Musashi Energy Solutions Co., Ltd.

Jsr Corporation

Masaya Naoi

Kazunari Aita

Kenji Kojima

Hiroki Yakushiji

Terukazu Kokubo

Kazuo Inoue

Koji Seno

Katsumi Sato

Ryoji Setaka

Yukihiro Kawada

Masahiro Yamamoto

Hirobumi Suzuki

Hitoshi Fujiyama

Ichihiro Miura

Nobuo Ando

Tomohiro Utaka

A doping system dopes an active material with an alkali metal, the active material being contained in a layer of a strip-shaped electrode. The doping system includes a doping bath, a conveyor unit, a counter electrode unit, a connection unit, and a recovery unit. The doping bath stores a solution containing alkali metal ions. The conveyor unit conveys the electrode along a path passing through the doping bath. The counter electrode unit is housed in the doping bath. The connection unit electrically connects a conveyor roller provided in the conveyor unit with the counter electrode unit. The recovery unit collects in the doping bath the solution adhered to the electrode having passed through the doping bath.

Doping system and doping method

A doped electrode is manufactured by an electrode manufacturing method. The doped electrode includes an active material doped with an alkali metal. In the electrode manufacturing method, a dope solution is brought into contact with an electrode. The electrode includes a current collector and an active material layer. The active material layer is formed on a surface of the current collector and includes the active material. The dope solution includes an alkali metal ion and flows. In the electrode manufacturing method, for example, the alkali metal is electrically doped to the active material using a counter electrode member arranged to face the electrode.

Method for manufacturing doped electrode and method for manufacturing power storage device

A power storage device includes: an electrode assembly, including a positive electrode, a separator, and a negative electrode; and an electrolyte solution. The negative electrode includes a negative electrode current collector, and a negative electrode active material layer formed on a surface of the negative electrode current collector. The negative electrode is doped with lithium. The power storage device includes first through-holes penetrating the negative electrode current collector in a thickness direction thereof. On at least one side of the negative electrode current collector, the power storage device includes second through-holes penetrating the negative electrode active material layer in a thickness direction thereof. An aperture ratio of the first through-holes on the negative electrode current collector, or an aperture ratio of the second through-holes on the negative electrode active material layer is 0.001% or higher and 1% or lower.

Power storage device, power storage device electrode, and a method for manufacturing said power storage device and power storage device electrode

The electrode manufacturing system comprises a cutting device. The cutting device cuts an electrode material along one direction of the electrode material to manufacture electrodes. The electrode material comprises first sections and a second section. The first section includes an active material doped with alkali metal, and extends in the one direction. The second section is located between two adjacent first sections of the first sections. In the second section, the active material doped with alkali metal is absent. The cutting device cuts the second section.

Electrode manufacturing system and electrode manufacturing method

An electrode manufacturing system includes: a doping unit; a cleaning unit: and a conveyor unit. The doping unit performs a process of doping an active material in a strip-shaped electrode with an alkali metal, the strip-shaped electrode including an active material layer formed portion in which an active material layer including the active material is formed, and an active material layer unformed portion in which the active material layer is not formed. The cleaning unit cleans the active material layer unformed portion that is adjacent to the active material layer formed portion. The conveyor unit conveys the electrode from the doping unit to the cleaning unit.

System for manufacturing an electrode, cleaning unit, and electrode manufacturing method

Provided is a method for manufacturing an electrode by doping an active material included a layer of an electrode precursor with alkali metal. The electrode precursor and a counter electrode member are brought into contact with a solution containing an alkali metal ion in a dope bath. The counter electrode member includes a conductive base material, an alkali metal-containing plate, and a member having an opening. The member having the opening is located between the conductive base material and the alkali metal-containing plate. The member having the opening is, for example, a resin film having an opening.

Method for manufacturing electrode

Provided is a doping system in which an active material in a strip-shaped electrode precursor having a layer including an active material is doped with alkali metal. The doping system includes a doping tank, a conveying unit, a counter electrode unit, a connection unit, and a porous insulating member. The doping tank accommodates a solution including alkali metal ions. The conveying unit conveys the electrode precursor along a path passing through the inside of the doping tank. The counter electrode unit is accommodated in the doping tank. The connection unit electrically connects the electrode precursor and the counter electrode unit. The porous insulating member is disposed between the electrode precursor and the counter electrode unit, and is not in contact with the electrode precursor.

Doping system, and method for manufacturing electrodes, batteries and capacitors

Provided is an anisotropic conductive connector and a prove member, each of which ensures that all of the conductive parts exhibit uniform conductivity when a pressing force is applied, even when the inspection target wafer has a large area and total number of inspection target electrodes of integrated circuits is 10,000 or more, and a wafer inspection system including the probe member. The anisotropic conductive connector includes a frame plate in which a plurality of anisotropic conductive film placement holes are formed, and elastic anisotropic conductive films respectively disposed in the anisotropic conductive film placement holes in the frame plate and supported by a peripheral part of the frame plate around the corresponding anisotropic conductive film placement hole, each of the elastic anisotropic conductive films includes a plurality of connection conductive parts each extending in a thicknesswise direction of the elastic anisotropic conductive film, being disposed corresponding to a connection target electrode, and comprising an elastic polymer substance and magnetic conductive particles densely contained in the elastic polymer substance; and an insulating part that insulates the connection conductive parts to one another, and the connection conductive parts of the elastic anisotropic conductive films disposed in a peripheral area of the frame plate having a thickness smaller than that of the connection conductive parts of the elastic anisotropic conductive films disposed in a center area of the frame plate.

Anisotropic conductive connector, probe member and wafer inspection system

An anisotropically conductive connector, by which positioning, and holding and fixing to a wafer to be inspected can be conducted with ease even when the wafer has a large area, contains a frame plate having a plurality of anisotropically conductive film-arranging holes formed corresponding to regions of electrodes to be inspected of a wafer, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes and supported by the inner peripheral edge thereabout.

Anisotropically conductive connector and production process thereof, and probe member

Disclosed herein are an anisotropically conductive connector, by which good conductivity is retained over a long period of time even when it is used repeatedly over many times or repeatedly used under a high-temperature environment, and applications thereof. The anisotropically conductive connector is an anisotropically conductive connector having an elastic anisotropically conductive film, in which a plurality of conductive parts for connection extending in a thickness-wise direction of the film have been formed.

Anisotropic conductive connector, probe member, wafer inspecting  device, and wafer inspecting method

Anisotropically conductive connector, its manufacture method and probe member

An anisotropic conductivity sheet is formed with a conductive portion, in which conductive material is linked in a thickness direction within an insulator, and a positioning portion, which is formed of an insulator having elasticity at a portion other than the conductive portion. A metal plate for positioning is provided in a peripheral portion of the anisotropic conductivity sheet.

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Tokyo, Japan

Masaya Naoi