Sumitomo Electric Industries, Limited

Toyo Kohan Co., Ltd.

International Superconductivity Technology Center

Kabushiki Kaisha Toshiba

Masaya Konishi

Takashi Yamaguchi

Tatsuoki Nagaishi

Kotaro Ohki

Genki Honda

Tatsuhiko Yoshihara

Shoji Tanaka

Youichi Enomoto

Hajime Ota

Yuh Shiohara

Takeshi Kato

Hiroyuki Fuke

Hironao Okayama

Yasuji Yamada

Takeshi Yamana

Kenji Motoi

Ken-ichi Sato

Kunihiko Hayashi

Kanshi Ohtsu

Yasuo Kanamori

Akira Kaneko

Tuneo Nakahara

A superconducting wire according to one embodiment of the present disclosure includes: a substrate having a first surface and a second surface; a superconducting layer having a third surface and a fourth surface; and respective coating layers. The second surface is opposite to the first surface. The fourth surface is opposite to the third surface. The superconducting layer is disposed on the substrate such that the third surface faces the second surface. The respective coating layers are disposed on the first surface and the fourth surface. Adhesion strength between the substrate and the coating layer disposed on the first surface is lower than adhesion strength between the superconducting layer and the coating layer disposed on the fourth surface.

Superconducting wire and superconducting coil

A superconducting wire includes a substrate and a superconducting material layer. The substrate includes a first main surface and a second main surface opposite to the first main surface. The superconducting material layer is disposed on the first main surface. Along at least a part of the superconducting wire in a direction in which the superconducting wire extends, the superconducting material layer is disposed to cover a side surface of the substrate in a width direction of the substrate and cover at least a part of the second main surface. A thickness of the superconducting material layer located on the first main surface varies along the width direction. A maximum thickness of the superconducting material layer located on the second main surface is smaller than a maximum thickness of the superconducting material layer located on the first main surface.

Superconducting wire

A superconducting coil according to the present disclosure includes: a substrate having a first surface and a second surface; a superconducting layer having a third surface and a fourth surface; respective stabilization layers; and respective protective layers. The second surface is opposite to the first surface. The fourth surface is opposite to the third surface. The superconducting layer is disposed on the substrate such that the third surface faces the second surface. The respective stabilization layers are disposed on the first surface and the fourth surface. The respective protective layers are disposed on the stabilization layers. Adhesion strength between each of the stabilization layers and each of the protective layers is lower than strength of the superconducting layer.

A superconducting wire includes a multilayer stack and a covering layer (stabilizing layer or protective layer). The multilayer stack includes a substrate having a main surface and a superconducting material layer formed on the main surface. The covering layer (stabilizing layer or protective layer) is disposed on at least the superconducting material layer. A front surface portion of the covering layer (stabilizing layer or protective layer) located on the superconducting material layer (front surface portion of the stabilizing layer or upper surface of the protective layer) has a concave shape.

An oxide superconducting wire includes an oriented metal substrate, an intermediate layer formed on the oriented metal substrate, and an oxide superconducting layer formed on the intermediate layer. The oriented metal substrate has an in-plane orientation &#x394;&#x3d5; of 7&#xb0; or less. The intermediate layer is formed of a single layer.

Oxide superconducting wire

A superconducting wire includes: a substrate having a first main surface and a second main surface opposite to the first main surface; and a superconducting material layer disposed on the first main surface of the substrate. The superconducting material layer is disposed to cover at least a part of a side surface of the substrate in a width direction of the substrate.

An oxide superconducting thin film wire includes a metal substrate, a laminate, and a Cu stabilizing layer. The metal substrate includes a supporting base material and a conductive layer located on the supporting base material. The conductive layer includes a Cu layer serving as an internal layer and a biaxially orientated surface layer. The laminate includes a buffer layer, an oxide superconducting layer, and a Ag stabilizing layer stacked on the metal substrate in this order from the metal substrate. The Cu stabilizing layer is formed so as to surround the laminate and the metal substrate. At least one of the Cu stabilizing layer and the Ag stabilizing layer is formed so as to be in contact with at least a portion of the conductive layer of the metal substrate and be electrically conductive with the conductive layer of the metal substrate.

