Tokyo Electron Limited

Masatomo Kita

Norihiko Amikura

Masahiro Dogome

Toshiaki Toyomaki

Daisuke Hayashi

Hiroshi Nagaike

Shin Matsuura

Seiichi Kaise

Nobutaka Sasaki

Eiji Takahashi

Gyeong Min Park

Toshiyuki Makabe

Hideyuki Osada

Takami Fukasawa

Genichi Nanasaki

Takashi Takizawa

Takashi Tetsuka

Chihiro Sato

Naoya Suenaga

A transfer apparatus includes a first vacuum transfer module; a first transfer robot disposed in the first vacuum transfer module and at least one ring. In addition, a second vacuum transfer module is provided; and a second transfer robot is disposed in the second vacuum transfer module. A tubular connecting module is disposed between the first vacuum transfer module and the second vacuum transfer module. Further, the first vacuum transfer module, the second vacuum transfer module and the tubular connecting module are arranged along a first direction, with the tubular connecting module having a first length in the first direction, and the first length is smaller than the diameter of the wafer. A wafer support is rotatably attached to the tubular connecting module and at least three ring supporting members outwardly extend from the wafer support to support the at least one ring.

Transfer apparatus

A transfer apparatus includes a transfer arm, an irradiator, a light receiver, and a controller. The transfer arm transfers the member. The irradiator irradiates light obliquely onto a passage area, through which the member passes, when the member is transferred by the transfer arm. The light receiver receives the light, which is irradiated from the irradiator and reflected from the member, when the member passes through the passage area. The controller determines whether the member has passed through the passage area according to whether the light irradiated from the irradiator is received by the light receiver.

Transfer apparatus and transfer method

A substrate processing apparatus is disclosed. The apparatus comprises a vacuum transfer chamber including a top surface, a bottom surface, and side surfaces between the top and the bottom surfaces, including a first side surface and a second side surface opposite to the first side surface; a transfer robot, disposed in the vacuum transfer chamber, for transferring a substrate; a load lock module connected to the first side surface; a pipe, connected to a purge gas supply source, for supplying a purge gas into the vacuum transfer chamber; one or more gas ports provided in the top surface in the vicinity of the second side surface and connected to the pipe; and one or more exhaust ports, provided in the bottom surface in the vicinity of the first side surface, to which an exhaust pump for exhausting the purge gas supplied into the vacuum transfer chamber is connected.

Substrate processing apparatus, purge gas control method, and vacuum transfer chamber cleaning method

Embodiments of this application discloses a substrate processing apparatus comprising: a vacuum transfer module having a vacuum transfer space and an opening; a wall unit attached to the opening and including a first gate valve and a second gate valve; a substrate processing module attached to the wall unit and having a substrate processing space communicating with the vacuum transfer space via the first gate valve; and a ring stocker attached to the wall unit and having a storage space for storing at least one annular member used in a plasma processing module. Moreover, the apparatus further includes a transfer mechanism disposed in the vacuum transfer space and transfers a substrate between the vacuum transfer space and the substrate processing space through the first gate valve and also transfers at least one annular member between the vacuum transfer space and the storage space via the second gate valve.

Substrate processing apparatus

A transfer device for simultaneously or separately transferring a wafer and a consumable part having a circular shape is disclosed. The consumable part is disposed in a wafer processing module, and the outer diameter of the consumable part is larger than the outer diameter of the wafer. The transfer device comprises an end effector configured to place the wafer and the consumable part thereon simultaneously or separately, an arm configured to move the end effector, and a controller configured to control the arm, to place the consumable part on the end effector such that the center of gravity of the consumable part coincides with a first position when transferring the consumable part, and to place the wafer on the end effector such that the center of gravity of the wafer coincides with a second position between the first position and front ends of the end effector when transferring the wafer.

Transfer device, transfer system, and end effector

A substrate processing system includes a vacuum transfer module; a plasma process module; a transfer robot in the vacuum transfer module; a stage in the plasma process module; a first ring disposed on the stage and a second ring disposed on the first ring to surround a substrate that is placed on the stage, the second ring having an inner diameter smaller than an inner diameter of the first ring; actuators to move support pins vertically to raise the first and the second rings and a transfer jig; and a controller configured to selectively execute a simultaneous transfer mode in which the transfer robot is caused to simultaneously transfer the first ring and the second ring and a sole transfer mode in which the transfer robot is caused to transfer only the second ring.

