Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Masaya Tateyanagi

Kiyoshi Fujihara

Shigeki Okamoto

Isao Hayami

Masanori Minamio

Toshiyuki Fukuda

Hiroyuki Ishida

Toru Nishikawa

Masanori Mimamio

Syouichi Tanaka

A caphaving a piece of glassformed at a laser irradiating position and covering a laser irradiating direction and an upper face of a package, is mounted onto the packagehaving lateral faces of a frame bodyformed in three directions other than the laser irradiating direction, so as to reduce the distance between a semiconductor elementand the piece of glassand to reduce a radiusof the piece of glass. The profile of the semiconductor device can be therefore lowered while maintaining the characteristics of a semiconductor laser. In addition, by mounting the semiconductor device, the profile of an optical pickup device can also be lowered.

Semiconductor device, method of manufacturing the same, and production equipment of the same

A tester according to the present invention can conduct a test on optical devices each having a different positional relation between a position of a contact face of an external contact terminal and a direction of light emitted from a semiconductor laser element.

Device for testing a light-emitting optical device using a socket

A copper frame plate () has a central frame plate () and a pair of side frame plates () bent from both ends of the central frame plate. A flexible substrate () has a central substrate () covering the central frame plate and bent substrates () bent from the central substrate so as to cover the side frame plates. An optical element () is mounted on the central frame plate. A plurality of internal wiring terminals () connected to the optical element are disposed on the central substrate and arranged in the width direction (W) along which the pair of side frame plates are opposed to each other. A plurality of external wiring terminals () used for connection to external equipment are disposed on the bent substrates and arranged in the length direction (L) orthogonal to the width direction.

Optical device and method of manufacturing the same

The semiconductor laser unit includes: a metal plate having a center portion wider than the remaining portions; a flexible substrate having a first opening; a substrate mounted on the center portion; a semiconductor laser placed on the substrate; a frame having a second opening and fixing the flexible substrate in the state of being bent along from the top surface to both side faces of the metal plate; and an optical element covering the second opening. The flexible substrate is fixed so that the first opening extends over the top surface and both side faces of the center portion.

Semiconductor laser unit and optical pickup device

An optical device includes a copper plate, light receiving elements mounted on the copper plate, a light emitting element mounted on the light receiving elements, a flexible substrate bent to cover portions of upper and side surfaces of the copper plate, and a positioning frame of metal for fixing the flexible substrate and the copper plate to each other. Since the positioning frame secures the flexible substrate and the copper plate against movement, a thin optical device can be attained without employing a resin-molded construction.

Growing community of inventors

Shiga, Japan

Masaya Tateyanagi