Resonac Corporation

Hitachi Chemical Company, Ltd.

Showa Denko Materials Co., Ltd.

Masaya Toba

Kazuyuki Mitsukura

Kazuhiko Kurafuchi

Shinichiro Abe

Yoshinori Ejiri

Takashi Masuko

Hiroshi Masuda

Hideo Nakako

Keita Sone

Yuki Kawana

Tomonori Minegishi

Kenichi Iwashita

Shinichirou Sukata

Yoshiaki Kurihara

Masaki Yamaguchi

Motoki Yonekura

Kosuke Urashima

Kohsuke Urashima

Takaaki Nohdoh

A semiconductor package includes a wiring board and a semiconductor element mounted on the wiring board. The wiring board includes a first insulating material layer having a surface with an arithmetic average roughness Ra of 100 nm or less, a metal wiring provided on the surface of the first insulating material layer, and a second insulating material layer provided to cover the metal wiring. The metal wiring is configured by a metal layer in contact with the surface of the first insulating material layer and a conductive part stacked on a surface of the metal layer, and a nickel content rate of the metal layer is 0.25 to 20% by mass.

Semiconductor package

A layered plate including a copper layer having a thickness of 5 μm or less, and a resin layer provided on a surface of the copper layer, in which a water absorption rate of the resin layer is 1% or less after being left in an environment of 130° C. in temperature and 85% in relative humidity for 200 hours.

Layered plate and wiring base board production method

Disclosed is a method for manufacturing a wiring structure including a step of forming a wiring on an insulating resin layer. The step of forming the wiring includes: forming a modified region including pores in a surface layer of the insulating resin layer by treating a surface of the insulating resin layer with a treatment method including surface modification; forming a seed layer on the surface of the insulating resin layer by sputtering; and forming the wiring on the seed layer by electrolytic copper plating.

Wiring structure, method for manufacturing same, and semiconductor package

One aspect of the present invention is a method for manufacturing an electronic component, the method including: a first step of applying a metal paste containing metal particles onto a polymer compact in a prescribed pattern to form a metal paste layer; a second step of sintering the metal particles to form metal wiring; a third step of applying a solder paste containing solder particles and a resin component onto the metal wiring to form a solder paste layer; a fourth step of disposing an electronic element on the solder paste layer; and a fifth step of heating the solder paste layer so as to form a solder layer bonding the metal wiring and the electronic element, and so as to form a resin layer covering at least a portion of the solder layer.

Electronic component and method for manufacturing electronic component

A wiring board according to the present disclosure includes a first insulating material layer having a surface with an arithmetic average roughness Ra of 100 nm or less, a metal wiring provided on the surface of the first insulating material layer, and a second insulating material layer provided to cover the metal wiring, in which the metal wiring is configured by a metal layer in contact with the surface of the first insulating material layer and a conductive part stacked on a surface of the metal layer, and a nickel content rate of the metal layer is 0.25 to 20% by mass.

Wiring board and production method for same

An organic interposer includes: a first organic insulating layer including a groove; a first metal wire located in the groove; a barrier metal material covering the first metal wire; and a second metal wire located above the first metal wire, wherein the barrier metal material includes: a first barrier metal film interposed between the first metal wire and an inner surface of the groove; and a second barrier metal film located on the first metal wire, and wherein the second metal wire is in contact with both of the first barrier metal film and the second barrier metal film.

Substrate and method for manufacturing the same

A method for manufacturing a wiring board according to the present disclosure includes: in the following order, (a) a step of irradiating an insulating layer composed of a resin composition with active energy rays; (b) a step of adsorbing an electroless plating catalyst to the insulating layer; and (c) a step of forming a metal layer on a surface of the insulating layer by electroless plating, in which in the step (a), a modified region having a thickness of 20 nm or more in a depth direction from the surface of the insulating layer and voids communicating from the surface of the insulating layer is formed by irradiation of the active energy rays.

Wiring board and method for manufacturing the same

Organic interposer and method for manufacturing organic interposer

There are provided an organic interposer capable of improving insulation reliability and a method for manufacturing the organic interposer. An organic interposeris provided with: an organic insulating laminatecomprising a plurality of organic insulating layers; and a plurality of wiresarranged in the organic insulating laminate, and each of the wiresand each of the organic insulating layers are separated by a barrier metal film. The organic insulating laminatemay include: a first organic insulating layerhaving a plurality of grooveseach having each of the wiresdisposed therein; and a second organic insulating layerlaminated to the first organic insulating layerin such a way as to embed the wires

One aspect of the present invention relates to a resin composition comprising a curable resin and a curing agent, which is used for forming an inter-wiring layer insulating layer in contact with a copper wiring.

Resin composition, wiring layer laminate for semiconductor, and semiconductor device

To provide a manufacturing method capable of manufacturing a high density semiconductor device excellent in transmission between chips at a favorable yield and at low cost. A method for manufacturing a semiconductor device includes an insulating layer forming step of forming an insulating layerhaving a trenchabove a substrate, a copper layer forming step of forming a copper layeron the insulating layerso as to fill the trench, and a removing step of removing the copper layeron the insulating layerby a fly cutting method so as to retain a copper layer part in the trench

Growing community of inventors

Tokyo, Japan

Masaya Toba