Substrate processing system and transfer method

According to an aspect of the present disclosure, there is provided a transfer system comprising a transfer robot configured to transfer a transfer target object by an end effector based on an operation instruction, and a controller configured to output the operation instruction to the transfer robot, wherein at least any one of the end effector and the transfer target object has at least any one of a sensor and a camera, the controller calculates a relative position between the end effector and the transfer target object based on at least any one of a detected result of the sensor and a captured result of the camera, and the controller determines a teaching position of the end effector with respect to the transfer target object based on the relative position, and outputs the operation instruction to the transfer robot such that the end effector is disposed at the teaching position.

Transfer system, transfer device, and transfer method

A storage module includes a substrate support, a sensor, a rotating unit, a storage unit and an elevating unit. The substrate support has a consumable member thereon. The sensor detects an orientation of the consumable member. The rotating unit rotates the consumable member in a predetermined direction based on the orientation of the consumable member detected by the sensor. The storage unit is disposed below the substrate support to store the consumable member. The elevating unit vertically moves the storage unit.

Storage module, substrate processing system, and method of transferring consumable member

A substrate processing apparatus includes one or more substrate processing modules; a vacuum transfer module connected to the one or more substrate processing modules; and a load-lock module including at least three load-lock chambers arranged along a first horizontal direction. A tubular fitting module is disposed between the vacuum transfer module and the load-lock module, and the tubular fitting module has a first opening and a second opening. The first opening is connected to the load-lock module, and the second opening is connected to the vacuum transfer module. The first opening has a first length in the first horizontal direction, the second opening has a second length in the first horizontal direction, and the first length is larger than the second length. A transfer mechanism transfers a substrate between the one or more substrate processing modules and the load-lock module through the tubular fitting module.

A gate valve opens and closes a first opening of a first chamber in a vacuum processing apparatus. The gate valve includes: a valve element configured to open and close the first opening; a drive configured to move the valve element so that the valve element takes at least a closing position, where the valve element closes the first opening, and an opening position, where the valve element opens the first opening; a first gas line and a second gas line; and a first switching valve that connects one of the first gas line and the second gas line to the drive. The drive moves the valve element from the opening position to the closing position by pressure of gas supplied from the first gas line or the second gas line, and holds the valve element at the closing position by pressure of gas supplied from the second gas line.

Gate valve and driving method

There is provided a processing system. The processing system comprises: a chamber in which a consumable member is installed; a storage module configured to store the consumable member; a position detection sensor configured to detect a position of the consumable member; a vacuum transfer module connected to the chamber and the storage module, the vacuum transfer module having a transfer robot configured to transfer the consumable member between the chamber and the storage module; and a controller. The controller is configured to perform processes of: (a) controlling the transfer robot to transfer the consumable member installed in the chamber to the storage module; (b) detecting the position of the consumable member transferred to the storage module by the position detection sensor; and (c) controlling the transfer robot to transfer a new consumable member different from the consumable member from the storage module to the chamber at a position adjusted based on the position of the consumable member detected in the process (b).

Processing system and transfer method

A substrate processing system includes a substrate processing module, an atmospheric substrate transfer module, a first and a second vacuum substrate transfer module, a load lock module, and a vacuum substrate transfer robot. The first vacuum substrate transfer module having a first transfer space is disposed adjacent to the atmospheric substrate transfer module and the substrate processing module. The second vacuum substrate transfer module, having a second transfer space in communication with the first transfer space and external dimensions smaller than those of the first vacuum substrate transfer module in a plan view, is disposed on or under the first vacuum substrate transfer module. The load lock module is disposed between the atmospheric substrate transfer module and the second vacuum substrate transfer module. The vacuum substrate transfer robot is disposed in the first transfer space or the second transfer space to transfer a substrate.

Substrate processing system, vacuum substrate transfer module, and substrate transfer method

A substrate transfer system includes an atmospheric substrate transfer module, a vacuum substrate transfer module, and a load lock module disposed on a side surface of the atmospheric substrate transfer module and disposed on an upper surface or a lower surface of the vacuum substrate transfer module. The load lock module includes a container having a first substrate transfer opening and a second substrate transfer opening, a first gate configured to open or close the first substrate transfer opening, a second gate configured to open or close the second substrate transfer opening, and a substrate actuator configured to vertically move a substrate through the second substrate transfer opening between a first position in the container and a second position in the vacuum substrate transfer module.

Substrate transfer system and load lock module

A particle generation preventing method for preventing particle generation in a vacuum apparatus including an alumite-treated component is provided. The particle generation preventing method includes an evacuation step of evacuating the vacuum apparatus to reduce a pressure within the vacuum apparatus to less than or equal to 1.3&#xd7;10Pa (1 mTorr), a pressure increasing step of increasing the pressure within the vacuum apparatus to atmospheric pressure after the evacuation step, and a moisture adhesion step of causing moisture to be adhered to the alumite-treated component after the pressure increasing step.

Growing community of inventors

Miyagi, Japan

Masatomo Kita