Oxide superconducting thin film wire and method for producing same

The present invention relates to a method of producing a substrate, including the steps of preparing a substrate having a nickel layer formed on a copper layer through plating, subjecting the nickel layer to thermal treatment at 800-1000&#xb0; C., and epitaxial-growing an intermediate layer on the nickel layer, after the step of subjecting the nickel layer to thermal treatment. According to the present invention, there can be provided a substrate that allows the orientation and flatness at the surface of a nickel layer to be improved, and a method of producing the substrate.

Method of producing substrate and superconducting wire

A metal laminated substrate for an oxide superconducting wire is manufactured such that a non-magnetic metal plate Thaving a thickness of not more than 0.2 mm and a metal foil Tmade of Cu alloy which is formed by cold rolling at a draft of not less than 90% and has a thickness of not more than 50 &#x3bc;m is laminated to each other by room-temperature surface active bonding, after lamination, crystal of the metal foil is oriented by heat treatment at a temperature of not less than 150&#xb0; C. and not more than 1000&#xb0; C. and, thereafter, an epitaxial growth film Tmade of Ni or an Ni alloy having a thickness of not more than 10 &#x3bc;m is laminated to the metal foil.

Method for producing metal laminated substrate for oxide superconducting wire, and oxide superconducting wire using the substrate

A substrate of the present invention includes a copper layer, an alloy layer containing copper and nickel, formed on the copper layer, a nickel layer formed on the alloy layer, and an intermediate layer formed on the nickel layer. The concentration of nickel in the alloy layer at the interface between the alloy layer and the nickel layer is greater than the concentration of nickel in the alloy layer at the interface between the alloy layer and the copper layer. According to the present invention, there can be provided a substrate that allows the AC loss of a superconducting wire to be reduced, a method of producing a substrate, a superconducting wire, and a method of producing a superconducting wire.

Substrate, method of producing substrate, superconducting wire, and method of producing superconducting wire

An oxide superconducting element wire ( ) comprises a base material ( ), an intermediate layer ( ), and an oxide superconducting thin film ( ). The base material ( ) being long and flexible has a cross-section in a circular or a regular polygonal form perpendicular to the longitudinal direction of the same. The periphery of the base material ( ) is covered with an intermediate layer ( ) and the periphery of the same is covered with an oxide superconducting thin film ( ). The oxide superconducting thin film ( ) has a portion in which a crystal orientation is three-axes aligned continuing in the longitudinal direction of the element wire ( ).

Oxide superconducting conductor with intermediate layer having aligned crystal orientation

When a cuprate oxide LnBa.sub.2 Cu.sub.3 O.sub.7-x (Ln=Y, Pr or Sm; 0.30.ltoreq.x.ltoreq.1) single crystal is heated for growing a film epitaxially on the crystal or for smoothing a damaged surface of the single crystal, many large protrusions occur on the surface of the oxide single crystal substrate or the film. The smooth surface of the oxides becomes rugged by the protrusions. According to the present invention, however, the oxide substrate or the oxide superconductor film can be heated in an atmosphere including oxygen of a partial pressure between 50 mTorr and 200 mTorr to prevent the protrusions from originating on the surface of the heated oxides.

Surface treatment of an oxide LNBA2CU307-X single crystal

The present invention is directed to a method for growing a superconductive film on a superconductive substrate in order to produce a bulk single crystal. According to a preferred embodiment, an oxide superconductive film of a material which is the same or similar to the substrate material is epitaxially grown at a temperature between 450.degree. C. and 800.degree. C. so that the film and substrate have the same lattice orientations. According to the present invention, problems associated with conventional films having non-superconductor substrates (e.g., MgO and SrTiO.sub.3) are avoided.

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Osaka, Japan

Masaya Konishi