Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Masatoshi Shinagawa

Takeshi Kawabata

Toshiyuki Fukuda

Tetsuyuki Fukushima

Akifumi Kawahara

Masakazu Kurata

Motoaki Satou

Manabu Komiya

In a substrate for a stacking-type semiconductor device including a connection terminal provided for a connection with a semiconductor chip to be stacked and an external terminal connected to the connection terminal through a conductor provided in a substrate, connection terminals of a power supply, a ground and the like, which terminals have an identical node, are electrically continuous with each other. Thus, it is possible to facilitate an inspection of electrical continuity between each connection terminal and an external terminal corresponding to each connection terminal by minimum addition of inspecting terminals. Further, it is possible to improve reliability of a stacking-type semiconductor module.

Semiconductor device, and inspection method thereof

In a semiconductor device, a semiconductor chip is connected to a board through an interconnection layer. A plurality of first terminals, a plurality of second terminals and a plurality of third terminals are provided on the board, the interconnection layer and the semiconductor chip, respectively. The second terminals are connected to the first terminals through the board. The third terminals are connected to the second terminals. The interconnection layer is rotatable about a rotation axis perpendicular to an upper surface of the interconnection layer. A first terminal having a specific function out of the first terminals and a third terminal having the specific function out of the third terminals are connected to each other by rotating the interconnection layer.

Semiconductor device

An imaging module is formed by stacking: a first resin board; a second resin board having a first opening; a first electrically-conductive member electrically connecting the first resin board and the second resin board to each other; a printed circuit board having a second opening; a second electrically-conductive member electrically connecting the second resin board and the printed circuit board to each other; an imaging semiconductor chip mounted on the lower surface of the second resin board to cover the first opening and provided with an imaging sensor, an optical member placed on the upper surface of the second resin board to cover the first opening; a first semiconductor control chip provided with a control device for controlling operation of the imaging sensor and mounted on the lower surface of the first resin board.

Imaging module and method for forming the same

To provide a nonvolatile memory microcomputer with which a step of testing a microcomputer unit using a logic tester can be omitted, thereby reducing the testing cost. A memory tester supplies test data and expectation data to the nonvolatile memory microcomputer, and the nonvolatile memory microcomputer stores them in a nonvolatile memory. Subsequently, upon receiving an address signal, the nonvolatile memory outputs a test signal and an expectation signal based on test data and expectation data corresponding to the address signal. The test signal is supplied to a circuit block in the microcomputer unit, to drive the circuit block. The circuit block returns a test result signal, which is output to the memory tester together with the expectation signal. The memory tester compares the test result signal and the expectation signal, to judge whether the microcomputer unit operates correctly.

Growing community of inventors

Shiga, Japan

Masatoshi Shinagawa