Murata Manufacturing Co., Ltd.

Masatoshi Arishiro

Masami Yamaguchi

Tetsuro Saito

Tadahiro Nakagawa

Koji Hayashi

Shizuma Tazuke

Kunio Okumura

Seiichi Morita

A surface mount electronic component that includes a resin case, metal terminals, and a sealing metal plate that are molded integrally by insert molding. A hollow casing part and a through hole are formed in the case. The through hole leads from the hollow casing part to a surface of the case. The metal plate seals the through hole. The metal plate has a coefficient of linear expansion that is different from a coefficient of linear expansion of the case so that deformation to unseal the through hole occurs when heated.

Surface mount electronic component

A manufacturing apparatus for manufacturing electronic monolithic ceramic components, including a sheet supplier for supplying a plurality of ceramic green sheets of a plurality of types in a predetermined order, and a laminator for laminating the ceramic green sheets supplied by the sheet supplier. A plurality of trays is set in two vertical columns in a rack which is vertically movable. Each tray holds a stack of a plurality of ceramic green sheets of the same type. A particular tray positioned to a predetermined level by the vertical movement of the rack is drawn by a tray drawer device, and one ceramic green sheet is picked up from the tray, and is then conveyed to the laminator. The utilization efficiency of area in the sheet supplier is thus increased.

Manufacturing apparatus for manufacturing electronic monolithic ceramic components

An apparatus for measuring a component that can carry out processes such as visual inspection, characteristic measurement, screening, and taping efficiently while transporting the electronic component at high speed. In order to transport the electronic components to the index table where the processes such as characteristic measurement, screening, and taping is carried out, a component transporting device is used in which the electronic component delivered from the component delivery section is transported to the component intake port based on negative pressure, transported with the airflow through the transportation path and discharged from the part discharging port The transporting device includes a gas discharging port in the vicinity of the component discharging port, which serves to decrease the transport speed of the electronic component before transporting it to the index table.

Component handling apparatus and method of handling the same

A plurality of vertically extending cylinders are formed in the interior of a chuck body providing a chucking face on its lower surface. Pistons, in which permanent magnets are embedded, are vertically movably provided in respective ones of the cylinders. When compressed air is introduced into upper portions of the cylinders, the pistons are downwardly displaced so that the permanent magnets are relatively approached to the lower surface of the chuck body. Thus, the chucking face is supplied with magnetic force exceeding a prescribed level, to attract a holder holding electronic component chips, for example. When compressed air is introduced into lower portions of the cylinders, on the other hand, the pistons are upwardly displaced so that the permanent magnets are relatively separated from the lower surface of the chuck body. Thus, the chucking face is supplied with no magnetic force exceeding the prescribed level, so that the holder is separated from the chuck body.

Magnetic chuck

A component-orienting apparatus provided with a plurality of parallel orienting passages for aligning a plurality of components such as rectangular-parallelopipedic electronic component chips in the same orientation as each other. Each of the orienting passages comprises a receiving portion provided with a first space defined by an upwardly-taperingly-opening first inner peripheral surface and an aligning passage having a cylindrical second inner peripheral surface defining a second space that communicates with the lower end of the first space. The aligning passage is selected to have sectional geometry which rejects the longitudinal dimension of each component but crosswisely and perpendicularly orients the component in prescribed directions respectively. The first inner peripheral surface is continuous with the second inner peripheral surface through a rounded face.

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Sabae, Japan

Masatoshi Arishiro