Sharp Kabushiki Kaisha Corporation

Masatoshi Omoto

Masatsugu Masuda

Masaaki Katoh

Masataka Miyata

Masaharu Kitano

Masahiro Seko

Keiji Takasugi

An LED lamp has a convex lens 3 which has an upper portionand a lower portion. An upper curved surfaceA of the upper portion is different in shape from a lower curved surfaceA of the lower portionso as to refract rays of light from an LED chipmore strongly than the lower curved surfaceA does. This avoids reflection of incident outside light toward a front and hence prevents misrecognition. An interface plane Sbetween the upper and lower portionsandof the convex lensis located on an upper end faceA to thereby prevent collection of outgoing light upon the interface plane Sand generation of an irregular emission peak at the front.

Light emitting diode lamp and light emitting diode display unit

An LED device at least including a blue light emitting element having peak emission wavelength of 420 nm to 480 nm, a green fluorescent substance having peak wavelength of fluorescent spectrum in the range of 500 nm to 580 nm with the emission of the blue light emitting element, and a red light emitting element having peak emission wavelength of 600 nm to 670 nm is provided. The device may further include an ultraviolet/violet light emitting element for exciting green fluorescent substance. As a result, an LED device capable of attaining bright white light with good color reproduction characteristic is provided.

LED device and portable telephone, digital camera and LCD apparatus using the same

The present invention provides an LED deviceas a light source having an excellent color reproducibility and high luminance. The LED devicecomprises: a basehaving a recesswith the upper surface opened, the inner wall surface of the recessconstituting a reflection surface; a LED chipdisposed on the inner bottom of the recess; a resinfilled in the recess, the resinincluding phosphorswhich absorb a part of light emitted from the LED chip to convert the wavelength thereof and emit light; and a phosphor layerformed on the reflection surface, the phosphor layerincluding the phosphors

LED device including phosphor layers on the reflecting surface

In a bonding method for a chip-type electronic part, the electronic part is prefixed onto an element-mounting section of a wiring substrate by using a non-conductive adhesive agent while an external metal electrode of the electronic part is brought close to, or in contact with the metal wiring pattern formed on the wiring substrate. Then, the wiring substrate, on which the electronic part has been prefixed, is subjected to an electroplating process while it is immersed into plating liquid containing a metal component, so that the metal component, which is deposited on the metal wiring pattern, grows to form a metal layer, and the external metal electrode and the metal wiring pattern are thus electrically connected to each other through the metal layer. With this arrangement, since no short circuit occurs between the external metal electrodes or between the portions of the metal wiring pattern, it is possible to miniaturize the electronic part and also to narrow its packaging pitch, thereby achieving a high-density packaging. Further, no stress, such as caused by heat and pressure during the bonding process, is applied onto the wiring substrate and the chip-type electronic part. This makes it possible to remarkably improve the reliability of the apparatus.

Growing community of inventors

Osaka, Japan

Masatoshi Omoto