Rohm Co., Ltd.

Rhom Co., Ltd.

Masaya Imamura

Hiromi Ogata

Kensuke Sawase

Seiji Koshikawa

Manabu Yokoyama

Hideharu Hamada

Norimichi Teshiba

An image sensor can easily adjust the focus by the use of an inexpensive focus adjusting means even if the dimensional accuracy in the image sensor frame is very low. In the image sensor or an optical character reader incorporating such an image sensor, an original document W, which is being conveyed onto a transparent covering by a platen roller, is irradiated by light from a light emitting element. The light reflected by the original document W is received and condensed by a rod lens array which is positioned perpendicular to the surface of the transparent covering. The condensed light is received by a light receiving element which is located directly below the rod lens array. At the light receiving element, the light is converted into an electrical signal. The image sensor includes a frame having an opened top which includes inner tapered sidewalls opposed to each other. When a transparent covering having the conventional configuration is to be mounted in the opened top of the frame, the focal length H can be easily adjusted by changing the inclination of the transparent covering relative to the opened top of the frame.

Image sensor and optical character reader

An image sensor and a facsimile apparatus incorporating the same. A sponge piece is attached to a substrate with a light receiving device attached thereto. The sponge piece is brought into contact with an inclined inner wall surface of the frame when the substrate is mounted on the frame. The sponge piece thus urges the substrate in the vertical direction and sideways, thereby fixing the substrate at a predetermined position. Since the light receiving device is prevented from any deviation in the horizontal and vertical direction, a good picture quality is obtained.

Image sensor and facsimile apparatus incorporating the same

An image sensor and a facsimile apparatus incorporating the same. The upper surface of a substrate with a light receiving device attached thereto is pushed upward so as to fix the substrate to a frame. Since the substrate is fixed to the frame at the upper surface of the substrate, it is easy to adjust the focus of an optical system on the light receiving portion.

A glass cover is mounted on the top portion of a frame and, in the frame, a light source substrate with a light emitting element packaged therein is fixed and a rod lens array is fixed, a substrate with a light receiving element packaged therein is disposed in the lower portion of the frame, a substrate including a heating resistor is mounted in the lower portion of the frame, a drive element for driving the heating resistor is packaged on the back side of the substrate, and the drive element is electrically connected with the substrate.

Combined read and print head

In an LED head, a photosensitive drum is positioned with reference to an upper surface of a circuit board on which surface at least one light-emitting element is supported in order to accurately set the distance between the light-emitting element and a photosensitive drum. Further, clips and a spring are used to accurately set the distance between the light-emitting element and a lens and to simplify the process of production.

LED head

In an image sensor having, in a frame equipped with a transparent cover engageable with an objective, a light emitter for radiating light over the objective, an optical system for condensing light reflected from the objective and for directing the light to a predetermined position, a light receptor for receiving the light directed by said optical system, electronic elements constituting the light receptor are mounted on a long substrate, and other electronic elements are mounted on a single short substrate, which is attached to the long substrate at a portion other than the portion where the light receptor is mounted. This image sensor can be assembled in a reduced number of steps, preventing soldering flux from flying to the light receptor.

Image sensor having a first light receptor substrate and a substrate

To provide an image sensor which enables internally mounted electronic parts such as a light receiving element to be protected against adverse affection at assembly of the image sensor, electronic parts in a control block to be easily adjusted after assembly, and the control block to be replaced easily and at low cost conforming to various electrical characteristic requirements, a part of a board containing a light emitting element and/or a light receiving element disposed within a frame is projected from the frame, having a glass cover on the top and side boards on both sides and terminals on one side of a connection terminal block are soldered to the projection of the board and terminals on the other side are soldered to a hybrid unit used as a control block for controlling electric signals of internally mounted electronic parts such as the light emitting and receiving elements. The hybrid unit consists of an electronic parts package and a board to which the package is soldered.

Image sensor having externally mounted control board

An LED array printhead comprises a head substrate which carries an array of semiconductor LED chips and an array of drive IC's in corresponding relation to the LED chips. Each of the LED chips has a plurality of light emitting portions. The printhead further comprises a transparent resin coating for covering at least the LED chip array. The resin coating is provided with at least one convex lens portion at a position corresponding to a selected light emitting portion of the LED whose luminance is lower than a predetermined level.

