Canon Kabushiki Kaisha

Masatoshi Endo

Takanori Morooka

Mitsuhide Nishimura

Junichi Motojima

Akihiko Kawamura

Tetsuji Kazaana

Naoto Ohkawa

An exposure apparatus that exposes a substrate is provided. The apparatus includes a stage configured to hold and move the substrate, and a controller configured to control focus driving of the stage based on a measurement value and a correction value obtained for the focus driving of the stage for a shot region on the substrate. The controller is configured to determine the correction value in accordance with an angle of view at a time of exposure.

Exposure apparatus, method thereof, and method of manufacturing article

The present invention provides a method of obtaining a position of a second shot region next to a first shot region, out of a plurality of shot regions formed on a substrate, comprising a first detection step of detecting a position of a first mark arranged in the first shot region, a second detection step of detecting a position of a mark more distant from the first mark, out of a second mark and a third mark arranged in the second shot region, and a determination step of determining the position of the second shot region based on a detection result in the first detection step and a detection result in the second detection step.

Method of obtaining position, exposure method, and method of manufacturing article

An exposure apparatus of performing an exposure for each shot region on a substrate includes: a stage configured to move while holding the substrate; a measurement device configured to measure a vibration of the stage; and a controller, when the vibration of the stage measured by the measurement device during an exposure period of a shot region of a first substrate falls outside an allowable range, configured to change a control parameter when exposing a shot region of a second substrate to be exposed after the first substrate at the same position as the shot region of the first substrate so as to improve an exposure accuracy.

Exposure apparatus and device manufacturing method

A measuring apparatus measures a position of each of shot regions formed on a substrate. The apparatus includes a detector configured to detect a mark formed with respect to a shot region on the substrate, and a processor configured to obtain a position of each of the shot regions based on an output of the detector. The processor is configured to obtain a coefficient of a regression equation for obtaining a position of each of the shot regions, based on an output of the detector with respect to each of a plurality of sample shot regions on the substrate, and obtain, if the coefficient satisfies a tolerable condition for a discrepancy between the coefficient and a reference value thereof, the position of each of the shot regions using each offset amount that is obtained beforehand to correct the position of each of the shot regions obtained based on the regression equation.

Measuring apparatus, measuring method, lithography apparatus, and article manufacturing method

The substrate holding device of the present invention includes a holding unit that adsorbs and holds the substrate, a measuring section that measures a physical quantity relating to a adsorption force of the holding unit with the substrate mounted on the holding unit; and a control section that carries out a first determination based on a first condition and a measurement result obtained by the measuring section and a second determination based on a second condition that is different from the first condition and a measurement result obtained by the measuring section to select one of at least three preset operations based on the result of first and second determinations to thereby execute processing depending on the selected operation.

Growing community of inventors

Utsunomiya, Japan

Masatoshi Endo