Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Masaya Matsumoto

Akihiko Wachi

Yasuhiro Maenishi

Takuya Yamazaki

Hiroyoshi Nishida

Ikuo Yoshida

Nobuyasu Nagafuku

Akihito Yamasaki

Chikashi Konishi

Toshiyuki Koyama

Seishiro Yanachi

Nobuyuki Kakishima

A method of optimizing an order of component mounting which includes optimizing an order of component mounting for any one pattern among the plurality of patterns, calculating a quotient and a remainder by dividing the total number of the patterns included in the board by the number of mounters, determining the quotient as the number of patterns to be allocated in a case where the remainder is zero. The optimization method also includes determining a number, which is the quotient plus one, as the number of patterns to be allocated to the same number of the mounters as the remainder, starting from the mounter in a process farthest upstream, determining the quotient as the number of patterns to be allocated to the rest of the mounters, in the case where the remainder is one or greater, and allocating the allocated number of patterns, to each of the mounters.

Method for optimization of an order for component mounting and apparatus for optimization of an order for component mounting

A component verification method for a mounter () that is capable of performing component verification with less labor. The method includes a position specification step (SA) of specifying a placement position in the mounter () where a component tape is placed; a read step (S) of reading component information from an IC tag () that is attached to the component tape or a reel (); and a verification step (S) of verifying the component information and the placement position against component arrangement data that indicates components that should be mounted onto the board as well a position where the component tape should be placed.

Component verification method and apparatus

An optimizing apparatus for optimizing a mounter equipped with a line gang pickup head which picks up a plurality of components and mounts them on a board. The apparatus includes a nozzle set determination unit for determining a nozzle set which reduces a mounting time in view of a number of times interchanging pickup nozzles and a total task number necessary for mounting the plural components, a nozzle pattern determination unit for determining an optimal nozzle pattern as well as an arrangement of pickup nozzles (nozzle arrangement) at a nozzle station, based on the nozzle set determined by the nozzle set determination unit, and Z-axis arrangement/mounting order optimization unit for determining an array order of component feeders and a mounting order of components while maintaining the determined nozzle set and nozzle pattern.

Method for optimization of an order of component mounting, apparatus using the same, and mounter

An algorithm for determining the movement of camera for automatic tracing of inspection positions is preset based on the characteristic shape of the component. A start point and an end point of inspection of lands are designated to the camera, and the camera moves from the start point to the end point automatically along a predetermined path in accordance with the preset algorithm, thereby performing inspection of lands in succession.

Inspection method and device by movement of the field of view of the camera

The present invention provides an apparatus and a method for operating reflow soldering in a mounting field whereby an abnormality in transfer of circuit boards can be detected with high reliability. Whether or not a circuit board is transferred by a transfer conveyor is judged. A discharge conveyor is started when a control device judges occurrence of transfer abnormality. After the discharge conveyor starts, the transfer abnormality is determined to be a drop of the circuit board if a discharge completion detector detects that a dropped circuit board is discharged. And then the control device continues the reflow soldering. The transfer abnormality in the reflow soldering apparatus can be detected with high reliability because it can be detected whether the transfer abnormality is either the drop or a clog of the circuit board.

Reflow soldering apparatus and method

Screen printing method and screen printing apparatus

Growing community of inventors

Ogouri, Japan

Masaya Matsumoto