LED array printhead and method of adjusting light luminance of same

There is provided an image sensor which can reduce loss in light emitted from a light emitting section toward an object to be sensed and also variability in the distribution of light and which can be produced with a small-sized structure with a reduced number of parts and with a decreased manufacturing cost. An optical path from the light emitting section to a transparent covering on which the object is to be placed is surrounded by a light reflecting portion. Light from the light emitting section can be irradiated onto the transparent covering without reduction in the amount of light while being repeatedly reflected by the light reflecting portion. The light reflected by the object is condensed by a condensing lens, the condensed light being then received by a light receiving section mounted on the same base plate as in the light emitting section. At the light receiving section, the light is converted into an electrical signal.

Image sensor

A small-sized image sensor which does not exert the deleterious influence of soldering, especially, on the light receiving device when attaching a substrate for a light emitting device. A glass cover (11) is attached to the upper portion of a frame (10), and a substrate of a light projecting portion having a light emitting device (12) is fixed to the frame (10) in such a manner as to be inclined toward the glass cover (11). A rod lens array (14) for converging the light reflected from a copy on the glass cover (11) is fixed to the frame (10) in such a manner as to be perpendicular to the glass cover (11). A sensor substrate (16) having a light receiving device (15) is disposed directly under the rod lens array (14), and a hybrid substrate (21) with an electronic part (20) mounted thereon is disposed in a space within the frame (10). The substrates (16) and (21) are connected by a lead frame (22 ) soldered to the bottom surface of the sensor substrate (16). The lead frame also supports the substrate (21).

An image sensor has a frame including a reading window formed therein at the top of the frame. The reading window is closed by a glass covering which is adhered to the frame through an adhesive. First and second grooves are provided in the frame to extend along the reading window. After the adhesive has been charged into the first groove, the glass covering is placed and pressed against the frame top so that the glass covering will be adhered to the frame top through the adhesive. At this time, any excess adhesive may be received and held by the second groove.

Image sensor with improved mount for transparent cover

A method of attaching an image sensor having a frame at the mounting position of an electronic machine. Protruding portions are formed on both side surfaces of the frame, and a fitting guide is provided at the mounting position of the electronic machine. One end of the fitting guide is a rectilinearly bent engaging portion and the other end is an arc-shaped engaging portion. When the image sensor is pushed to the mounting portion, the protruding portions engage the respective engaging portions, whereby the image sensor is fixed.

Arrangement and method for attaching image sensor to electronic machine

A light emitting element array substrate includes a plurality of light emitting elements arranged in line on the substrate with less dispersion in irradiation to a surface to be irradiated and can be manufactured with a reduction of cost. The light emitting element array substrate also includes light reflecting members formed on the light emitting element array substrate about light emitting elements having less irradiation. The light reflecting members re-reflect the light emitted from the light emitting elements and also reflected by surrounding parts so that the quantity of light at portions of the light emitting element array substrate having less irradiation is complemented by the re-reflected light to level the entire irradiation in the light emitting element array substrate.

Light emitting element array substrate with reflecting means

A connection structure and method of circuit boards including electronic parts thereon and a flexible cable for coupling the circuit boards. A first circuit board mounting electronic parts such as light detector elements and the like in an image sensor and a conductive pattern for connecting an image signal of the light detector elements to an external circuit and a second circuit board including amplifying ICs and a conductive pattern connected thereto are mutually laminated. The first circuit board is formed with a slot and a flexible bridging conductor is inserted into the slot. The flexible cable having a conductive pattern at its end is laminated on the laminated circuit boards so as to correspond to the conductive patterns. The flexible cable and the laminated circuit boards are closely fixed by a fixing plate to perform an electrical connection between the electronic parts of the circuit boards and between the electronic parts and the flexible cable at the same time without using soldering.

Connection structure of circuit boards having electronic parts thereon

An image sensor includes a frame 1, a light source unit 4 located in the frame 1 for irradiating light onto an original A to be read, a light receiving sensor 5 located in the frame 1 and including a plurality of light receiving portions arranged therein, and an optical system 6 located in the frame 1 for causing the light from the original A to be received by the light receiving portions in the light receiving sensor. The image sensor also includes at least one positioning portion formed in the frame 1 at an appropriate location and used to mount the light receiving sensor substrate 3 in the frame 1 and a stopper engaging and receiving portion 12 formed in the frame at an appropriate location. A leaf spring 2 has a stopper 21 formed thereon for detachably engaging the stopper engaging and receiving portion. The light receiving sensor substrate 3 properly positioned in the frame relative to the positioning portion 11 is resiliently biased against the frame. Thus, the light receiving sensor substrate can be detachably mounted and held in the frame.

Growing community of inventors

Kyoto, Japan

Masaya Imamura