Hitachi Automotive Systems, Ltd.

Hitachi Astemo Ltd.

Masatoshi Ogata

Norio Ishitsuka

Shinobu Tashiro

Noboru Tokuyasu

Takeshi Morino

Takayuki Yogo

Akira Uenodan

Tsubasa Watanabe

Masahiro Matsumoto

Takahiro Miki

Hiroaki Hoshika

Tsutomu Kono

An object is to improve measurement accuracy of a thermal air flow meter. A flow-rate measuring device comprising: a sensor assembly having a flow-rate detecting element; a circuit board on which the sensor assembly is mounted; and a housing on which the circuit board is mounted, wherein the sensor assembly is mounted on the circuit board such that a detection portion side of the flow-rate detecting element is closer to the housing, and the sensor assembly includes a contact portion in contact with the housing on the detection portion side.

Flow-rate measuring device

The purpose is to improve the measurement accuracy of a thermal air flow meter. The device has: an auxiliary passage for entraining a portion of a fluid being measured; a sensor chip arranged in the auxiliary passage, for measuring the flow rate of the fluid being measured; an electronic component having an internal resistor, for converting the fluid flow rate detected by the sensor chip to an electrical signal; and a substrate on which the sensor chip and the electronic component are mounted. The substrate is covered by a filler material, on the surface of which the electronic component is mounted.

Thermal air flow meter

To obtain a flow meter with which it is possible to facilitate establishing an electrical connection with a conductor exposed in a location through which a gas to be measured passes. A flow meter that is provided with a lead and a circuit component placed on the lead, and that has a package in which part of the lead is molded from a resin, wherein the package is provided with an exposure portion for exposing part of the lead from the resin member, the exposure portion being electrically connected to a conductor that constitutes part of an auxiliary passage.

Flow meter

In order to provide a thermal flow sensor having high measurement accuracy, the thermal type air flow sensor includes a flow detecting unit, a sub passage on which the flow detecting unit is disposed, and an LSI to which a signal obtained by the flow detecting unit is input and which outputs a signal to the outside. A side wall of the sub passage is disposed between the flow detecting unit and the LSI, or on the LSI. A diffusion resistor provided inside the LSI has its longitudinal direction in parallel with a &#x3c;100&#x3e; orientation of single-crystal Si.

Thermal type air flow sensor

An object of the present invention is to provide a thermal-type air flow meter with a high measurement accuracy by reducing influence of a thermal stress generated in a resistor in an LSI while securing a high positioning accuracy flow rate detection unit. Thus, a thermal-type air flow meter is provided with: a sensor assemblyincluding an LSIhaving a resistorand a flow rate detection unitwhich are configured by insert molding so as to expose at least a part of the flow rate detection unit, a housingwhich has secondary passagesand, and houses the sensor assemblyby allowing the flow rate detection unitto be arranged in the secondary passage, the sensor assemblybeing molded using a first resin, and the housingbeing molded using a second resin, the sensor assemblybeing fixed to the housingusing the second resin; and resin structuresandwhich cause a tensile stress in a direction parallel to a surface on which the flow rate detection unitis exposed with respect to the sensor assembly

Thermal-type air flow meter

An objective of the present invention is, in a thermal flow meter having a structure including a resin portion formed in the vicinity of a diaphragm structural portion using a mold, to prevent destruction of the diaphragm structural portion at the time of pressing the mold, in a method of manufacturing the thermal flow meter, including: supporting a gas flow measurement elementon support membersand, the gas flow measurement elementincluding a cavity portionsurrounded by a substrate inclined portioninclined to a substrate surface, a diaphragmthat covers the cavity portion, and an electrical resistive element formed in the diaphragm; and covering the gas flow measurement elementand the support membersandwith the resin portionformed with the mold, to set the moldsuch that an acting portion of pressure force by the mold that molds the resin portionis positioned outside the substrate inclined portionin the entire periphery of the diaphragm

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Tokyo, Japan

Masatoshi Ogata