Osaka Soda Co., Ltd.

Masatoshi Okuda

Takamichi Mori

Naruhito Iwasa

Ryo Katou

Junichirou Minami

Junichiro Minami

The present invention provides an electroconductive adhesive which is desirably sintered at low temperatures even without pressurization during the sintering of the electroconductive adhesive, and which forms a sintered body that has high denseness and high mechanical strength (shear strength) if used as an electroconductive adhesive. An electroconductive adhesive which contains a solvent and silver particles that have an average particle diameter within the range of from 20 nm (inclusive) to 500 nm (exclusive), wherein the moisture content in the electroconductive adhesive is 1,300 ppm or less.

Electroconductive adhesive

The present invention provides silver nanoparticles that form a sintered body having a high shear strength and a low specific resistance when sintered at a low temperature (for example, 200° C. or less), even though the silver nanoparticles have an average particle diameter as large as 200 nm or more. Silver nanoparticles having an average particle diameter of 200 to 600 nm, wherein an exothermic peak due to binding of the silver nanoparticles in thermogravimetry-differential thermal analysis appears at less than 175° C., and a weight loss on heating from 30 to 500° C. by thermogravimetry-differential thermal analysis is 0.4% by weight or less.

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Osaka, Japan

Masatoshi Okuda