Citizen Electronics Co., Ltd.

Citizen Holdings Company, Ltd.

Masatoshi Sasuga

Takashi Akiyama

Takakazu Yano

Ryo Tamura

Masato Yazaki

Mitsunori Miyamoto

Yoshihisa Hirayama

In a first aspect of the present invention, a lighting device includes a light-emitting element, a phosphor layer including a phosphor and spaced from the light-emitting element, and a light-transmitting layer with thermal conductivity that is higher than thermal conductivity of the phosphor layer, the light-transmitting layer disposed in contact with the phosphor layer. It is disclosed that the phosphor layer has first and second surfaces opposite to each other. In some embodiments, the light-transmitting layer that transmits light emitted from the light-emitting element is disposed on the first surface of the phosphor layer. It is also disclosed that the first light-transmitting layer that transmits light emitted from the light-emitting element is disposed on the first surface of the phosphor layer and a second light-transmitting layer that transmits visible light is disposed on the second surface of the phosphor layer.

Lighting device including phosphor layer and light-transmitting layer that is arranged in contact with the phosphor layer to release static charge to substrate

A light-emitting apparatus, comprising at least one LED element, and at least one liquid crystal lens disposed to face the LED element and positioned at a distance from the LED element, a focal length of light, broadening and narrowing directions of light, and changing the illuminating area of light being adjustable by applying a voltage to the at least one liquid crystal lens and a light-emitting apparatus, further comprising at least one lens placed on the liquid crystal lens.

Light-emitting apparatus

A semiconductor package comprising a base material, an FPC substrate bonded through the intervention of an adhesive or an adhesive sheet on the base material and a semiconductor chip mounted on the FPC substrate, the semiconductor chip being mounted on the FPC substrate by FC bonding, the base material being formed by a resin, the base material having a concave portion or hole, and the semiconductor chip being mounted on the FPC substrate inside the concave portion or hole of the base material.

Semiconductor package

An LED device comprises a white LED device and a red LED device. The white LED device has a substrate, a blue LED mounted on the substrate for emitting blue light, a transparent resin covering the blue LED and including phosphor particles. The phosphor particle has a quality to convert blue light to white light, if the particle contacts with the blue light. The red LED device has a substrate, a red LED mounted on the substrate for emitting red light, and a transparent resin covering the red LED device is disposed so that emitted red light mixes with the white light emitted from the white LED device.

Growing community of inventors

Yamanashi-ken, Japan

Masatoshi Sasuga