Sumitomo Chemical Company, Limited

Masaya Shimogawara

Shinichi Morishima

Masato Shakutsui

Eiji Kishikawa

According to an embodiment, a substrate with an electrode is a substrate with an electrodefor manufacturing an organic deviceincluding a first electrode, an organic functional layer, and a second electrode. The substrate with an electrode includes a support substrate, a first electrode provided on an inner side of a device formation area DA on a surfaceof the support substrate, and an antistatic conductive portionprovided on the surface described above and electrically connected to the first electrode.

Electrode-attached substrate, laminated substrate, and organic device manufacturing method

An organic EL element comprises a supporting substratehaving a first side surfaceand a second side surfacelocated opposite to the first side surface in the first direction, a first electrode-attached on the supporting substrate, an organic EL bodydisposed on the first electrode, a second electrodedisposed extending from the first side surface to the second side surface and covering at least a part of the organic EL body, and a sealing member disposed on the second electrode, extending from the first side surface to the second side surface and sealing at least the organic EL body, each of the side surfacesandof the second electrode and the sealing member on the first side surface-side being made evened with the first side surface, and each of the side surfacesandof the second electrode and the sealing member on the second side surface-side being made evened with the second side surface, in the first direction.

Organic EL element and method for manufacturing same

An organic EL element includes a support substrate, an organic EL portion that is disposed on the support substrate and is formed by stacking a first electrode layer, an organic functional layer, and a second electrode layer, a sealing member that seals the organic EL portion, and one or more moisture absorbing portions that have moisture absorption characteristics. The moisture absorbing portion is disposed in an outer edge portion of a light emitting area of the organic EL portion in which the first electrode layer, the organic functional layer, and the second electrode layer are sequentially continuously superimposed when viewed in a stacking direction of the organic EL portion. An area of the moisture absorbing portion disposed on the light emitting area is smaller than an area of the light emitting area.

Organic electroluminescent element

A method for producing an organic electronic device according to an embodiment includes: a device base formation step; a dehydration step of dehydrating a protective film-bearing sealing member under a pressure of 1000 Pa or more while conveying the protective film-bearing sealing memberin which a protective filmis laminated on a sealing member; and a sealing member bonding step of peeling off the protective filmfrom the protective film-bearing sealing member which has been subjected to the dehydration step and bonding the sealing memberto a device base. In the dehydration step, an atmosphere gas Ghaving a dew point of &#x2212;40&#xb0; C. or lower is caused to flow from a downstream side to an upstream side in a conveyance direction of the protective film-bearing sealing member.

Method for producing organic electronic device

A manufacturing method of an organic electronic device of the present invention, includes: a removing step of removing a volatile component from a flexible base material; a fixing step of fixing the flexible base material onto a support substrate via an adhesive layer; and a forming step of forming a device main body sequentially including a first electrode layer, at least one organic functional layer, and a second electrode layer on the flexible base material that is fixed onto the support substrate, on a side opposite to the support substrate, in this order, in which a vapor pressure of the volatile component is greater than or equal to 101325 Pa within a temperature range from 20&#xb0; C. to a melting point of a parent resin of the flexible base material.

Method for manufacturing organic electronic device

A method for manufacturing an organic deviceaccording to an embodiment includes: a film forming step of continuously forming first to N-th layers (N is an integer of 2 or more) on a first electrode layerformed on a main surfaceof a flexible substrate while continuously conveying the flexible substrate, wherein in the film forming step, the first to N-th layers are sequentially formed on the first electrode layer by supplying materials of the first to N-th layers from first to N-th film forming sources to the flexible substrate through first to N-th shielding parts arranged between the first to N-th film forming sources and the flexible substrate, the first to N-th shielding parts are fixed in a conveyance direction of the flexible substrate in a state of being spaced apart from the flexible substrate, and a shielding area due to at least one shielding part of the first to N-th shielding parts is different from a shielding area due to other shielding part.

Method for manufacturing organic device, and film forming device

A production method for an organic EL element includes a step of forming an organic EL section on an organic EL section arrangement area in a first electrode section while conveying an electrode-attached substrate in a first direction, a step of forming a band-shaped conductive film along the first direction to cover the organic EL section and at least a part of an external connection area in the first electrode section while conveying the electrode-attached substrate on which the organic EL section is formed in the first direction, and a step of forming a groove section that separates the conductive film into a first part and a second part being a second electrode section by removing the conductive film in a predetermined area in a second direction while conveying the electrode-attached substrate on which the conductive film is formed in the first direction, and extends in the first direction.

Organic EL element production method and organic EL element having conductive member on external connection area of first electrode

A method for producing an organic device, includes: first forming steps Sand Sof producing a support substratewith an organic functional layer; a winding step Sof winding the support substratewith an organic functional layer and a protective film; a peeling step Sof feeding out the protective filmand the support substratehave been wound in, and peeling off the protective film; a heating step Sof heating the support substratewith an organic functional layer after the peeling step S; and a second forming step Sof forming at least one layer selected from the second electrode layerand an organic functional layernot formed in the first forming step Sand being one of the organic functional layers comprising the multiple organic functional layers, after the heating step S

Method for producing organic device

A method of manufacturing an organic EL element () includes: a step of forming a first electrode layer (), an organic functional layer (), and a second electrode layer () on a substrate (), a step of detecting a defective portion after forming the second electrode layer (), a step of removing the second electrode layer () in the defective portion by irradiating the defective portion with a laser beam (L) from the second electrode layer () side when the defective portion has been detected, and a step of forming a sealing layer () after removing the second electrode layerin the defective portion.

Method of manufacturing organic EL element

According to a method for manufacturing an organic electronic device, a sealing member () that includes a sealing substrate (), an adhesive part () exhibiting adhesiveness and is provided on the sealing substrate (), and a hygroscopic part () being a hygroscopic cured product provided on the adhesive part () is bonded to an organic electronic element ().

Growing community of inventors

Niihama, Japan

Masaya Shimogawara