Sony Corporation

Sony Semiconductor Solutions Corporation

Sony Group Corporation

Masaya Nagata

Yuichi Yamamoto

Atsushi Yamamoto

Nobutoshi Fujii

Kensaku Maeda

Naoki Ogawa

Yutaka Ooka

Shinji Miyazawa

Yusuke Moriya

Shunsuke Furuse

Kaori Takimoto

Satoru Wakiyama

Taizo Takachi

Koji Fukumoto

Atsuhito Yasui

Kazuhiro Matsuhisa

Hiroshi Takahashi

Hiroshi Horikoshi

Taku Umebayashi

Tadashi Iijima

Yoichi Ootsuka

Toshihiko Hayashi

Ikuo Yoshihara

Masaki Haneda

Hiroshi Yoshioka

Hayato Iwamoto

Suguru Saito

Hiroyasu Matsugai

Naoki Komai

Keishi Inoue

Naoto Sasaki

Yoichi Otsuka

Takashi Oinoue

Tokihisa Kaneguchi

Isaya Kitamura

Masato Kawashima

Mayoshi Aonuma

Hiroshi Nishitake

An imaging device to which a simple mounting method can be applied is configured. The imaging device is provided with an imaging element, a wiring substrate, and a sealing portion. The imaging element is provided with an image pickup chip over which an light transmitting portion transmitting incident light is arranged and which generates an image signal on the basis of the incident light that has passed through the light transmitting portion, and a pad which is arranged on a bottom surface of the image pickup chip different from a surface on which the light transmitting portion is arranged, which the pad transmitting the generated image signal. The wiring substrate has wiring connected to the pad and extending to a region outside the imaging element, and has the imaging element arranged on a surface thereof. The sealing portion is arranged adjacent to a side surface which is a surface adjacent to the bottom surface of the imaging element, and seals the imaging element.

Imaging device and method for manufacturing imaging device

The present disclosure relates to a backside illumination type solid-state imaging device, a manufacturing method for a backside illumination type solid-state imaging device, an imaging apparatus, and electronic equipment by which the manufacturing cost can be reduced. A singulated memory circuit and a singulated logic circuit are laid out in a horizontal direction and are embedded by an oxide film and flattened, and then are stacked so as to be contained in a plane direction under a solid-state imaging element. The present disclosure can be applied to an imaging apparatus.

Backside illumination type solid-state imaging device, manufacturing method for backside illumination type solid-state imaging device, imaging apparatus and electronic equipment

A semiconductor device is provided, including a semiconductor substrate that includes a semiconductor; an electrode layer formed above a first surface side inside the semiconductor substrate; a conductor layer formed above the electrode layer and above the first surface of the semiconductor substrate; a hole formed through the semiconductor substrate from a second surface of the semiconductor substrate to the conductor layer; and a wiring layer that is electrically connected to the electrode layer via the conductor layer at an end portion of the vertical hole, and that extends to the second surface of the semiconductor substrate, the wiring layer being physically separated from the electrode layer by an insulating layer disposed therebetween.

Semiconductor device, fabrication process, and electronic device

The present technology relates to a solid-state imaging unit that makes it possible to increase the number of terminals, a method of producing the same, and an electronic apparatus. A solid-state imaging unit includes: an image sensor substrate including a light receiving region in which pixels that each convert incoming light to an electric signal are arranged in a matrix; a solder ball; a glass substrate opposite the image sensor substrate and the solder ball; and a through electrode that couples a wiring line pattern and the solder ball to each other by penetrating a glass adhesive resin interposed between the wiring line pattern and the solder ball. The solder ball is disposed outside the image sensor substrate in a plane direction. The wiring line pattern being formed on the glass substrate. The present disclosure is applicable, for example, to a package and the like including the image sensor substrate.

Solid-state imaging unit, method of producing the same, and electronic apparatus

The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.

Image sensor having improved dicing properties

The present technology relates to a solid-state imaging unit that makes it possible to increase the number of terminals, a method of producing the same, and an electronic apparatus. A solid-state imaging unit includes: an image sensor substrate including a light receiving region in which pixels that convert incoming light to an electric signal are arranged in a matrix; a solder ball; a glass substrate opposite the image sensor substrate and the solder ball; and a through electrode that couples a wiring line pattern and the solder ball to each other by penetrating a glass adhesive resin interposed between the wiring line pattern and the solder ball. The solder ball is disposed outside the image sensor substrate in a plane direction. The wiring line pattern being formed on the glass substrate. The present disclosure is applicable, for example, to a package and the like including the image sensor substrate.

Display devices, display modules, and methods of manufacture are disclosed. In one example, a display device includes a pixel region in which pixels for displaying an image are arranged, on an upper surface of a substrate. A device-side signal electrode for exchanging a signal related to the pixels with an outside is disposed on a side surface of the substrate. A module casing is configured to store the display device and to have a casing-side signal electrode electrically connected to the device-side signal electrode in a spot facing the device-side signal electrode.

Display device, display module, method of manufacturing display device, and method of manufacturing display module

Image sensor including grooves

The present disclosure relates to a semiconductor device, an electronic device, and a manufacturing method that can maintain the mounting reliability of an underfill. A chip is formed by a circuitof an imaging element being produced on a Si substrate that is a first substrate and a second substrate being produced on an adhesive formed on the circuit. In this event, a photosensitive material is formed around the chip after the chip is mounted on a mounting substrate by a solder ball or in the state of the chip, then an underfill is formed, and then only the photosensitivematerial is dissolved. The present disclosure can be applied to, for example, a CMOS solid-state imaging sensor used for an imaging device such as a camera.

Semiconductor device and electronic device having a chip size package (CSP)

The present disclosure relates to a semiconductor device, an electronic device, and a manufacturing method that can maintain the mounting reliability of an underfill. A chip is formed by a circuit of an imaging element being produced on a Si substrate that is a first substrate and a second substrate being produced on an adhesive formed on the circuit. In this event, a photosensitive material is formed around the chip after the chip is mounted on a mounting substrate by a solder ball or in the state of the chip, then an underfill is formed, and then only the photosensitive material is dissolved. The present disclosure can be applied to, for example, a CMOS solid-state imaging sensor used for an imaging device such as a camera.

Semiconductor device and electronic device having a chip size package (CSP) stack

Packaged image sensor having improved dicing properties

Image sensor having improved dicing properties, manufacturing apparatus, and manufacturing method of the same

Growing community of inventors

Kanagawa, Japan

Masaya Nagata