Rohm Co., Ltd.

Masatsugu Yutani

Yuki Shiraishi

A semiconductor device includes: a semiconductor layer; a gate trench formed in the semiconductor layer; an insulating layer formed on the semiconductor layer; a gate electrode buried in the gate trench via the insulating layer; a gate wiring formed on the insulating layer and electrically connected to the gate electrode; and a protection trench formed in the semiconductor layer, wherein the semiconductor layer includes an outer peripheral region including outer edges of the semiconductor layer in a plan view and an inner region surrounded by the outer peripheral region, wherein the gate trench includes an outer peripheral gate trench portion arranged in the outer peripheral region and surrounded by the protection trench in a plan view, and wherein the outer peripheral gate trench portion and the protection trench are formed in a closed annular shape along the outer edges of the semiconductor layer in the outer peripheral region.

Semiconductor device

The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor chip having a first main surface including an active region and a peripheral region surrounding the active region; a first trench formed in the active region; a first insulating film formed on an inner surface of the first trench; a first electrode formed in the first trench interfacing the first insulating film, and forming a channel in a portion of the semiconductor chip facing the first insulating film; a second trench formed in the peripheral region and having a width greater a width of the first trench; a second insulating film formed on an inner surface of the second trench; and a second electrode formed in the second trench interfacing the second insulating film and electrically coupled to the first electrode.

Growing community of inventors

Kyoto, Japan

Masatsugu Yutani