Renesas Electronics Corporation

Nec Electronics Corporation

Nec Corporation

Mitsubishi Heavy Industries Limited

Nec Research Institute, Inc.

Masaya Kawano

Koji Soejima

Yoichiro Kurita

Shintaro Yamamichi

Nobuaki Takahashi

Katsumi Kikuchi

Kentaro Mori

Hideya Murai

Satoshi Matsui

Kouji Soejima

Yasutaka Nakashiba

Takehiko Maeda

Takuo Funaya

Shin Nishimoto

Stuart A Solin

Tineke Thio

Kohei Ozaki

Azumi Yoshida

Masahiro Komuro

Tatsuro Furusho

Tsutomu Tashiro

Yoshiaki Yamamoto

Katsumi Maeda

Hidekazu Uehara

Noriyuki Hayashi

Tadashi Kimura

Takao Kuroiwa

Shinsuke Sato

Yoshitomo Noda

Chihiro Yoshimine

Takuzo Shigihara

Shimpei Yokoyama

Takumi Hori

Takamasa Ito

Nobuyasu Nakamura

Masahiro Sugihara

Norihisa Takei

Yuuji Kayashima

Shintaro Okumura

This seal device comprises: a movable seal ring arranged so as to be deformable in the radial direction, in a state of facing an outer peripheral surface of a rotor of a steam turbine capable of rotating around the axis; a first elastic member provided to each of end surfaces of the movable seal ring in the circumferential direction; and a second elastic member that is provided to an intermediate position in the circumferential direction of the movable seal ring and urges the movable seal ring outward in the radial direction.

Seal device

This shaft sealing device comprises: a housing that has a storage groove; a seal body stored in the storage groove; and a projected part that projects from one of the housing and the seal body toward the other in the storage groove in an axial direction. The seal body divides an annular space into a high-pressure region on a first side in the axial direction and a low-pressure region on a second side in the axial direction. The housing has a connection part that connects the low-pressure region with the inside of the storage groove. The projected part divides a portion between an opposite surface and a low-pressure-side lateral surface of the seal body into a first space on the radially outer side and a second space on the radially inner side. The connection part connects the first space with the low-pressure region.

Shaft sealing device and rotary machine

A temperature measuring device includes an ultrasonic sensor attached to a rear surface side of the structural body having the multilayer structure, an acquisition unit configured to, through the ultrasonic sensor, acquire a signal of a reflected wave of an ultrasonic wave incident at the internal side of the structural body, an extraction unit configured to extract, from the signal of the reflected wave, a domain including a reflected wave reflected on a surface on the internal side of the structural body, and an identification unit configured to, based on a signal of the reflected wave in the extracted domain, identify the temperature of the surface on the internal side of the structural body.

Temperature measuring device, mechanical system, temperature measuring method, and program

A fluid film bearing includes a plurality of bearing pads that are arranged in a circumferential direction of a rotating body that rotates about an axis, and that support the rotating body via a fluid film, wherein the bearing pad includes a base layer made of metal, an elastic layer that is layered on the rotating body side of the base layer, and that is made of an elastically deformable elastic material, a sliding layer that is layered on the rotating body side of the elastic layer, and that opposes the rotating body and is made of a bearing material, and a metal plate that is layered between the elastic layer and the sliding layer, and that is more rigid than the elastic layer and the sliding layer.

Fluid film bearing

In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball side is limited. The electronic device includes an interconnect layer (a first interconnect layer) and an interconnect layer (a second interconnect layer). The second interconnect layer is formed on the undersurface of the first interconnect layer. The second interconnect layer is larger in area seen from the top than the first interconnect layer and is extended to the outside from the first interconnect layer.

Electronic device

A circuit device, includes a semiconductor substrate, and a first inductor provided over said semiconductor substrate, and a first interconnect provided over said semiconductor substrate and coupled with first inductor.

Circuit device

A circuit device includes a semiconductor substrate, a first inductor provided over the semiconductor substrate, and a second inductor provided over the semiconductor substrate and coupled to the first inductor. The first inductor and second inductor are wound in a same direction with each other from respective inner end portions to respective outer end portions thereof.

A transparent board is positioned on a support board provided with a positioning mark, and a release material is provided. A semiconductor element is then positioned so that the electrode element faces upward, and the support board is then removed. An insulating resin is then formed on the release material so as to cover the semiconductor element; and a via, a wiring layer, an insulation layer, an external terminal, and a solder resist are then formed. The transparent board is then peeled from the semiconductor device through the use of the release material. A chip can thereby be mounted with high precision, there is no need to provide a positioning mark during mounting of the chip on the substrate in the manufacturing process, and the substrate can easily be removed. As a result, a semiconductor device having high density and a thin profile can be manufactured at low cost.

Semiconductor device manufacturing method

The device includes a first inductor, a first insulating layer, a second inductor, and a third inductor. The first inductor includes a helical conductive pattern. The second inductor is located in a region overlapping the first inductor through the first insulating layer. The second inductor includes a helical conductive pattern. The third inductor is connected in series to the second inductor, and includes a helical conductive pattern.

Growing community of inventors

Kanagawa, Japan

Masaya Kawano