamber () wherein a subject () to be heated is stored; a heating chamber () wherein a heater lamp () is stored; and a crystal board () for separating the subject () and the heater lamp () one from the other. In the hydrogen vacuum furnace (), the subject () is heated by a radiant ray applied from the heater lamp (). The process chamber () and the heating chamber () are provided with gas feed ports () and exhaust ports (), respectively, for feeding and exhausting a gas. When the subject () is being heated, atmospheric pressure in each chamber is adjusted so that the heating chamber () is under positive pressure to the process chamber () by feeding or exhausting the gas.

Heating furnace and heating method employed by heating furnace

A conveyance section positioning method has carrier pallets on which workpieces are fixed, a conveyer, a heating furnace for heating the workpieces, and a positioning mechanism for positioning the carrier pallets, and the method stops the carrier pallets at predetermined positions. The heating furnace has halogen heaters for heating the workpieces. The carrier pallets each have projections and output grooves. Comb tooth-shaped stopper projections engaging with the projections are formed on a carrier stopper. When the carrier stopper is moved forward, the stopper projections and the projections are engaged with each other. In this one operation, the carrier pallets are positioned at places corresponding to the halogen heaters, and then the workpieces are heated.

Method of positioning conveyance section, and conveyance device

An object is heated to a preheating temperature in an atmosphere of a reducing gas under the atmospheric pressure while adjusting the setting of the emissivity of a non-contact temperature measuring part and regulating the temperature of the object according to the measured value measured by a contact temperature measuring part. The pressure of the atmosphere is reduced. The object is further heated to a heating temperature under a lowered pressure while regulating the temperature of the object according to the measured value measured by the non-contact temperature measuring part whose setting of the emissivity is adjusted during the heating process to the preheating temperature. The pressure of the atmosphere is increased back to the atmospheric pressure while maintaining the heating temperature of the object. The temperature of the object is decreased under the atmospheric pressure. With this, in the process of heating an object under a lowered pressure, the actual temperature of the object is managed over the whole steps, and the object can be most suitably heated according to the actual temperature.

Decompressing type heater, its heating method, and electronic product manufacturing method

The present invention provides technology that uniformly heats and melts a plurality of solder material arranged in a plurality of locations on a board, and uniformly solders a plurality of parts to the board that are arranged in a plurality of locations on the board. A soldering apparatus includes an induction coil having a length in the longitudinal direction that is longer than the length of the board. An inner space having a size sufficient to arrange the board therein is maintained inside the induction coil. The board supporting the parts and the solder material will be positioned in the approximate center of the inner space of the induction coil. An alternating current will flow through the induction coil in this state. An alternating magnetic field will be generated in the inner space of the induction coil. Magnetic fluxes will substantially uniformly pass through the inner space of the induction coil along the longitudinal direction of the induction coil. In this way, the plurality of solder material arranged on a plurality of locations on the board may be uniformly heated and melted. The plurality of parts arranged on a plurality of locations on the board may be uniformly soldered to the board because the plurality of solder material may be uniformly heated and melted due to magnetic fluxes that uniformly passing through the board.

Growing community of inventors

Kumamoto, Japan

Masaya Tsuruta